Thermal Conductivity Detector
20170030873 ยท 2017-02-02
Inventors
Cpc classification
B01L3/5027
PERFORMING OPERATIONS; TRANSPORTING
G01N27/18
PHYSICS
International classification
Abstract
A thermal conductivity detector which includes a measurement channel, an electrically heatable heating filament extending longitudinally along the center of the measurement channel so that a fluid passing through the measurement channel flows around the filament, an evaluator that detects electrical resistance changes of the heating filament and provide an output representative of the presence and amount of various fluid components passing the heating filament, and a bypass channel for bypassing the measurement channel, where the bypass channel has a lower fluidic resistance than the measurement channel and where, in order to improve the detection capability, the thermal conductivity detector further includes a flow sensor for measuring the flow of the fluid in the bypass channel and for providing an output indicative of the measured flow, and a correcting device for correcting the output of the evaluator using the output of the flow sensor.
Claims
1.-11. (canceled)
12. A thermal conductivity detector comprising: a measurement channel; an electrically heatable heating filament extending longitudinally along a center of the measurement channel such that a fluid passing through the measurement channel flows around the filament; an evaluator which detects electrical resistance changes of the heating filament and provides an output representing a presence and amount of various fluid components flowing around the heating filament; a bypass channel for bypassing the measurement channel, said bypass channel having a lower fluidic resistance than the measurement channel; a flow sensor for measuring the flow of the fluid in the bypass channel and for providing an output indicative of the measured flow of the fluid; and correcting means for correcting the output of the evaluator using an output of the flow sensor.
13. The thermal conductivity detector of claim 12, wherein the flow sensor is a thermal type flow sensor.
14. The thermal conductivity detector of claim 12, wherein the flow sensor is a time-of-flight sensor.
15. The thermal conductivity detector of claim 13, wherein the flow sensor is a time-of-flight sensor.
16. The thermal conductivity detector of claim 12, wherein the bypass channel has a larger inner width than the measurement channel.
17. The thermal conductivity detector of claim 12, wherein the bypass channel has a shorter length than the measurement channel.
18. The thermal conductivity detector of claim 12, wherein the measurement channel and the bypass channel branch out asymmetrically from a common fluid delivery channel.
19. The thermal conductivity detector of claim 18, wherein the fluid delivery channel continues straight into the bypass channel.
20. The thermal conductivity detector of claim 12, further comprising: at least one particle filter arranged upstream of the heating filament, the at least one particle filter comprising a channel section of reduced cross-section of the measurement channel and a retaining bar diametrically traversing the channel section.
21. The thermal conductivity detector of claim 20, further comprising: at least one further particle filter arranged upstream of the flow sensor, the further particle filter comprising a channel section of reduced cross-section of the bypass channel and a retaining bar diametrically traversing the channel section.
22. The thermal conductivity detector of claim 12, wherein the thermal conductivity detector is a MEMS (Micro-Electro-Mechanical System) based device.
23. A gas chromatograph comprising at least one thermal conductivity detector of claim 12.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The invention will now be described by way of example and with reference to the accompanying drawing, in which:
[0021]
[0022]
[0023]
[0024]
[0025]
DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
[0026]
[0027]
[0028] A heating filament 7 is suspended longitudinally along the center of the measurement channel 6 between two electrically conductive supporting arms 16 and 17, which are formed on the side of the plate containing the grooves and which intersect the measurement channel 6. The supporting arms 16 and 17 end in contact pads 18 and 19, which are disposed on the carrier plate 10 in a region that is not covered by the plate 11. A temperature sensing filament is located in the wall of the measurement channel 6 and connected to further contact pads 21 and 22. The heating filament 7 and the temperature sensing filament 20 are, via their respective contact pads 18, 19, 21, 22, connected to the evaluation device 8 which determines the presence and amount of a substance passing the heating filament 7 from the heat flow from the heating filament 7 to the wall of the measurement channel 6. The heat flow, for its part, is determined from an amount of energy that is supplied to the heating filament 7 and is controlled to keep the difference between the temperature of the heating filament 7 and the wall temperature measured by the temperature sensing filament 20 at a constant value.
[0029] The inlet flow of a fluid 23 coming from, e.g., the separating device 4 of
[0030] For that purpose, a thermal time-of-flight flow sensor 24 is provided in the bypass channel 13. The thermal time-of-flight flow sensor 24 comprises several single or multiple folded conductive filaments 25, 26, 27, 28, 29 which are, preferably evenly, distributed along the bypass channel 13 and each cross the bypass channel 13. The outer filaments 25 and 29 are connected in series between two contact pads 30 and 31. The inner filaments 26-28 are also connected in series between two contact pads 32 and 33. The flow sensor 24 is based on the time-of-flight of a thermal pulse which is generated by the outer filaments 25 and 29, more exactly by one of the outer filaments that is situated upstream in the flow direction. To this end, the outer filaments 25 and 29 are, via their contact pads 30 and 31, connected to an electrical pulse generator 34. The time-of-flight of the generated thermal pulse is measured via at least one of the inner 15 sensing filaments 26, 27, 28. To this end, the inner filaments 26, 27, 28 are via their contact pads 32 and 33, connected to a resistance measurement circuit (ohmmeter) 35. The electrical pulse generator 34 and the resistance measurement circuit 35 are connected to a computing unit 36 that synchronizes generation and detection of the heat pulses and provides an output 37 indicating the flow in the bypass channel 13. This output 37 is provided to correcting means 38 in the evaluation device 8 for correcting the measurement of thermal conductivity, i.e., for correcting the measuring value of the amount of a substance passing the heating filament 7.
[0031] As described so far, the thermal flow sensor 24 is preferably based on the thermal time-of-flight principle that allows for measuring the flow unaffected by temperature, composition, thermal conductivity and viscosity of the fluid. If the flow sensor is of another type, such as an anemometric or calorimetric type, its output may be corrected by using the temperature measured by the temperature sensing filament 20 or another temperature sensor and/or using the thermal conductivity measured in the measurement channel 6.
[0032]
[0033]
[0034]
[0035] In another exemplary embodiment of the thermal conductivity detector 5 (here only plate 10), which mainly differs from that of
[0036] Thus, while there have been shown, described and pointed out fundamental novel features of the invention as applied to a preferred embodiment thereof, it will be understood that various omissions and substitutions and changes in the form and details of the devices illustrated, and in their operation, may be made by those skilled in the art without departing from the spirit of the invention. For example, it is expressly intended that all combinations of those element steps which perform substantially the same function in substantially the same way to achieve the same results are within the scope of the invention. Moreover, it should be recognized that structures and/or elements shown and/or described in connection with any disclosed form or embodiment of the invention may be incorporated in any other disclosed or described or suggested form or embodiment as a general matter of design choice. It is the intention, therefore, to be limited only as indicated by the scope of the claims appended hereto.