Encapsulation film

Abstract

Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

Claims

1. An encapsulating film, comprising: a first layer comprising a resin component having a water vapor transmission rate (WVTR) of 50 g/m.sup.2.Math.day or less; and a second layer comprising a curable resin composition and having a ratio (M1/M2) of the tensile modulus (M1) at 25 C. after curing of the first layer to the tensile modulus (M2) at 25 C. after curing of the second layer of 1 10.sup.6 to 0.5, wherein the second layer is disposed on one or both surfaces of the first layer, wherein the first layer is a pressure-sensitive adhesive layer; wherein the first layer has a contact angle of 80 to 150 degrees; and wherein the WVTR is measured in a thickness direction of a layer which is formed from the resin component to have a thickness of 100m at 100 F. and a relative humidity of 100%.

2. The film according to claim 1, wherein the tensile modulus at 25 C. after curing of the first layer is 0.001 to 400MPa.

3. The film according to claim 1, wherein the tensile modulus at 25 C. after curing of the second layer is 400 to 1000 MPa.

4. The film according to claim 1, wherein the first layer further includes a moisture scavenger.

5. The film according to claim 4, wherein the first layer includes the moisture scavenger of 5 to 250 parts by weight with respect to 100 parts by weight of the resin component.

6. The film according to claim 1, wherein the second layer includes the moisture scavenger at less than 5 parts by weight with respect to 100 parts by weight of a total solid content of the second layer.

7. The film according to claim 1, wherein the second layer is a solid or semi-solid at room temperature.

8. The film according to claim 7, wherein the second layer is in a non-cured state.

9. The film according to claim 1, wherein the second layer includes the curable resin composition in a film.

10. An electronic device comprising: an upper substrate; a bottom substrate; and an encapsulating layer which includes the film of claim 1 encapsulating a diode between the upper and bottom substrates.

11. The electronic device according to claim 10, wherein the diode is formed on a surface of the bottom substrate facing the upper substrate, and the second layer of the film is in contact with the bottom substrate.

12. A method of manufacturing an electronic device, comprising: laminating the film of claim 1 on a substrate on which a diode is formed such that the second layer of the film is in contact with the diode.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic diagram of a film according to an exemplary embodiment;

(2) FIG. 2 is a schematic diagram of a film according to another exemplary embodiment;

(3) FIG. 3 is a schematic diagram of an organic electronic device according to an exemplary embodiment;

(4) FIG. 4 is a schematic diagram of an organic electronic device according to another exemplary embodiment;

(5) FIG. 5 is a schematic diagram illustrating a method of manufacturing an organic electronic device according to an exemplary embodiment; and

(6) FIG. 6 is a schematic diagram illustrating a method of manufacturing an organic electronic device according to another exemplary embodiment.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

(7) Hereinafter, a film will be described in further detail with reference to Examples and Comparative Examples, but the scope of the film is not limited to the following Examples.

(8) Hereinafter, physical properties shown in Examples and Comparative Examples are evaluated by the following methods.

(9) 1. Measurement of Tensile Modulus

(10) A resin composition was prepared by dissolving a first or second layer prepared in Example or Comparative Example in a solvent. The resin composition was coated on a base film (releasing polyester film, RS-21G, SKC) having a thickness of 38 m. Subsequently, the coated composition was dried at 110 C. for 10 minutes, and thereby a film-type layer having a thickness of 40 m was prepared. The prepared coating layer was designed to be coated in a length direction, and then cut in a size of 50 mm10 mm (lengthwidth), thereby preparing a specimen. Both terminal ends of the specimen were taped to leave 25 mm in a length direction. Subsequently, while the taped part was extended at 25 C. at a rate of 18 mm/min, a tensile modulus was measured.

(11) 2. Evaluation of Moisture Blocking Property

(12) Calcium (Ca) was deposited on a glass substrate having a size of 12 mm12 mm (lengthwidth) to have a size of 10 mm10 mm (lengthwidth). Separately, a film formed in Example or Comparative Example was cut to a size of 12 mm12 mm (lengthwidth). Subsequently, the first layer or one surface of the film was transferred to a cover glass. Afterward, an opposite surface to that of the film on which the cover glass was disposed was laminated on the calcium of the glass substrate, and thermally pressed using a vacuum press at 80 C. for 2 minutes, and cured at 100 C. for 3 hours, thereby forming an encapsulating layer. Thus, a specimen was manufactured. Then, while the specimen was maintained in a constant temperature and constant humidity chamber at 85 C. and a relative humidity of 85% for approximately 500 hours, a length of the calcium-deposited part which was oxidized and made transparent was measured. Since calcium had a total length in one direction of 10 mm, the length of the oxidized part of the calcium from one terminal end became 5 mm, which meant that all of the calcium was oxidized.

(13) 3. Evaluation of Durability and Reliability

(14) A film formed in Example or Comparative Example was laminated between soda lime glass substrates, thermally pressed using a vacuum press at 80 C. for 2 minutes, and curing the substrates at 100 C. for 3 hours, thereby forming an encapsulating layer. As a result, a specimen was prepared. Afterward, while the specimen was maintained in a constant temperature and constant humidity chamber at 85 C. and a relative humidity of 85% for approximately 500 hours, it was observed whether or not lifting occurred at an interface between the glass substrate and the encapsulating layer.

(15) 4. Evaluation of Applicability of Panel

(16) A film formed in Example or Comparative Example was cut to a size of 90 mm90 mm (lengthwidth), and a first layer or one surface of the film was transferred to a cover glass. Then, an opposite surface to that of the film on which the cover glass was disposed was thermally pressed on a glass substrate having a size of 100 mm100 mm (lengthwidth) using a vacuum press at 80 C. for 2 minutes, and cured at 100 C. for 3 hours, thereby preparing a specimen. It was observed whether or not bubbles were generated in the specimen.

EXAMPLE 1

(17) (1) Preparation of First Layer Solution

(18) A moisture scavenger solution was prepared by adding 100 parts by weight of calcined dolomite as a moisture scavenger and 0.5 parts by weight of stearic acid as a dispersing agent to a solution to have a solid content of 50 wt %, and the solution was milled by ball milling for 24 hours. In addition, separately, 70 parts by weight of a polyisobutene resin (Product Name: B100, Manufacturer: BASF) having a weight average molecular weight of 1,100,000 was added to a reaction vessel as a resin component for the first layer, and 30 parts by weight of a hydrogenated dicyclopentadiene-based resin (Product Name: SU-90, Manufacturer: Kolon) was added as a tackifier and then diluted with toluene to have a solid content of approximately 20 wt %. Afterward, an inside of the reaction vessel was substituted with nitrogen, and the prepared solution was homogenized. The previously-prepared moisture scavenger solution was added to the homogenized solution to have a content of calcined dolomite of 50 parts by weight with respect to 100 parts by weight of the resin component. Thus, a first layer solution was prepared.

(19) (2) Preparation of Second Layer Solution

(20) A second layer solution was prepared by adding 100 parts by weight of a silane-modified epoxy resin (KSR-177, Kukdo Chemical), 100 parts by weight of a bisphenol A-type epoxy resin (YD-011, Kukdo Chemical) and 80 parts by weight of a phenoxy resin (YP-50, Tohto Kasei) to a reaction vessel at room temperature, diluting the resulting mixture with methylethylketone, substituting an inside of the reaction vessel with nitrogen, homogenizing the prepared solution, adding 4 parts by weight of an imidazole (Shikoku Chemical) as a curing agent to the homogenized solution, and stirring the resulting solution at a high rate for 1 hour.

(21) (3) Formation of Film

(22) A first layer was formed to a thickness of 40 m by coating the solution of a first layer previously prepared on a release surface of releasing PET and drying the coated solution at 110 C. for 10 minutes.

(23) A second layer was formed to a thickness of 15 m by coating the solution of a second layer previously prepared on a release surface of releasing PET and drying the coated solution at 130 C. for 3 minutes.

(24) A multilayer film was formed by laminating the first and second layers.

EXAMPLE 2

(25) A first layer solution, a second layer solution and a film were prepared as described in Example 1, except that a moisture scavenger solution was added to have a content of calcined dolomite of 100 parts by weight with respect to 100 parts by weight of the resin component.

EXAMPLE 3

(26) A first layer solution, a second layer solution and a film were prepared as described in Example 1, except that a moisture scavenger solution was added to have a content of calcined dolomite of 200 parts by weight with respect to 100 parts by weight of the resin component.

EXAMPLE 4

(27) (1) Preparation of First Layer Solution

(28) A first layer solution was prepared by adding 100 parts by weight of a carboxyl-terminal end butadiene-acrylonitrile (CTBN)-modified epoxy resin (Product Name: KR-207, Manufacturer: Kukdo Chemical) and 100 parts by weight of a phenoxy resin (YP-50, Tohto Kasei) as resin components to a reaction vessel at room temperature, diluting the resulting mixture with toluene to have a solid content of approximately 20 wt %, homogenizing the prepared solution, putting 4 parts by weight of an imidazole (Shikoku Chemical) into the homogenized solution as a curing agent, stirring the resulting solution at a high rate for 1 hour, and mixing the same moisture scavenger solution as prepared in Example 1 with the resulting solution to have a content of calcined dolomite of 70 parts by weight with respect to 100 parts by weight of the resin component.

(29) (2) Preparation of Second Layer Solution

(30) A second layer solution was prepared as described in Example 1.

(31) (3) Formation of Film

(32) A film was formed as described in Example 1, except that the solution prepared in Example 4 was used as a first layer solution.

EXAMPLE 5

(33) A first layer solution, a second layer solution and a film were prepared as described in Example 4, except that 70 parts by weight of a dicyclopentadiene-based epoxy resin (DCPD) and 30 parts by weight of a maleic acid anhydride-modified isobutene copolymer (Product Name: Glissopal, Manufacturer: BASF) were used as resin components for the first layer instead of 100 parts by weight of a CTBN-modified epoxy resin.

COMPARATIVE EXAMPLE 1

(34) A second layer solution and a film were prepared as described in Example 1, except that the second layer solution in Example 1 was used as a first layer solution. However, the first layer solution prepared by adding the same moisture scavenger solution as prepared in Example 1 to the solution to have a content of calcined dolomite of 10 parts by weight with respect to 100 parts by weight of an epoxy resin was used.

COMPARATIVE EXAMPLE 2

(35) A first layer solution, a second layer solution and a film were prepared as described in Comparative Example 1, except that a moisture scavenger solution was added to have a content of calcined dolomite of 50 parts by weight with respect to 100 parts by weight of an epoxy resin.

COMPARATIVE EXAMPLE 3

(36) A first layer solution, a second layer solution and a film were prepared as described in Comparative Example 1, except that a moisture scavenger solution was added to have a content of calcined dolomite of 70 parts by weight with respect to 100 parts by weight of an epoxy resin.

COMPARATIVE EXAMPLE 4

(37) A first layer solution, a second layer solution and a film were prepared as described in Comparative Example 1, except that a moisture scavenger solution was added to have a content of calcined dolomite of 100 parts by weight with respect to 100 parts by weight of an epoxy resin.

COMPARATIVE EXAMPLE 5

(38) (1) Preparation of First Layer Solution

(39) A first layer solution was prepared as described in Comparative Example 3.

(40) (2) Preparation of Second Layer Solution

(41) A second layer solution was prepared by adding 70 parts by weight of a polyisobutene resin and 30 parts by weight of a hydrogenated dicyclopentadiene-based resin to a reaction vessel at room temperature, diluting the resulting mixture with toluene to have a solid content of 20 wt %, substituting an inside of the reaction vessel with nitrogen, and homogenizing the prepared solution.

(42) (3) Formation of Film

(43) A film was formed as described in Comparative Example 3, except that the second layer solution prepared in Comparative Example 5 was used as a second layer solution.

COMPARATIVE EXAMPLE 6

(44) (1) Preparation of First Layer Solution

(45) A first layer solution was prepared as described in Example 1, except that a moisture scavenger solution was added to have a content of calcined dolomite of 70 parts by weight with respect to 100 parts by weight of the resin component.

(46) (2) Preparation of Second Layer Solution

(47) 98 parts by weight of n-butyl acrylate (n-BA), 2 parts by weight of 2-hydroxyethyl acrylate and 100 parts by weight of ethyl acetate (EAc) as a solvent were added to a 1 L reaction vessel refluxing nitrogen gas and equipped with a cooling device to facilitate temperature control. Afterward, nitrogen gas purging was performed for 1 hour to remove oxygen, and a temperature was maintained at 60 C. 0.05 parts by weight of azobisisobutyronitrile (AIBN) and 0.01 parts by weight of n-dodecylmercaptane were further added thereto as reaction initiators to react. After the reaction, the reaction product was diluted with ethyl acetate, thereby preparing an acryl resin solution having a weight average molecular weight of 1,300,000 and a solid content of 25 wt %. A tetrafunctional epoxy compound (Product Name: BXX5627, Manufacturer: Tow Ink Mfg. Co., Ltd) was mixed as an epoxy crosslinking agent with the solution at 0.5 parts by weight with respect to 100 parts by weight of a solid content of an acryl resin solution. As a result, a second layer solution was prepared.

(48) (3) Formation of Film

(49) A film was formed as described in Example 1, except that the first solution prepared in Comparative Example 6 was used as a first layer solution, and the second layer solution prepared in Comparative Example 6 was used as a second layer solution.

COMPARATIVE EXAMPLE 7

(50) A first layer solution and a film were prepared as described in Comparative Example 6, except that the second layer solution prepared in Comparative Example 5 was used as a second layer solution.

(51) TABLE-US-00001 TABLE 1 Moisture Blocking Durability and Possibility to M1.sup.a M2.sup.b M1/M2 Property.sup.c Reliability Apply Panel EXAMPLE 1 0.68 580 0.0012 2 Good No Bubbles 2 0.68 580 0.0012 1.6 Good No Bubbles 3 0.68 580 0.0012 1.1 Good No Bubbles 4 120 580 0.0017 4.3 Good No Bubbles 5 98 580 0.1690 4.1 Good No Bubbles C. EXAMPLE 1 580 580 1 More than 5 Destroyed No Bubbles 2 580 580 1 More than 5 Destroyed No Bubbles 3 580 580 1 More than 5 Destroyed No Bubbles 4 580 580 1 More than 5 Destroyed No Bubbles 5 580 0.68 853 More than 5 Destroyed Bubbles 6 0.68 0.45 1.5111 More than 5 Good Bubbles 7 0.68 0.68 1 More than 5 Good Bubbles .sup.aTensile Modulus (Unit: MPa) of First Layer .sup.bTensile Modulus (Unit: MPa) of Second Layer .sup.cLength of calcium oxidized in one direction from one surface (Unit: mm) *C. EXAMPLE: Comparative Example