Array substrate and manufacturing method thereof, display device

Abstract

An array substrate and a manufacturing method thereof, comprising a base substrate, and a gate, a gate insulating layer, an active layer and a source/drain arranged on the base substrate, the array substrate further comprising an antenna for receiving and/or transmitting wireless signals, the antenna being arranged on the base substrate. By arranging the antenna on the base substrate of the array substrate, the antenna is integrated directly in the display panel. Thus, not only the area of the PCB circuit board in the display device can be reduced, but also the spare area in the array substrate can be utilized sufficiently, thereby improving the integration level of the display device and reducing the total volume of the display device.

Claims

1. An array substrate, comprising a base substrate; and a gate, a gate insulating layer, an active layer and a source/drain arranged on the base substrate, wherein the array substrate further comprises an antenna for receiving and/or transmitting wireless signals, the antenna arranged on the base substrate, and wherein the array substrate further comprises a first insulating layer located on the antenna and a signal line arranged on a top surface of the first insulating layer, and a bottom surface of the signal line is in direct contact with the top surface of the first insulating layer, wherein a via hole is arranged in the first insulating layer, and a connecting layer is arranged in the via hole, wherein the signal line is connected with the antenna through the connecting layer, and wherein the antenna has a spiral shape, and a bottom surface of the connecting layer is in direct contact with a central portion of the antenna.

2. The array substrate according to claim 1, wherein the antenna and the gate are of the same material and are formed in one patterning process.

3. The array substrate according to claim 1, wherein the first insulating layer and the gate insulating layer are of the same material and are formed in one patterning process, and the signal line and the source/drain are of the same material and are formed in one patterning process.

4. The array substrate according to claim 1, further comprising a buffer metal layer arranged between the active layer and the source/drain, wherein the connecting layer and the buffer metal layer are of the same material and are formed in one patterning process.

5. The array substrate according to claim 1, wherein the gate, the gate insulating layer, the active layer and the source/drain are located in a display area of the base substrate, and the antenna is located in a non-display area of the base substrate.

6. A display device, comprising the array substrate according to claim 1.

7. The display device according to claim 6, wherein the antenna and the gate are of the same material and are formed in one patterning process.

8. The display device according to claim 6, wherein the first insulating layer and the gate insulating layer are of the same material and are formed in one patterning process, and the signal line and the source/drain are of the same material and are formed in one patterning process.

9. The display device according to claim 6, wherein the array substrate further comprises a buffer metal layer arranged between the active layer and the source/drain, and wherein the connecting layer and the buffer metal layer are of the same material and are formed in one patterning process.

10. The display device according to claim 6, wherein the gate, the gate insulating layer, the active layer and the source/drain are located in a display area of the base substrate, and the antenna is located in a non-display area of the base substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic view of an array substrate provided by an embodiment of the present invention;

(2) FIG. 2 is a structural schematic view of an antenna provided by an embodiment of the present invention;

(3) FIG. 3 is a flow chart of forming an antenna in an array substrate provided by an embodiment of the present invention;

(4) FIG. 4 is a flow chart of manufacturing an array substrate provided by an embodiment of the present invention;

(5) FIGS. 5-11 are schematic views of manufacturing an array substrate provided by an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

(6) Specific embodiments of the present invention will be described in greater detail with reference to the drawings and the embodiments. The following embodiments are for explanatory purposes only and not for limiting the scope of the present invention.

(7) An embodiment of the present invention provides an array substrate, the array substrate comprising a base substrate, and a gate, a gate insulating layer, an active layer and a source/drain arranged on the base substrate, the array substrate further comprising an antenna for receiving and/or transmitting wireless signals, with the antenna arranged on the base substrate.

(8) FIG. 1 is a schematic view of an array substrate provided by an embodiment of the present invention. The array substrate comprises a base substrate 1, a gate 2a, a gate insulating layer 3a, an active layer 4 and a source/drain 6a are arranged successively on a display area of the base substrate 1. Optionally, a buffer metal layer 5a can also be arranged between the active layer 4 and the source/drain 6a. An antenna 2b, a first insulating layer 3b and a signal line 6b are arranged successively on a non-display area of the base substrate 1. The signal line 6b is connected with the antenna 2b through a via hole in a first insulating layer 3b.

(9) The above base substrate 1 can be a glass substrate, and the antenna can have any shape. Further, in order to improve space utilization rate and enhance signal receiving effect of the antenna, the antenna 2b can have a spiral shape as shown in FIG. 2.

(10) By arranging the antenna on the base substrate of the array substrate, the array substrate provided by the embodiment can integrate the antenna in the display panel directly. Thus, not only the area of the PCB circuit board in the display device may be reduced, but also the spare area in the array substrate may be utilized sufficiently, thereby improving the integration level of the display device and reducing the total volume of the display device. In addition, the antenna can be prepared on a glass substrate. Since the insulating property of the glass substrate enables the substrate loss of the antenna to be very small, the quality of the antenna can be improved.

(11) Further, in the above embodiment, the antenna and the gate can be arranged in the same layer, i.e., the antenna 2b and the gate 2a are of the same material and are formed in one patterning process.

(12) Further, the above embodiment may include the first insulating layer and the gate insulating layer arranged in the same layer, and the signal line and the source/drain arranged in the same layer (i.e., the gate insulating layer 3a and the first insulating layer 3b use the same material and are formed in one patterning process, and the signal line 6b and the source/drain 6a use the same material and are formed in one patterning process).

(13) Further, in order to improve adhesion and electrical conductivity between the signal line 6b and the antenna 2b, a connecting layer 5b is further arranged in the via hole of the first insulating layer 3b, and the signal line 6b is connected with the antenna 2b through the connecting layer 5b. Further, in the event that the buffer metal layer 5a is arranged between the active layer 4 and the source/drain 6a, the connecting layer 5b and the buffer metal layer 5a can be arranged in the same layer, i.e., the connecting layer 5b and the buffer metal layer 5a use the same material and are formed in one patterning process.

(14) In addition, an embodiment of the present invention further provides a display device, comprising the above array substrate. The display device provided by the embodiment of the present invention may be any product or component with display function, such as a notebook computer display screen, a liquid crystal display, a liquid crystal television, a digital photo frame, a mobile phone, a panel computer etc.

(15) An embodiment of the present invention further provides a manufacturing method of an array substrate, the manufacturing method of the array substrate comprising forming a gate, a gate insulating layer, an active layer and a source/drain on an base substrate, with the method further comprising forming an antenna for receiving and/or transmitting wireless signals on the base substrate.

(16) The above base substrate may be a glass substrate, and the forming of the antenna can be achieved by forming a patterned metal layer on the base substrate.

(17) Specifically, referring to FIG. 3, FIG. 3 is a flow chart of forming an antenna on the array substrate provided by an embodiment of the present invention, comprising:

(18) S11: forming a first metal film on the base substrate;

(19) S12: patterning the first metal film, so as to form the gate on a display area of the base substrate and form the antenna on a non-display area of the base substrate.

(20) For the display device, since the spare area on the array substrate therein is much larger than the silicon based integrated circuit, the above antenna can be formed in the spare area other than the display area in the array substrate. Thus, not only the manufacturing costs can be reduced, but also the product manufactured can be lighter and thinner, moreover, impact on display of the array substrate can also be avoided.

(21) The manufacturing method of the array substrate provided by the embodiment of the present invention, by forming the antenna on the base substrate of the array substrate, can integrate the antenna in the display panel directly. Thus, not only the area of the PCB circuit board in the display device can be reduced, but also the spare area in the array substrate can be utilized sufficiently, thereby improving the integration level of the display device and reducing the total volume of the display device. In addition, the antenna can be prepared on a glass substrate. Since the insulating property of the glass substrate enables the substrate loss of the antenna to be very small, the quality of the antenna can be improved.

(22) Wherein, the above antenna can be formed simultaneously in the 4 mask or 5 mask process of manufacturing the array substrate. Thus, increasing patterning times in manufacturing the array substrate caused by manufacturing the antenna can be avoided, thereby reducing the manufacturing cost. Specifically, referring to FIG. 4, a flow chart of a method of manufacturing an array substrate is provided. The method includes the steps of:

(23) S21: forming a first metal film on the base substrate. Wherein the first metal film is located on a display area of the base substrate and a non-display area outside the display area of the base substrate. For example, referring to FIG. 5, the first metal film 2 can be formed by depositing Cu material through vacuum sputtering on the cleaned transparent glass substrate 1.

(24) S22: patterning the first metal film using a patterning process, so as to form the gate on the display area and form the antenna on the non-display area. Further, the antenna can have a spiral shape, thereby being capable of improving the space utilization rate of the non-display area in the array substrate as much as possible. For example, referring to FIG. 6, a first mask can be used to form the gate 2a and the antenna 2b simultaneously through exposing, developing and etching.

(25) S23: forming an insulating film, the insulating film is not only located on the display area of the base substrate, but also located on its non-display area. The insulating film that is located on the non-display area and covers the antenna forms the first insulating layer, and the insulating film located on the display area forms the gate insulating layer. For example, referring to FIG. 7, the SiNx material can be deposited on the gate and the antenna using PECVD so as to form the insulating film, to obtain the first insulating layer 3b and the gate insulating layer 3a.

(26) S24: etching the first insulating layer located in the non-display area using the patterning process, so as to form a via hole in the first insulating layer. For example, referring to FIG. 8, a negative photoresist and a second mask can be used to form a via hole 3c by exposing, developing and etching the first insulating layer 3b located on the non-display area, the position of the via hole can be located exactly above the antenna.

(27) S25: forming an active layer on the gate insulating layer, then, forming a third metal film on the display area and the non-display area. The third metal film is used for improving adhesion and electrical conductivity between the two layer structures adjacent to it. For example, referring to FIG. 9, after the active layer 4 is formed, a third metal film 5 is formed using the method of ion sputtering or evaporation, the third metal film can use Cr material, and can also use Mo, ALNd, MoW, Ti, Ta or Cu material.

(28) S26: patterning the third metal film using a patterning process, so as to form a buffer metal layer on the source/drain area of the active layer and form a connecting layer in the via hole. Through the above buffer metal layer, the adhesion and electrical conductivity between the active layer and the source/drain can be improved. Moreover, the adhesion and electrical conductivity between the antenna and the signal line can be improved through the connecting layer. For example, referring to FIG. 10, a positive photoresist and a third mask can be used to form the buffer metal layer 5a on the display area and form the connecting layer 5b in the via hole 3c of the non-display area through exposing, developing and etching.

(29) S27: forming a second metal film on the display area and the non-display area, the second metal film located on the non-display area is connected with the antenna through the connecting layer. For example, referring to FIG. 11, the second metal film 6 can be formed using evaporation or ion sputtering.

(30) S28: patterning the second metal film using a patterning process, so as to form the source/drain on the display area and form the signal line on the non-display area. For example, a fourth mask can be used to form the source/drain on the display area and form the signal line in the non-display area through exposing, developing and etching, so as to obtain the structure as shown in FIG. 1.

(31) The above embodiments are only used for explaining the present invention rather than limiting the present invention. The ordinary skilled person in the related technical field can also make various modifications and variants without departing from the spirit and scope of the present invention. Therefore, all the equivalent technical solutions also belong to the scope of the present invention, and the patent protection scope of the present invention should be defined by claims.