ANTI-PARALLEL DIODE FORMED USING DAMAGED CRYSTAL STRUCTURE IN A VERICAL POWER DEVICE

Abstract

After the various regions of a vertical power device are formed in or on the top surface of an n-type wafer, the wafer is thinned, such as by grinding. A drift layer may be n-type, and various n-type regions and p-type regions in the top surface contact a top metal electrode. A blanket dopant implant through the bottom surface of the thinned wafer is performed to form an n− buffer layer and a bottom p+ emitter layer. Energetic particles are injected through the bottom surface to intentionally damage the crystalline structure. A wet etch is performed, which etches the damaged crystal at a much greater rate, so some areas of the n− buffer layer are exposed. The bottom surface is metallized. The areas where the metal contacts the n− buffer layer form cathodes of an anti-parallel diode for conducting reverse voltages, such as voltage spikes from inductive loads.

Claims

1. A method for forming a vertical power device comprising: providing a silicon substrate wafer having a top surface and a bottom surface; forming n-type and p-type device regions in the top surface of the wafer; thinning the wafer from the bottom surface; implanting dopants into the bottom surface such that the bottom surface is a first layer of a first conductivity type, wherein the first layer abuts a second layer, having a second conductivity type, overlying the first layer; causing the bottom surface of the wafer to have a damaged crystalline structure so that the silicon will etch unevenly in an etching process; etching the bottom surface, wherein areas of the bottom surface have non-uniform etch rates, until areas of the second layer are exposed; and forming a first metal electrode on the bottom surface such that the first metal electrode directly contacts the first layer and the second layer, wherein contact with the second layer forms an anti-parallel diode, and wherein the first metal electrode conducts current in a forward direction when the device is on, and the first metal electrode conducts a reverse current when the device is off and a reverse voltage is applied across the device.

2. The method of claim 1 wherein the step of etching the bottom surface comprises wet etching the bottom surface.

3. The method of claim 1 wherein causing the bottom surface of the wafer to have a damaged crystalline structure comprises injecting energetic atoms into the bottom surface.

4. The method of claim 1 wherein causing the bottom surface of the wafer to have a damaged crystalline structure comprises damaging the bottom surface with a laser.

5. The method of claim 1 wherein causing the bottom surface of the wafer to have a damaged crystalline structure comprises masking the bottom surface and then damaging an unmasked area of the bottom surface.

6. The method of claim 1 wherein causing the bottom surface of the wafer to have a damaged crystalline structure comprises performing a blanket process on the bottom surface without masking.

7. The method of claim 1 wherein causing the bottom surface of the wafer to have a damaged crystalline structure occurs during the step of implanting dopants into the bottom surface.

8. The method of claim 1 further comprising laser annealing the bottom surface after the step of implanting dopants into the bottom surface.

9. The method of claim 1 wherein the wafer includes a drift region overlying the second layer.

10. The method of claim 1 wherein the second layer is a buffer layer below a drift layer of the second conductivity type.

11. The method of claim 1 wherein the second layer comprises a drift layer.

12. The method of claim 1 wherein the step of etching the bottom surface comprises subjecting the bottom surface to a KOH solution or a TMAH solution.

13. The method of claim 1 wherein the step of forming n-type and p-type device regions in the top surface of the wafer comprises forming an insulated gate turn off device.

14. The method of claim 1 wherein the step of forming n-type and p-type device regions in the top surface of the wafer comprises forming an insulated gate bipolar transistor.

15. The method of claim 1 further comprising forming trenched gates through the top surface for controlling conductivity of the device.

16. The method of claim 1 wherein the anti-parallel diode is formed in selected areas across the wafer.

17. The method of claim 1 wherein the anti-parallel diode is formed in random areas across the wafer.

18. A vertical power device comprising: a silicon substrate wafer having a top surface and a bottom surface; n-type and p-type device regions in the top surface of the wafer; dopants implanted into the bottom surface such that the bottom surface is a first layer of a first conductivity type, wherein the first layer abuts a second layer, having a second conductivity type, overlying the first layer; the bottom surface being non-uniformly etched such that some areas of the bottom surface comprise the second layer and other areas of the bottom surface comprise the first layer; and a first metal electrode on the bottom surface such that the first metal electrode directly contacts the first layer and the second layer, wherein contact with the second layer forms an anti-parallel diode, and wherein the first metal electrode conducts current in a forward direction when the device is on, and the first metal electrode conducts a reverse current when the device is off and a reverse voltage is applied across the device.

19. The device of claim 18 wherein the bottom surface of the wafer has damaged crystalline areas having higher etch rates than undamaged crystalline areas.

20. The device of claim 18 wherein the device is a gated, vertical semiconductor structure having n-type and p-type layers.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG. 1 is a cross-sectional view of a portion of a prior art IGTO device of the Applicant's own design, which does not contain an anti-parallel diode.

[0038] FIG. 2 is a cross-sectional view of a portion of a prior art IGTO device of the Applicant's own design where an integral anti-parallel diode is formed.

[0039] FIG. 3 is a cross-sectional view of a prior art IGBT which does not contain an anti-parallel diode.

[0040] FIG. 4 illustrates an IGTO device prior to the back side of the wafer being ground down, in accordance with one embodiment of the invention.

[0041] FIG. 5 illustrates the thinning of the wafer in FIG. 4, where details of the top device structure are not shown for simplicity.

[0042] FIG. 6 illustrates blanket implantation of phosphorus and boron ions to form the n− buffer layer and bottom p+ emitter layer.

[0043] FIG. 7 illustrates a laser anneal step for activating the dopants and re-crystallizing the silicon.

[0044] FIG. 8 illustrates energetic particles being injected into the bottom surface to damage the crystalline structure in either random distributed areas or in selected areas.

[0045] FIG. 9 illustrates wet etching the bottom surface of the wafer, where the etching rate is much more rapid in areas where the silicon is damaged.

[0046] FIG. 10 illustrates the result of the wet etching, where the n− buffer layer is exposed in various areas. A patterned mask layer may be used, if desired, to only subject certain areas to the wet etch of FIG. 9. The mask may also be used to select areas that are subjected to the injection of energetic particles in FIG. 8, such as only in the termination region of the die.

[0047] FIG. 11 illustrates the introduction of n-type dopants into the exposed etched regions to form n+ regions.

[0048] FIG. 12 illustrates the device after a bottom metallization, where the metal electrode directly contacts both the bottom p+ emitter layer and the n− buffer layer due to the uneven etching of the bottom surface. An anti-parallel diode symbol is overlaid in one area between the bottom metal electrode and any p-region formed in the top surface of the device.

[0049] FIG. 13 is a flowchart of steps used in one embodiment of the invention where energetic particles are injected to damage the silicon.

[0050] FIG. 14 is a flowchart of steps used in another embodiment of the invention where there is no step of injecting energetic particles, but rather the damage incurred by implanting n and p-type dopants is used to create uneven etch rates of the bottom surface.

[0051] Elements that are the same or equivalent are labeled with the same numbers.

DETAILED DESCRIPTION

[0052] FIG. 4 illustrates an IGTO device 60 prior to the back side of the n-type wafer 62 being ground down, in accordance with one embodiment of the invention. In one embodiment, the starting wafer 62 is n-type and is used for the drift region. In another embodiment, the wafer has a thick n-epitaxial layer formed over it that serves as the drift region. The wafer 62 may be up to 1000 microns thick at this stage.

[0053] FIG. 5 illustrates the thinning of the wafer 62 down to, for example, 50 microns, by grinding. Details of the top device structure are not shown for simplicity. The thinned wafer 64 is then subjected to backside processing. In another embodiment, the central area of the wafer 62 is thinned, and the perimeter is not thinned, using the well-known Taiko process.

[0054] FIG. 6 illustrates blanket implantation of phosphorus ions 66 to form an n− buffer layer 68 and a blanket implantation of boron ions 70 to form the bottom p+ emitter layer 72. The phosphorus ions 66 have a higher energy than the boron ions 70 to be implanted deeper. The n− buffer layer 68 is optional. The n− buffer layer 68 is more highly doped than the overlying n− drift layer and helps control the injection of holes by the p+ emitter layer 72. The n− buffer layer 68 also limits the thickness of the depletion region when the device is off.

[0055] FIG. 7 illustrates a laser anneal 74 of the back surface of the wafer 64 for activating the dopants and re-crystallizing the silicon.

[0056] FIG. 8 illustrates energetic particles 76 being injected into the bottom surface of the wafer 64 to damage the crystalline structure in either random distributed areas or in selected areas. The damaged areas will have a higher etch rate than the undamaged areas. If there is no masking, the dose of the energetic particles 76 is fairly low so that the distribution is random and sparse, causing some areas to be damaged and other areas to not be damaged. A suitable dosage can be determined by simulation or by testing. Alternatively, a mask can be used to limit the damage to, for example, the edge area of the wafer 64 so as not to subsequently remove the p+ emitter layer 72 under the central cell array.

[0057] Suitable energetic particles include n-type dopant atoms such as phosphorus or arsenic; p-type dopant compounds such as BF.sub.2; insert gas atoms such as helium, argon, or neon; semiconductor atoms such as silicon or germanium; or protons such as hydrogen ions that can cause voids and other defects.

[0058] Other ways of providing damaged crystalline silicon on the bottom surface include the following. Wafers with a high level of defects can be used. Or a high level of defects can be created using a process like intrinsic gettering. Or, damage to the back of the wafer can be caused with a laser in a patterned or a pseudo-random fashion before the silicon etch. Or, an etch resistant layer can be used that is itself masked and etched in a patterned or a pseudo-random fashion over the back of the silicon wafer before the silicon etch. Thus, the element 76 in FIG. 8 represents all of these processes.

[0059] FIG. 9 illustrates wet etching 78 the bottom surface of the wafer 64, where the etching rate is inherently much more rapid in areas where the silicon is damaged. Suitable wet etchants include KOH (potassium hydroxide) and TMAH (tetramethyl ammonium hydroxide). The wet etch time is sufficient to remove the silicon to the point where the n− buffer layer 68 is exposed in various areas. This time may be determined by simulation or testing. In another embodiment, other types of etching may be used where damaged silicon is etch more rapidly than crystalline silicon.

[0060] FIG. 10 illustrates the result of the wet etching, where the n− buffer layer 68 is exposed in various areas. Since no masking is used, the damaged areas 80 are randomly distributed, with the more damaged areas having the highest etch rate. Another laser anneal may be performed to re-crystallize the damaged areas, if necessary, to achieve the lowest resistance of the layers.

[0061] FIG. 10 also illustrates the optional masking of the bottom surface (using mask 81) prior to the wet etching step of FIG. 9. This results in the selective etching of the silicon in only certain areas. The mask 81 may also be used to select areas that are subjected to the injection of energetic particles in FIG. 8, such as only in the termination region of the die. Accordingly, the areas to be rapidly etched by the wet etch or the areas that are subjected to the injection of energetic particles can be random (no mask) or predetermined using one or more masks.

[0062] FIG. 11 illustrates the introduction of n-type dopants, such as arsenic or phosphorus, into the exposed etched regions to form n+ regions 82. This step may be used to form a subsequent low resistance ohmic contact to the exposed n-buffer region 68 (or to the exposed n-buffer and n− drift regions) so an anti-parallel diode with low resistance n-type and p-type contact regions may be formed. In embodiments where no masking is used, the bottom p+ emitter layer 72 should be heavily doped p-type so the net doping after the blanket introduction of n-type dopants is still p+.

[0063] FIG. 12 illustrates the device after a bottom metallization, where the metal electrode 83 directly contacts both the bottom p+ emitter layer 72 and the n− buffer layer 68 due to the uneven etching of the bottom surface. An anti-parallel diode symbol 84 is overlaid in one area between the bottom metal electrode 82 and any p-region 86 formed in the top surface of the device. The p-region 86 may include the p-well 14 in FIG. 1, or the p-well in the termination area of FIG. 2 coupled to a top metal electrode 88. The top metal electrode 88 will typically be the main cathode electrode that conducts current when the device is on. The anti-parallel diode conducts reverse voltage spikes that could otherwise damage the IGTO or IGBT device.

[0064] The device itself may be any vertical conduction device that conducts current in one direction when the device is on and can benefit from an anti-parallel diode that conducts in the opposite direction when the device is off and a reverse voltage is applied to the top and bottom electrodes of the device. Most vertical switches used for controlling motors or other inductive loads can benefit from the invention.

[0065] The thickness of the various layers depends on the desired device and operating parameters. Generally, a thinner p+ emitter layer 72 is beneficial for reduced forward voltage drop.

[0066] FIG. 13 is a flowchart of steps used in one embodiment of the invention where a separate step is used to damage the silicon, such as injecting energetic particles. In step 90, all the “upper” device layers and regions are formed through the top surface of the wafer. Alternatively, a thick epitaxial layer can be formed over a starting wafer to form the n− drift region, and the other layers may be formed in the epitaxial layer. This allows the wafer to have any conductivity type and may be un-doped.

[0067] In step 92, the wafer is thinned, such as by grinding.

[0068] In step 94, n-type and p-type dopants are implanted in the back side of the thinned wafer to form the n− buffer layer and the bottom p+ emitter layer.

[0069] In step 96, the bottom surface is laser annealed to activate the dopants and re-crystallize the silicon.

[0070] In step 98, the bottom surface is randomly or selectively damaged by the injection of energetic particles, or using other techniques, to increase the etch rate in the damaged areas.

[0071] In step 100, the bottom surface of the wafer is wet etched. The etching rate is much higher in the damaged areas. The etching is stopped when areas of the n− buffer layer or the n− drift layer are exposed.

[0072] In step 101, n-type dopants are implanted into the sidewalls and bottom surfaces of the etched areas for ohmic contact to the bottom metal electrode.

[0073] In step 102, the bottom surface is metallized, resulting in the metal layer directly contacting the n− buffer layer and the p+ emitter layer. An anti-parallel diode is formed where the metal electrode directly contacts the n− buffer layer or n− drift region.

[0074] FIG. 14 is a flowchart of steps used in another embodiment of the invention where there is no step of injecting energetic particles, but rather the damage incurred by implanting n and p-type dopants is used to create uneven etch rates of the bottom surface. In FIG. 14, all steps are the same as in FIG. 13, except that, in step 104, the laser anneal (if any) is insufficient to fully re-crystallize the silicon, resulting in some damaged areas of the bottom surface. Therefore, there is no need for the step 98 in FIG. 13 of injecting energetic particles to damage the silicon. After the wet etch step 100, an optional laser anneal step can be performed to re-crystallize the silicon to lower resistivity and lower the forward voltage.

[0075] While particular embodiments of the present invention have been shown and described, it will be obvious to those skilled in the art that changes and modifications may be made without departing from this invention in its broader aspects and, therefore, the appended claims are to encompass within their scope all such changes and modifications as fall within the true spirit and scope of this invention.