METALLIZED JUNCTION FINFET STRUCTURES

Abstract

FinFET devices are provided wherein the current path is minimized and mostly limited to spacer regions before the channel carriers reach the metal contacts. The fins in the source/drain regions are metallized to increase the contact area and reduce contact resistance. Selective removal of semiconductor fins in the source/drain regions following source/drain epitaxy facilitates replacement thereof by the metallized fins. A spacer formed subsequent to source/drain epitaxy prevents the etching of extension/channel regions during semiconductor fin removal.

Claims

1-11. (canceled)

12. A FinFET structure comprising: a substrate; a plurality of vertically extending, parallel semiconductor fins mounted to the substrate; a plurality of parallel gate structures on and extending perpendicularly with respect to the semiconductor fins; a plurality of first sidewall spacers on the gate structures; a plurality of pairs of unmerged epitaxial source/drain structures operatively associated with the semiconductor fins; a plurality of parallel, vertically oriented, fin-shaped cavities between each pair of source/drain structures, each of the cavities being horizontally aligned with one of the semiconductor fins and extending perpendicularly with respect to the plurality of gate structures, and a metal silicide layer adjoining the source/drain structures and filling the plurality of cavities.

13. The FinFET structure of claim 12, wherein semiconductor substrate comprises a semiconductor-on-insulator substrate including a bottom semiconductor layer and an electrically insulating layer adjoining the bottom semiconductor layer, the semiconductor fins having base portions adjoining the electrically insulating layer and the cavities extending down to the electrically insulating layer.

14. The FinFET structure of claim 13, wherein the metal silicide layer is formed on (111) planes of the epitaxial source/drain structures.

15. The FinFET structure of claim 14, further including a plurality of second dielectric spacers adjoining the first dielectric sidewall spacers and covering portions of the source/drain structures.

16. The FinFET structure of claim 15, further including an inter-level dielectric layer on the substrate and an opening in the inter-level dielectric layer exposing the metal silicide layer on the source/drain structures.

17. The FinFET structure of claim 14, further including an electrically conductive contact bar in direct contact with the metal silicide layer.

18. The FinFET structure of claim 17, further including doped extension junctions within the semiconductor fins.

19. The FinFET structure of claim 17, wherein the source/drain structures consist essentially of doped silicon germanium.

20. The FinFET structure of claim 17, wherein the source/drain structures consist essentially of doped silicon.

21. The FinFET structure of claim 14, wherein the semiconductor fins are mono-crystalline silicon fins having sidewalls including (110) surfaces and each pair of source/drain structures comprises a pair of laterally extending, diamond-shaped structures including facets.

22. A FinFET structure comprising: a substrate; a plurality of vertically extending semiconductor fins mounted to the substrate, each of the fins including a plurality of discrete fin portions; a plurality of gate structures on the fin portions, the gate structures including sidewalls; first dielectric sidewall spacers adjoining the sidewalls of the gate structures; a plurality of pairs of unmerged epitaxial source/drain structures operatively associated with the fin portions and extending between the gate structures; a plurality of parallel, vertically oriented fin-shaped cavities between and separating each pair of source/drain structures, the fin-shaped cavities extending between the fin portions, and a metal silicide layer adjoining the source/drain structures and filling the plurality of cavities.

23. The FinFET structure of claim 22, wherein semiconductor substrate comprises a semiconductor-on-insulator substrate including a bottom semiconductor layer and an electrically insulating layer adjoining the bottom semiconductor layer, the fin portions having base portions adjoining the electrically insulating layer, and the cavities extending vertically to the electrically insulating layer of the semiconductor-on-insulator substrate.

24. The FinFET structure of claim 23, wherein the metal silicide layer is formed on (111) planes of the epitaxial source/drain structures and the sidewalls of the fin portions include (110) surfaces.

25. The FinFET structure of claim 24, further including second dielectric sidewall spacers adjoining the first dielectric sidewall spacers and covering portions of the source/drain structures.

26. The FinFET structure of claim 24, wherein the semiconductor fins are mono-crystalline silicon fins and each pair of source/drain structures comprises laterally extending, diamond-shaped structures including facets.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG. 1A is a schematic top plan view of an array of fins formed on an oxide layer;

[0013] FIG. 1B is a sectional view thereof;

[0014] FIG. 2A is a schematic top plan view showing gates formed on the array of fins;

[0015] FIG. 2B is a sectional view thereof;

[0016] FIG. 3A is a schematic top plan view showing first sidewall spacers formed on the gates;

[0017] FIG. 3B is a sectional view thereof;

[0018] FIG. 4A is a schematic top plan view showing selective epitaxial growth of source/drain regions on the fins;

[0019] FIG. 4B is a sectional view thereof;

[0020] FIG. 5A is a schematic top plan view showing second sidewall spacers formed on the gates;

[0021] FIG. 5B is a sectional view thereof;

[0022] FIG. 6A is a schematic top plan view showing formation of an inter-level dielectric layer on the structure shown in FIG. 5A;

[0023] FIG. 6B is a sectional view thereof;

[0024] FIG. 7A is a schematic top plan view showing removal of a portion of the inter-level dielectric layer;

[0025] FIG. 7B is a sectional view thereof;

[0026] FIG. 8A is a schematic top plan view showing the structure of FIG. 7A following removal of the fins in the source/drain regions;

[0027] FIG. 8B is a sectional view thereof

[0028] FIG. 9A is a schematic top plan view showing metal deposition and silicidation;

[0029] FIG. 9B is a sectional view thereof, and

[0030] FIG. 10 is a schematic sectional view showing an exemplary finished structure.

DETAILED DESCRIPTION

[0031] FinFET structures are characterized by fins formed on semiconductor substrates. Such substrates include bulk silicon substrates (fin on bulk) and SOI substrates (fin on SOI) as discussed above. FIGS. 1-9 illustrate exemplary steps that may be performed sequentially in fabricating a finned structure usable to form nFET and pFET devices, it being appreciated that additional steps may be necessary or desirable depending on the desired features of the structure. Fabrication may commence with a partially completed structure, in which case one or more of the steps described below could be omitted.

[0032] An exemplary structure 20 including mono-crystalline silicon fins 22 formed from a SOI substrate 24 is shown in FIGS. 1A and 1B. The fin heights are commensurate with the thickness of the crystalline silicon layer of the original substrate from which they are formed. Fin heights are fifty nanometers or less in one or more exemplary embodiments discussed herein. Fin widths are twenty nanometers or less in one or more of the exemplary embodiments. The base portions of the fins 22 adjoin an insulating layer such as a buried oxide (BOX) layer 25, for example silicon dioxide. The bottom semiconductor layer 27 may comprise silicon. The SOI layer from which the fins 22 are formed and the bottom semiconductor layer 27 are not necessarily comprised of the same materials. While the fins 22 are shown as having vertical side walls and horizontal top surfaces in the schematic illustrations, it will be appreciated that fins in FinFET structures may have somewhat different configurations such as triangular configurations wherein the fin bases are wider than the tops of the fins. For example, tapered fins formed on bulk silicon substrates (not shown) facilitate filling the cavities between fins with oxide materials (not shown) without forming voids. The structure 20 may accordingly include fins having sides that are not completely vertical. Fin heights are preferably equal. Fin heights, widths and spacing are further chosen in accordance with manufacturer preferences. Fin heights in some embodiments range between 10-50 nm. The substrate in one exemplary embodiment is a (100) substrate oriented such that the side walls of the mono-crystalline silicon fins 22 are (110) surfaces. As discussed above, the side walls of the fins 22 may not be exactly vertical. Surfaces described as (110) surfaces herein are at least close to being (110) surfaces but may or may not be exactly (110) surfaces.

[0033] Referring to FIGS. 2A and 2B, gate structures 30 are formed on the finned structure 20 and extend perpendicularly with respect to the fins 22. Any gate pitch suitable for the intended application of the completed product may be chosen. If a gate-first process as described above is employed, gate materials may comprise a gate dielectric (e.g., high-k such as hafnium oxide) and a gate conductor (e.g., metal gate). Any suitable deposition technique can be used to deposit high-k and metal gate, including but not limited to atomic layer deposition, chemical vapor deposition, physical vapor deposition, sputtering, plating, etc. First dielectric spacers 32 are formed on the side walls of the gate structures 30 as shown schematically in FIGS. 3A and 3B. A dielectric material such as silicon nitride is used to form the spacers in some embodiments. Conventional deposition techniques such as spin-on coating, CVD, plasma-assisted CVD, or other known techniques can be employed to deposit silicon nitride (Si.sub.3N.sub.4). Patterning and suitable etching techniques such as reactive ion etching (RIE) can be employed to form the first sidewall spacers 32 from the deposited material. Optionally, the fins 22 may be subjected to ion implantation following formation of the first sidewall spacers to form extension junctions.

[0034] Referring to FIGS. 4A and 4B, diamond-shaped source/drain structures 42 of uniformly doped semiconductor material are formed on the exposed sidewalls of the fins 22 by epitaxial growth. Faceted structures are formed on the fins as the silicon germanium (or silicon) epitaxy forms on (110) planes, thereby enlarging the source/drain regions of the fins 22. Fin sidewall surfaces are (110) surfaces in one or more embodiments, epitaxial growth thereon resulting in diamond-shaped structures due to the fact that the growth rate on (111) planes is considerably less than on (110) planes (100 is fastest), therefore self-limiting diamond-shaped structures 42 are formed. Growth is limited in this exemplary embodiment to avoid merging of the faceted structures 42. Those of skill in the art are familiar with processes for growing such structures. Silane and germane are exemplary precursor materials for use in an epitaxial tool. The choice of semiconductor materials and dopants depends on the type of device to be fabricated and desired device characteristics. To employ the epitaxial tool in the fabrication of a pFET structure, boron-doped SiGe is formed in one or more embodiments for growth of the unmerged diamond-shaped structures 42 on the sidewalls of the crystalline silicon fins 22 shown in FIGS. 4A and 4B. To fabricate nFET structures, the unmerged diamond-shaped structures are formed with phosphorus-doped silicon (Si:P) in some embodiments. The doping can be chosen as desired for particular transistor applications, particularly if the fins 22 are already effectively doped. Doping levels high enough to provide the desired electrical properties can be beneficial in reducing defects. In one exemplary embodiment where the doped source/drain semiconductor material is SiGe containing about thirty-five percent (35%) gemanium, the dopant is boron in a concentration ranging 6-910.sup.20cm.sup.3 and the resulting FinFET structure is p-type. The resulting structure may be subjected to rapid thermal anneal following formation of the unmerged diamond-shaped structures to drive dopant into the fins 22 to form extension junctions.

[0035] A second spacer layer is deposited and patterned to form a plurality of second dielectric spacers 44 on the fins 22. The material employed for the second spacer layer may or may not be the same as that used to form the first spacers 32. In some embodiments, the second spacers 44 are nitride spacers that are 4-6 nm thick. As shown in FIGS. 4A and 4B, the second spacers 44, being formed subsequent to source/drain epitaxy, cover parts of the diamond-shaped structures 42 of doped semiconductor material. The second spacers 44 also adjoin the first spacers 32 formed on the gate structures 30.

[0036] An inter-level dielectric (ILD) layer 46 is formed on the structure 20, as shown in FIGS. 6A and 6B. Silicon oxide is an exemplary material employed for use as the ILD layer, and can be formed using a standard process such as PECVD. The ILD layer 46 is then masked and etched to form opening(s) (trenches) exposing the diamond-shaped structures 42 of doped source/drain semiconductor material. Reactive ion etching (ME) is employed to remove the selected portion(s) of the ILD. FIGS. 7A and 7B schematically illustrate the ILD layer 46 and an opening 48 provided therein. The epitaxial source/drain structures 42 are exposed following the reactive ion etch.

[0037] Anisotropic reactive ion etching is a directional etch employed in one or more exemplary embodiments for the complete and selective removal of the semiconductor fins 22 in the source/drain regions and forming parallel, fin-shaped cavities 50 therein. The second spacers 44 prevent etching of the source/drain extension/channel regions as well as extension junctions optionally formed therein via rapid temperature annealing or ion implantation prior to formation of the second sidewall spacers 44. The portions of the semiconductor fins 22 protected by the gate structures remain intact during this step.

[0038] Metal is deposited on the faceted surfaces of the diamond-shaped structures 42 of doped semiconductor material and also fills the cavities 50 formed by the removal of the exposed portions of the semiconductor fins 22. This substantially increases the contact area, thereby reducing the contact resistance and overall access resistance to the FinFET devices obtained. In one or more embodiments, a metal such as nickel, nickel platinum, or titanium is deposited on the surfaces of the faceted structures 42 and within the cavities 50. In one or more embodiments, the thickness of the deposited metal layer is between eight to ten nanometers (8-10 nm). Electroless deposition processes and atomic layer deposition (ALD) are among the techniques that may be employed. Metal deposition may be followed by low temperature silicidation to form a metal silicide layer 52 as shown schematically in FIGS. 9A and 9B Annealing temperatures between 300-420 C. form uniform layers of metal-rich silicides.

[0039] An exemplary device 60 is shown in FIG. 10. An electrically conductive (e.g. copper) contact bar 54 adjoins the metal silicide layer 52 and is accordingly electrically connected thereto. It is evident that the contact area of the device 60 is substantial and the current path is mostly limited to the spacer region before the channel carriers reach the metal contacts.

[0040] Given the discussion thus far and with reference to the exemplary embodiments discussed above and the drawings, it will be appreciated that, in general terms, an exemplary fabrication method includes obtaining a structure including a substrate 24, a plurality of parallel semiconductor fins 22 on the substrate, each of the semiconductor fins including a pair of unmerged epitaxial source/drain structures 42 comprising doped semiconductor material extending from sidewalls thereof, a plurality of parallel gate structures 30 intersecting the plurality of parallel semiconductor fins 22, a first set of sidewall spacers 32 adjoining the gate structures 30, and a second set of spacers 44 adjoining the first set of sidewall spacers 32 and covering portions of the source/drain structures 42. FIGS. 7A and 7B illustrate an exemplary structure including such elements. Portions of the plurality of parallel semiconductor fins 22 are selectively removed from the substrate, forming parallel cavities 50 separating pairs of the source/drain structures 42, as shown in FIGS. 8A and 8B. Metal is deposited within the cavities and on the source/drain structures and metal silicide regions 52 adjoining the source/drain structures are formed, as schematically illustrated in FIGS. 9A and 9B. In one or more embodiments, the step of obtaining the structure includes obtaining the substrate 24, forming the plurality of parallel semiconductor fins 22 on the substrate, forming the plurality of parallel gate structures 30 on the substrate and around the plurality of semiconductor fins, forming the first set of sidewall spacers 32 on the plurality of parallel gate structures 30 as shown in FIGS. 3A and 3B, epitaxially growing the pairs of epitaxial source/drain structures 42 on the exposed sidewalls of the fins as shown in FIGS. 4A and 4B, and forming the second set of spacers around the parallel gate structures and over portions of the source/drain structures adjoining parallel gate structures. FIGS. 5A and 5B schematically illustrate the deposition and patterning of the second set of spacers 44. An inter-level dielectric layer 46 is formed on the substrate 24 and covers the pairs of epitaxial source/drain structures in some embodiments. The inter-level dielectric layer is subjected to etching to expose portions of the epitaxial source/drain structures, as shown in FIGS. 7A and 7B. The step of epitaxially growing the pairs of epitaxial source/drain structures 42 on the exposed sidewalls of the fins 22 further includes forming the epitaxial source/drain regions on (110) planes such that the epitaxial source/drain structures are unmerged and bound by (111) planes. FIGS. 4A and 4B schematically illustrate the unmerged source/drain structures 42, which are formed subsequent to formation of the gate structures and the first set of sidewall spacers 32.

[0041] An exemplary FinFET structure provided in accordance with the disclosure includes a substrate 24 and a plurality of semiconductor fins 22 mounted to the substrate. A plurality of gate structures 30 and a plurality of pairs of unmerged source/drain structures 42 are operatively associated with the semiconductor fins. A plurality of cavities 50 is located between each pair of source/drain structures 42. A metal silicide layer 52 adjoins the source/drain structures and fills the plurality of cavities. FIGS. 9A and 9B schematically illustrate a FinFET structure including such elements. The FinFET structure further includes a first set of dielectric sidewall spacers 32 adjoining the gate structures 30 and a second set of dielectric spacers 44 adjoining the first set of dielectric spacers 32 and covering portions of the source/drain structures 42 in one or more embodiments. An inter-level dielectric layer 46 on the substrate is provided in some embodiments. The inter-level dielectric layer includes an opening exposing the metal silicide layer on the source/drain structures. The FinFET structure includes an electrically conductive contact bar 54 in direct contact with the metal silicide layer 52 in some embodiments, as schematically illustrated in FIG. 10. Doped extension junctions within the semiconductor fins are included in some embodiments.

[0042] Those skilled in the art will appreciate that the exemplary structures discussed above can be distributed in raw form (a single wafer having multiple unpackaged chips), as bare dies, in packaged form, or incorporated as parts of intermediate products or end products that benefit from having FinFET devices therein.

[0043] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms a, an and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprises and/or comprising, when used in this specification, specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof Terms such as above and below are used to indicate relative positioning of elements or structures to each other as opposed to relative elevation.

[0044] The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the various embodiments has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the forms disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the various embodiments with various modifications as are suited to the particular use contemplated.