Abstract
A component carrier which includes a laminated stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having at least one electrically conductive connection structure and embedded in the stack, wherein the at least one electrically conductive connection structure of the component is exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the stack.
Claims
1. A final component carrier, comprising: a laminated stack having at least two electrically insulating layer structures and at least one electrically conductive layer structure; a component having at least one electrically conductive connection structure and embedded in the laminated stack; wherein the component is embedded in two electrically insulating layer structures with the component extending into one of the two electrically insulating layer structures for a first distance and extending into a remaining one of the two electrically insulating layer structures for a second distance different than the first distance; wherein the at least one electrically conductive connection structure of the component is exposed with respect to the laminated stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the laminated stack, said exposed electrically conductive connection structure configured for an electric connection to an electronic periphery in a direction of the laminated stack; wherein an adhesive structure is arranged on a surface of the component facing away from the exposed electrically conductive connection structure, wherein the at least one electrically conductive connection structure comprises at least one monolithic pillar, wherein the at least one monolithic pillar comprises a continuous sidewall that extends in a direction perpendicular to a main surface of the component from which the at least one monolithic pillar extends.
2. The final component carrier according to claim 1, wherein the at least one electrically conductive connection structure comprises or consists of at least one pad.
3. The final component carrier according to claim 1, wherein the at least one electrically conductive connection structure comprises at least one pad and at least one pillar on the at least one pad.
4. The final component carrier according to claim 3, wherein the at least one pad comprises at least one of the group consisting of: at least one pad being spaced with regard to a main body of the component by the at least one pillar; at least one pad directly on a main body of the component and spacing the main body of the component with respect to the at least one monolithic pillar.
5. The final component carrier according to claim 1, further comprising at least one of the following features: wherein the at least one electrically conductive connection structure has an aspect ratio of at least 0.3; wherein the exposed electrically conductive connection structure is coupled to a semiconductor chip; wherein the exposed electrically conductive connection structure is configured for connecting the electronic periphery with or without redistribution structure; wherein an at least one exposed free end of the at least one electrically conductive connection structure is covered with a solder material; at least one further component embedded in the laminated stack, and being electrically connected to the component; wherein the component is selected from a group consisting of a logic chip; wherein the final component carrier is configured as one of the group consisting of a printed circuit board, and a substrate, or a preform thereof; wherein the final component carrier is configured as a laminate-type component carrier.
6. The final component carrier according to claim 1, wherein the at least one exposed free end of the at least one electrically conductive connection structure is provided with at least one pad, the at least one pad being covered with a solder material.
7. A system, comprising: a final component carrier, the final component carrier comprising: a laminated stack comprising at least two electrically insulating layer structures and at least one electrically conductive layer structure; a component having at least one electrically conductive connection structure and embedded in the laminated stack; wherein the component is embedded in two electrically insulating layer structures with the component extending into one of the two electrically insulating layer structures for a first distance and extending into a remaining one of the two electrically insulating layer structures for a second distance different than the first distance; wherein the at least one electrically conductive connection structure of the component is exposed with respect to the laminated stack so that a free exposed end of the at least one electrically conductive connection structure of the component flushes with or extends beyond an exterior main surface of the laminated stack; wherein an adhesive structure is arranged on a surface of the component facing away from the exposed electrically conductive connection structure; and at least one further component vertically stacked with the final component carrier and electrically coupled with the embedded component by the at least one electrically conductive connection structure of the component, wherein the at least one electrically conductive connection structure has a vertical electric connection to the at least one further component, wherein the at least one electrically conductive connection structure comprises at least one monolithic pillar, wherein the at least one monolithic pillar comprises a continuous sidewall that extends in a direction perpendicular to a main surface of the component from which the at least one monolithic pillar extends.
8. The system according to claim 7, further comprising one of the following features: the at least one further component is a non-embedded component being surface mounted on the final component carrier; the at least one further component is embedded in material of and forms part of a module being connected with the final component carrier.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, FIG. 7 to FIG. 8 illustrate cross-sectional views of structures obtained during carrying out a method of manufacturing a component carrier with an embedded component, shown in FIG. 8 as part of a system composed of the component carrier and a module, according to an exemplary embodiment of the invention.
(2) FIG. 9 illustrates a cross-sectional view of a system composed of a component carrier, which may be manufactured as described referring to FIG. 1 to FIG. 7, and further surface mounted components according to another exemplary embodiment of the invention.
(3) FIG. 10, FIG. 11, FIG. 12, FIG. 13 to FIG. 14 illustrate cross-sectional views of structures obtained during carrying out a method of manufacturing a component carrier with an embedded component, shown as part of a system composed of the component carrier and a module in FIG. 14, according to yet another exemplary embodiment of the invention.
DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
(4) The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.
(5) Before, referring to the drawings, exemplary embodiments will be de-scribed in further detail, some basic considerations will be summarized based on which exemplary embodiments of the invention have been developed.
(6) According to an exemplary embodiment of the invention, a component carrier is provided in which a (preferably direct) contacting of one more component may be accomplished using copper pillar technology, or another appropriate vertical connection structure. In particular by using copper pillars for providing a z-axis connection of the embedded component, it is possible to obtain a high registration accuracy on the component (in particular chip). Using one or more copper pillars as connection structure may be also advantageous, because it may allow to achieve a higher aspect ratio than obtainable with laser via connections, for instance in a range between 2:1 and 1:1. Particularly advantageous is the use of copper pillars for z-axis interconnection with face-up assembly of the component in a cavity of the stack. This may allow to establish an electric coupling of a memory-processor connection, a connection to power modules, a connection with one or more antennas, etc.
(7) One exemplary embodiment of the invention allows the application of a rewiring layer on the surface of the package. The diameter of corresponding copper pillars may be preferably smaller than the connecting surface of the rewiring layer. By this embodiment, the registration area of the copper pillar may increase to the pad.
(8) According to another exemplary embodiment of the invention, a solder depot may be provided on the electrically conductive connection structure(s) to produce a direct contact of outer components to the internal connection component (for example an active component with copper pillar). Additionally, it is possible that such an external component is also connected to other connection points and internal components.
(9) In a further embodiment, it is possible to apply a module on said two mentioned embodiments.
(10) A corresponding component carrier or device may also be designed as a module that may contain components. The connection paths may thereby be reduced to a shorter or even shortest possible extent.
(11) A component carrier or module according to an exemplary embodiment can also be implemented as a power core. It is also possible to provide a module which may be implemented as a rewiring subcarrier (for example a silicon interposer, an HDI (high-density integration) organic interposer).
(12) FIG. 1 to FIG. 8 illustrate cross-sectional views of structures obtained during carrying out a method of manufacturing a component carrier 100 with an embedded component 108. Such a component carrier 100 according to an exemplary embodiment of the invention is shown in FIG. 5 to FIG. 7. In FIG. 8, the component carrier 100 is illustrated as part of a system 170 according to an exemplary embodiment of the invention composed of the component carrier 100 and a module 160. These embodiments may be used, for example, in substrate technology.
(13) Referring to FIG. 1, a laminated stack 102 is provided which comprises electrically conductive layer structures 106 and electrically insulating layer structures 104, being connected with one another by lamination (i.e., the application of heat and/or pressure). As shown, the layer stack 102 is composed of multiple planar layer structures 104, 106 so that the formed component carrier 100 is a plate-shaped laminate type printed circuit board (PCB) component carrier. The electrically conductive layer structures 106 are composed of patterned metal layers such as patterned copper foils and may also comprise vertical through connections such as copper filled laser vias. The electrically insulating layer structures 104 may comprise sheets comprising resin (in particular epoxy resin), optionally comprising reinforcing particles (such as glass fibers or glass spheres) therein. For instance, the electrically insulating layer structures 104 may be made of prepreg. A cavity 156 is formed in the stack 102.
(14) Passive components 150, 152, such as capacitors or inductances, are embedded in the stack 102.
(15) FIG. 1 also illustrates an active component 108 (such as a semiconductor chip embodied as microprocessor) to be embedded in the cavity 156 of the stack 102. As shown, component 108 has a plurality of electrically conductive connection structures 110 extending upwardly and in parallel to one another. According to FIG. 1, the component 108 is arranged above the stack 102 with the electrically conductive connection structures 110 facing away from the stack 102 so as to bring the component 108 into a configuration in which it may later be inserted into the cavity 156 (compare FIG. 2). At a bottom surface, the component 108 comprises a layer of an adhesive structure 122.
(16) Although not shown, it is also possible to modify the described manufacturing method by embedding the component 108 not in a cavity 156, but in contrast to this in a through-hole extending through the entire stack 102.
(17) Further alternatively and also not shown, it is possible that the component 108 is embedded by being pressed between opposing planar layer structures of the stack 102. This may be particularly advantageous for components 108 with very small thickness, for instance thin naked semiconductor dies having a thickness of less than 50 m.
(18) Again, referring to FIG. 1, the component 108 is covered with an adhesive structure 122 on a bottom main surface facing the stack 102 and facing away from the connection structures 110. By this adhesion structure 122 integrated in the component 108, it is subsequently possible to insert the component 108 into the cavity 156 of the stack 102 to thereby connect the component 108 with the stack 102 by the adhesive function of the adhesion structure 122. Additionally or alternatively, adhesive material may be placed in the cavity 156. However, providing the adhesive structure 122 as part of the component 108 renders the manufacturing process particularly simple, because dispensing adhesive material in the cavity 156 may then be dispensable. The component 108 to be embedded in the stack 102 is thus provided with a die attach film as adhesive structure 122 at a bottom main surface of the component 108.
(19) On the opposing other main surface, the active component 108 is provided with an array of copper pillars 116 as electrically conductive connection structures 110. The copper pillars 116 extend from a main body (in particular a semiconductor block) of the component 108 up to a free end 112. The component 108 is ready for being inserted into the cavity 156 of the stack 102. The stack 102 may be configured as a substrate with the cavity 156 and the already embedded components 150, 152.
(20) As illustrated by a detail 149, an electrically conductive pad 119 may be provided between a main body 108a of the component 108 on the one hand and a respective pillar 116 on the other hand. Hence, a component 108 may be provided on one or both opposing main surfaces of its main body 108a with one or more such electrically conductive pads 119 as electric terminals. Hence, also such one or more conductive pads 119 may form part of or may even form an entire connection structure 110 of any embodiment of the invention. For the sake of conciseness, such pads 119 are only shown in FIG. 1, but may be present in each embodiment described referring to the figures.
(21) As shown in FIG. 1, the pad 119 can be protruding in a vertical direction from the main body 108a of the component 108, but does not need to. Alternatively, the contact pad 119 at the main body 108a of the component 108 can also be flush with the outer surface of the main body 108a or even located in a (for instance ever so slight) recess (not shown). Thus, the pads 119 can, but do not need to, be protruding, and may be denoted generally as electrical contacts at an outer surface delimiting a component 108.
(22) Referring to FIG. 2, the component 108 may be inserted and fitted in the cavity 156. In the shown embodiment, the assembly area at the bottom of the cavity 156 has no copper, i.e., has no electrically conductive material of the electrically conductive layer structures 106. An advantage of this is the reduction of the CTE (coefficient of thermal expansion) stress. The assembly takes place supported by an attached film of adhesive material on the component 108 or by the application of a liquid adhesive on the back of the component 108 (compare adhesive structure 122 in FIG. 1). Thus, in order to obtain the central body of the structure shown in FIG. 2, the component 108 is inserted into the cavity 156 of the stack 102 so that the adhesive structure 122 on the back main surface of the component 108 connects the component 108 and the stack 102.
(23) Moreover, two uncured resin films in B-stage may be provided as further adhesive structures 122 which may be laminated onto the central body of FIG. 2 composed of the stack 102 and the component 108. These layer-shaped further adhesive structures 122 may comprise a matrix 121 of still uncured resin in which filler particles 124 with diameters in a range between 0.5 m and 1 m are located (as indicated schematically in a detail 151 in FIG. 2). The filler particles 124 may be selected to fine tune the properties of the layer type further adhesive structures 122 in the framework of the readily manufactured component carrier 100. For instance, the filler particles 124 may serve for reducing a CTE mismatch, enhancing thermal conductivity, etc.
(24) Hence, FIG. 2 shows the structure shown in FIG. 1 after having inserted the component 108 into the cavity 156 so that the adhesive structure 122 of the component 108 is attached to a bottom of the cavity 156. Subsequently, the so obtained structure is sandwiched between the two opposing electrically insulating layer structures forming the further adhesive structures 122, which are here embodied as at least partially uncured dielectric sheets. For instance, said layer type further adhesive structures 122 may comprise epoxy-based build-up material such as ABF (Ajinomoto Build-up Film) or prepreg material. ABF is a registered mark of Ajinomoto Co., Inc. of Tokyo, Japan.
(25) The structure shown in FIG. 3 may be obtained by connecting the central structure and the peripheral layers shown in FIG. 2 by lamination, i.e., by the application of mechanical pressure and/or thermal energy. During lamination, the previously uncured material of the further adhesive structures 122 becomes flowable, cross-links, solidifies and is thereby cured. As a result of this lamination, the copper pillar type connection structures 110 are completely embedded in material of the upper one of the further adhesive structures 122. After said lamination, the free ends 112 of the connection structures 110 are already located very close to the surface (for instance with a distance, L, in a range between 0.5 m and 5 m, compare detail 153).
(26) Referring to FIG. 4, the free ends 112 of the electrically conductive connection structures 110 are exposed with respect to the stack 102 by a plasma treatment (as indicated schematically by reference numeral 158) so that the free exposed ends 112 flush with (or even extend beyond, as in FIG. 12) an exterior main surface 114 of the stack 102. In other words, the free exposed ends 112 are now aligned with the planar exterior main surface 114 of the stack 102, as also illustrated in a detail 157. Thus, after having connected the component 108 with the stack 102 by the adhesive structures 122, the plasma treatment subsequently removes a surface portion of the uppermost adhesive structure 122 to thereby expose the electrically conductive connection structures 110. Exposing the copper pillars 116 may be done by plasma, or alternatively by another material removal procedure such as mechanical grinding and/or a chemical process. Thus, the electrically conductive connection structures 110 may be exposed for accomplishing a direct electric component interconnection.
(27) In order to obtain the component carrier 100 shown in FIG. 5, further electrically conductive layer structures 106 in form of copper filled laser vias may be formed in the upper and lower electrically insulating layer structures 104 by laser drilling followed by copper plating. As a result, inner electrically conductive layer structures 106 may be connected up to an exterior surface of the component carrier 100 shown in FIG. 5.
(28) Referring to FIG. 6, a further rewiring layer is formed on a top main surface and a bottom main surface of the component carrier 100 of FIG. 5, so as to provide additional connection surfaces.
(29) More precisely, in order to obtain the component carrier 100 shown in FIG. 6, all exposed electrically conductive surfaces of the structure shown in FIG. 5 may be covered with pads 118. For instance, this may be accomplished by laminating copper foils on both the upper main surface and the lower main surface of the component carrier 100 shown in FIG. 5, followed by a corresponding patterning procedure. This patterning may be carried out by a lithography and etching procedure. Thus, exterior electrically conductive connection surfaces can be formed.
(30) As shown, the pillars 116 may have a smaller diameter, d, than the diameter, D, of the pads 118. For example, diameter, d, of the copper pillars 116 may be in a range between 15 m and 20 m. In contrast to this, diameter, D, of the pads 118 (which may also be denoted as lands) may be 44 m (or more generally in a range between 30 m and 60 m). This may correspond to a registration tolerance of 12 m.
(31) Referring to FIG. 7, a solder deposit is formed. Thereafter, finalization of the PCB type component carrier 100 may be achieved (for instance by formation of a solder mask, etc.). Thus, the illustrated component carrier 100 according to an exemplary embodiment of the invention may be obtained by depositing solder material 120 on exposed electrically conductive surfaces, and in particular on the pads 118, on the upper main surface of the structure of FIG. 6. In the shown embodiment, the solder structures 120 are shaped as hemispherical bodies. Said solder structures 120 simplify a solder connection which may be established for electrically connecting the embedded component 108 and the passive components 150, 152 with an electronic environment.
(32) As illustrated in a detail 189 in FIG. 7, it is alternatively also possible that solder structures 120 directly cover pillars 116 (i.e., also when pads 118 on top of pillars 118 are absent). In such an embodiment, it is possible that the solder structures 120 partially cover a horizontal flange face of the pillars 116, as well as part of the lateral surface of the pillars 116.
(33) FIG. 7 shows a cross-sectional view of the component carrier 100 with the stack 102 composed of electrically insulating layer structures 104 and electrically conductive layer structures 106. The active component 108 with its parallel and vertically upwardly extending electrically conductive connection structures 110 in form of copper pillars 116 and pads 118 is partially embedded in the stack 102 and is partially exposed with regard to the stack 102. More specifically, the electrically conductive connection structures 110 of the component 108 are exposed with respect to the stack 102 so that a respective free exposed end 112 of the electrically conductive connection structure 110 of the component 108 slightly protrudes beyond an exterior main surface 114 of the stack 102. More precisely, the electrically conductive connection structures 110 comprise pads 118 or lands, each of which being formed on a respective one of the pillars 116. The pillars 116 have an aspect ratio (i.e., a ratio between height and diameter) of larger than one so as to establish an expanded z-axis connection within the component carrier 100. Said exposed electrically conductive connection structures 110 are configured for a direct electric connection of the embedded component 108 to the electronic periphery by soldering the solder structures 120 on top of the electrically conductive connection structures 110 on the electronic periphery. Each of said exposed free ends 112 of the electrically conductive connection structures 110 corresponds, according to FIG. 7, to the end face of a respective pad 118 being covered, in turn, with a half sphere of solder material in form of solder material 120.
(34) Alternatively, for instance in the absence of pads 118, the exposed free ends 112 of the electrically conductive connection structures 110 may be formed by horizontal end faces of the pillars 116 flushing or being aligned with the main surface 114, as shown in FIG. 5.
(35) Hence, the mentioned geometry allows the application of a rewiring layer on the surface of the package or component carrier 100. The diameter of the copper pillars 116 is smaller than the connecting surface of the rewiring layer. By this embodiment, the registration area of the copper pillars 116 increases to the size of the respective pad 118.
(36) Referring to FIG. 8, the exposed electrically conductive connection structures 110 of the component carrier 100 may be directly solder connected, by the solder structures 120, with a module 160 comprising further components 174, 176, which may be embodied as semiconductor chips (for instance memory chips).
(37) Thus, FIG. 8 shows the component carrier 100 according to FIG. 7 together with module 160. In order to obtain a system 170, the module 160 and the component carrier 100 can be connected by connecting exposed pads 172 of the module 160 with the solder material 120 on the upper main surface of the component carrier 100. As shown, the module 160 may comprise embedded components 174, 176, such as semiconductor chips. Said semiconductor chips may for instance be memory chips or a microprocessor. The components 174, 176 are embedded in a further stack 173 composed of further electrically insulating layer structures 175 and further electrically conductive layer structures 178. As a result of the embedding of component 108 in component carrier 100 in such a way that the electrically conductive connection structures 110 extend up to and optionally even beyond the upper main surface 114 of the component carrier 100, the electric paths in z-directions are extremely short. This enables a low loss transport of signals and keeps the obtained system 170 highly compact.
(38) FIG. 9 illustrates a cross-sectional view of a system 170 composed of the component carrier 100 manufactured according to FIG. 1 to FIG. 7 and further surface mounted components 174, 176 according to another exemplary embodiment of the invention.
(39) Thus, FIG. 9 illustrates another system 170 composed of the component carrier 100 according to FIG. 7 and further components 174, 176 being surface-mounted directly on the component carrier 100 by establishing a solder connection between pads 180 of the further components 174, 176 on the one hand and the solder material 120 on the other hand. For instance, the first further component 174 may be a processor and the second further component 176 may be a memory chip. More generally, said further components 174, 176 may be active or passive dies, microelectromechanical systems (MEMS), soldered antenna structures, modules, a further component carrier 100, etc. Optionally, an underfill may be provided to fill at least part of gaps 181 between the component carrier 100 and the further components 174, 176. The component 108 may for instance be a level shifter, an active die, a passive array (for instance silicon caps), a transceiver, etc.
(40) With embodiments described referring to FIG. 1 to FIG. 9, a redistribution structure 193 may be provided on the surface of the component carrier 100. As shown in particular in FIG. 9 and FIG. 6, diameter, d, of the pillars 116 is smaller than diameter, D, of the lands or pads 118 (the latter corresponding to the connecting area of the redistribution structure 193. Thus, the registration area of the copper pillars 116 with respect to the connection area can be increased.
(41) FIG. 10 to FIG. 14 illustrate cross-sectional views of structures obtained during carrying out a method of manufacturing a component carrier 100 with an embedded component 108, shown in FIG. 14 as part of a system 170 composed of the component carrier 100 and a module 160, according to yet another exemplary embodiment of the invention.
(42) The arrangement shown in FIG. 10 corresponds to the arrangement shown in FIG. 1 with the difference that, according to FIG. 10, exposed upper ends of the pillars 116 are covered with solder structures 120. Thus, the solder material 120 may be provided already before embedding the component 108 in the cavity 156. The embodiment described in the following can be denoted as an active bridge embodiment.
(43) The layer structure shown in FIG. 11 can be obtained based on the structure shown in FIG. 10 in the same way as described above referring to FIG. 2.
(44) In order to obtain the structure shown in FIG. 12, the electrically insulating layer structures 104 corresponding to the further layer type adhesive structures 122 may be laminated on top and bottom of the stack 102 with the inserted component 108, in a similar way as described referring to FIG. 3. However, in contrast to FIG. 3, the thickness of the further electrically insulating layer structures 104 to be laminated on top and on bottom and being made of uncured material may be formed sufficiently thin so that the solder material 120 on the pillars 116 remains exposed after the lamination process. This renders a plasma process or the like dispensable. In other words, in the lamination procedure according to FIG. 12, the copper pillars 116 with the solder material 120 are placed over the main surface 114 (for instance extending beyond the upper main surface 114 by 0.5 m to 5 m).
(45) Directly thereafter and now referring to FIG. 13, a module 160 may be placed above the component carrier 100 for subsequent interconnection, in a similar way as described above referring to FIG. 8. However, according to FIG. 13, the land diameter, i.e., the lateral extension, of the pads 172 of the module 160 may be 50 m. The pillars 116 may have a dimension of larger than 44 m. The registration accuracy may be 8 m.
(46) Still referring to FIG. 13, a respective solder depot (compare reference numeral 120) may already be pre-formed on the copper pillars 116 prior to the described embedding procedure, in order to produce a direct contacting of the external components to the internal connection component 108 (for example an active component 108 with copper pillars 116). More generally, such an external component may also be connected to another connection point and internal components.
(47) FIG. 14 illustrates a cross-sectional view of system 170 according to an exemplary embodiment of the invention which may be obtained by connecting component carrier 100 with module 160. Hence, FIG. 14 shows the result of the interconnection between component carrier 100 and module 160 by soldering, so that the readily manufactured system 170 is obtained as illustrated in FIG. 14. As shown, the connection between component carrier 100 and module 160 can be established directly and without redistribution layer.
(48) Optionally, an underfill may be filled in between the component carrier 100 and the module 160 (compare reference numeral 181).
(49) The embodiment described referring to FIG. 10 to FIG. 14 uses a solder depot or solder material 120 directly on copper pillar 116 of component 108 for accomplishing a direct electric coupling of the exterior further components 174, 176 with the interior embedded component 108. It is also possible that the exterior further components 174, 176 are electrically coupled, via additional connection structures 197 with the further components 150, 152 of the component carrier 100.
(50) It should be noted that the term comprising does not exclude other elements or steps and the article a or an does not exclude a plurality. Also, elements described in association with different embodiments may be combined.
(51) Implementation of the invention is not limited to the preferred embodiments shown in the figures and described above. Instead, a multiplicity of variants is possible which use the solutions shown and the principle according to the invention even in the case of fundamentally different embodiments.
