Heat dissipation device and manufacturing method thereof

Abstract

A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components.

Claims

1. A manufacturing method of a heat dissipation device, comprising steps of: preparing a first board body and a second board body, wherein a planar raised section is selectively disposed on an outer surface of the first board body or the second board body for directly contacting a flat surface of a heat source; disposing at least one capillary structure on and multiple support pillars extending between inner faces of the first and second board bodies; mating the first and second board bodies with each other to form a heat dissipation device with a closed chamber, the support pillars being disposed in the closed chamber, vacuuming the closed chamber, filling a working fluid into the closed chamber and sealing the heat dissipation device, wherein two ends of each of the support pillar are respectively connected with the capillary structure on the inner faces of the first and second board bodies; and mechanically processing the first and second board bodies to form a fixing hole through the closed chamber in the first and second board bodies and a corresponding support pillar in a position where a selected support pillar is positioned.

2. The manufacturing method of the heat dissipation device as claimed in claim 1, wherein the capillary structure is selected from a group consisting of sintered powder body, and channeled structure.

3. The manufacturing method of the heat dissipation device as claimed in claim 1, wherein the heat dissipation device further has a fixing member, one end of the fixing member being correspondingly fitted through the fixing hole, the fixing member having a hole formed with an inner thread.

4. The manufacturing method of the heat dissipation device as claimed in claim 1, wherein the mechanical processing is selected from a group consisting of punching, drilling and milling.

5. The manufacturing method of the heat dissipation device as claimed in claim 1, wherein the capillary structure and the support pillars are connected with the first and second board bodies by means of a process selected from a group consisting of diffusion bonding, sintering and brazing.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

(2) FIG. 1a is a sectional view of a conventional heat spreader;

(3) FIG. 1b is a top view of the conventional heat spreader;

(4) FIG. 2 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention;

(5) FIG. 3 is a perspective assembled view of the first embodiment of the heat dissipation device of the present invention;

(6) FIG. 4 is a sectional view taken along line A-A of FIG. 3;

(7) FIG. 5 is a perspective view of a second embodiment of the heat dissipation device of the present invention;

(8) FIG. 6 is a sectional view of a third embodiment of the heat dissipation device of the present invention;

(9) FIG. 7 is a sectional view of a fourth embodiment of the heat dissipation device of the present invention;

(10) FIG. 8 is a perspective view of a fifth embodiment of the heat dissipation device of the present invention;

(11) FIG. 9 is a perspective view of a sixth embodiment of the heat dissipation device of the present invention;

(12) FIG. 10 is a perspective exploded view of a seventh embodiment of the heat dissipation device of the present invention;

(13) FIG. 11 is a perspective assembled view of the seventh embodiment of the heat dissipation device of the present invention;

(14) FIG. 12 is a perspective exploded view of an eighth embodiment of the heat dissipation device of the present invention;

(15) FIG. 13 is a perspective exploded view of a ninth embodiment of the heat dissipation device of the present invention;

(16) FIG. 14 is a perspective assembled view of the ninth embodiment of the heat dissipation device of the present invention; and

(17) FIG. 15 is a flow chart of the manufacturing method of the heat dissipation device of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(18) Please refer to FIGS. 2, 3 and 4. FIG. 2 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention. FIG. 3 is a perspective assembled view of the first embodiment of the heat dissipation device of the present invention. FIG. 4 is a sectional view taken along line A-A of FIG. 3. According to the first embodiment, the heat dissipation device 1 of the present invention includes a main body 11 and at least one fixing hole 111.

(19) The main body 11 has a first board body 112 and a second board body 113 corresponding to the first board body 112. The first and second board bodies 112, 113 are mated with each other to define a chamber 114. The chamber 114 has a first inner side 1141 and a second inner side 1142. A working fluid 115 and multiple support pillars 116 are disposed in the chamber 114. At least one capillary structure 117 is disposed on a surface of the chamber 114. Two ends of the support pillar 116 are connected to the first and second sides 1141, 1142 of the chamber 114 respectively. The capillary structure 117 is a sintered powder body.

(20) The fixing hole 111 is formed on the main body 11 in a position where any support pillar 116 is positioned. The fixing hole 111 passes through the first and second board bodies 112, 113 and the support pillar 116.

(21) In this embodiment, the heat dissipation device 1 is, but not limited to, a heat spreader for illustration purposes only.

(22) Please refer to FIG. 5, which is a perspective view of a second embodiment of the heat dissipation device of the present invention. The second embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The second embodiment is different from the first embodiment in that the fixing hole 111 is formed with an inner thread 1111.

(23) Please refer to FIG. 6, which is a sectional view of a third embodiment of the heat dissipation device of the present invention. The third embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The third embodiment is different from the first embodiment in that the capillary structure 117 is a mesh body.

(24) Please refer to FIG. 7, which is a sectional view of a fourth embodiment of the heat dissipation device of the present invention. The fourth embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fourth embodiment is different from the first embodiment in that the capillary structure 117 is a channeled structure.

(25) Please refer to FIG. 8, which is a perspective view of a fifth embodiment of the heat dissipation device of the present invention. The fifth embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fifth embodiment is different from the first embodiment in that the fifth embodiment of the heat dissipation device 1 further has a fixing member 118. One end of the fixing member 118 is correspondingly fitted through the fixing hole 111. The fixing member 118 has a hole 1181 formed with an inner thread 1182.

(26) Please refer to FIG. 9, which is a perspective view of a sixth embodiment of the heat dissipation device of the present invention. The sixth embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The sixth embodiment is different from the first embodiment in that at least one raised heated section 119 is disposed on an outer side of the main body 11 in adjacency to the fixing hole 111.

(27) Please refer to FIGS. 10 and 11. FIG. 10 is a perspective exploded view of a seventh embodiment of the heat dissipation device of the present invention. FIG. 11 is a perspective assembled view of the seventh embodiment of the heat dissipation device of the present invention. The seventh embodiment is partially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The seventh embodiment is different from the first embodiment in that the main body 11 is correspondingly attached to a substrate 2. At least one raised heated section 119 is disposed on one side of the main body 11. A heat sink 3 is connected to the other side of the main body 11 opposite to the heated section 119. The heated section 119 of the main body 11 contacts at least one heat source 21 on the substrate 2. Multiple fixing bosses 22 are arranged along a periphery of the heat source 21 of the substrate 2. Each fixing boss 22 has an inner thread 221 corresponding to the fixing hole 111. A fastening member 4 is passed through the fixing hole 111 and the inner thread 221 of the fixing boss 22 to affix the main body 11 onto the substrate 2.

(28) Please refer to FIG. 12, which is a perspective exploded view of an eighth embodiment of the heat dissipation device of the present invention. The eighth embodiment is partially identical to the seventh embodiment in structure and thus will not be repeatedly described hereinafter. The eighth embodiment is different from the seventh embodiment in that the fixing hole 111 has an inner thread 1111. The fastening member 4 is passed through the inner thread 1111 of the fixing hole 111 and the inner thread 221 of the fixing boss 22 to affix the main body 11 onto the substrate 2.

(29) Please refer to FIGS. 13 and 14. FIG. 13 is a perspective exploded view of a ninth embodiment of the heat dissipation device of the present invention. FIG. 14 is a perspective assembled view of the ninth embodiment of the heat dissipation device of the present invention. The ninth embodiment is partially identical to the seventh embodiment in structure and thus will not be repeatedly described hereinafter. The ninth embodiment is different from the seventh embodiment in that the ninth embodiment of the heat dissipation device 1 further has a fixing member 118. One end of the fixing member 118 is correspondingly fitted through the fixing hole 111 of the main body 11. The fixing member 118 has a hole 1181 formed with an inner thread 1182. The fastening member 4 is passed through the inner thread 1182 of the hole 1181 and the inner thread 221 of the fixing boss 22 to affix the main body 11 onto the substrate 2.

(30) Please refer to FIG. 15, which is a flow chart of the manufacturing method of the heat dissipation device of the present invention. Also referring to FIGS. 2 to 9, the manufacturing method of the heat dissipation device of the present invention includes steps of:

(31) S1: preparing a first board body and a second board body, a first board body 112 and a second board body 113 being prepared, the first and second board bodies 112, 113 being made of a material with good heat conductivity, such as copper material, aluminum material, stainless steel or ceramic material, in this embodiment, the material being, but not limited to, copper material for illustration purposes only;
S2: disposing at least one capillary structure and multiple support pillars on inner faces of the first and second board bodies, at least one layer of capillary structure 117 and multiple support pillars 116 being disposed on inner faces of the first and second board bodies 112, 113, which inner faces are to be mated with each other, the capillary structure 117 being selected from a group consisting of sintered powder body (as shown in FIG. 4), mesh body (as shown in FIG. 6) and channeled structure (as shown in FIG. 7), the support pillars 116 being selected from a group consisting of copper pillars and aluminum pillars, the capillary structure 117 and the support pillars 116 being connected with the first and second board bodies 112, 113 by means of a process selected from a group consisting of diffusion bonding, sintering and brazing;
S3: mating the first and second board bodies with each other to form a heat dissipation device with a chamber, vacuuming the chamber, filling a working fluid into the chamber and sealing the heat dissipation device, the first and second board bodies 112, 113 being mated and fixedly connected with each other by means of diffusion bonding or brazing to form a heat dissipation device 1 with a chamber 114, the chamber 114 being vacuumed and a working fluid 115 being filled into the chamber 114 and then the heat dissipation device 1 being sealed; and
S4: mechanically processing the first and second board bodies to form a fixing hole in a position where any support pillar is positioned, after sealed, the heat dissipation device 1 being mechanically processed to form a fixing hole 111, the fixing hole 111 being arranged in adjacency to a section of the heat dissipation device 1 for attaching to a heat source and conducting heat generated by the heat source, the fixing hole 111 being formed on the heat dissipation device 1 in a position where the support pillar 116 is positioned in the chamber 114 of the heat dissipation device 1, the fixing hole 111 passing through the main body 11 of the heat dissipation device 1 and the support pillar 116.

(32) The mechanical processing is selected from a group consisting of punching, drilling and milling. In this embodiment, the mechanical processing is, but not limited to, punching for illustration purposes only.

(33) The above embodiments are only used to illustrate the present invention, not intended to limit the scope thereof. It is understood that many changes and modifications of the above embodiments can be made without departing from the spirit of the present invention. The scope of the present invention is limited only by the appended claims.