Alkaline pickling process

Abstract

A process for edge isolation or texture smoothing of a substrate, in which a process medium which allows control treatment of limited regions of the substrate is used. The process is therefore particularly suitable for one-sided treatment of substrates. The viscosity of the process medium plays a central role here. Furthermore, an apparatus designed for the process is presented.

Claims

1. A method for etching a semiconductor substrate comprising the step of: contacting the substrate with a process medium which is provided in a process tank, wherein the substrate is transported such that it is moved in a plane which is oriented substantially in parallel direction to the surface of the process medium, and wherein the process medium comprises at least one alkaline and at least one viscosity-increasing component and has a pH value of higher than 12 and a viscosity of at least 1.5 mPas, and in that the substrate is contacted with the process medium only on one side, wherein on one side means that in the case of a flat substrate, such as a wafer, one of both main sides, thus the front side or the back side, is not contacted with the process medium.

2. The method according to claim 1, wherein the process medium comprises the viscosity-increasing component in a proportion of at least 3% by weight.

3. The method according to claim 1, wherein the process medium comprises at least one oxidant, in particular selected from peroxodisulfates or peroxomonosulfates.

4. The method according to claim 1, wherein before the step of contacting the substrate with the process medium, including conducting a step of emitter etching.

5. The method according to claim 1, wherein the viscosity-increasing component comprises polyhydric alcohols, inorganic salts, and mixtures thereof.

6. The method according to claim 5, wherein the viscosity-increasing component comprises silicates, phosphates, or sulfates, or mixtures thereof.

7. The method according to claim 1, wherein the alkaline component is used in the process medium in a proportion of 0.1 to 15% by weight.

8. The method according to claim 1, wherein the substrate before the step of contacting with the process medium is treated with diluted hydrofluoric acid for removing glass or oxides on the surface of the substrate.

9. The method according to claim 1, wherein the process medium is provided in a process tank, the substrate is moved relatively to the process tank and the back edge of the substrate is lifted at an outlet of the process tank.

10. The method according to claim 1, wherein the viscosity of the process medium is higher than 1.75 mPas.

11. The method according to claim 1, wherein the viscosity of the process medium is not higher than 10.sup.3 mPas.

12. The method according to claim 1, wherein the alkaline component is selected from organic and inorganic bases.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Description of the Drawings

(1) FIG. 1 shows an apparatus of prior art. A substrate 1 is moved over a process medium 5 by shafts of support 2 in such a manner that this medium comes in contact with substrate 1. The filling level 11 of the process medium 5 is selected such that a meniscus 10 is formed. Therefore, a respective method is also called meniscus etching. When an acidic process medium which normally contains nitric acid (HNO3) is used, NOx vapors 6 are produced which form a gas atmosphere 7 as a toxic by-product.

(2) FIG. 2 illustrates the method of film etching which is known from prior art. Between closed massive shafts with profile pattern 4 and a substrate 1 a film 8 of the process medium 5 is formed.

(3) FIG. 3a shows meniscus etching with an alkaline process medium. Meniscus 10 is shown. The substrate 1 is moved by shafts of support 2. Below substrate 1 hydrogen gas bubbles are formed.

(4) FIG. 3b shows an apparatus with a closed massive shaft 3 at the outlet of the process tank. The substrate 1 is moved by shafts of support 2 and closed massive shafts 3 into the direction of the outlet of the process tank.

(5) FIG. 3c shows that in the case of the use of an apparatus with a closed massive shaft 3 at the outlet of the process tank there is the risk that through bursting gas bubbles process medium may reach the upper side of the substrate.

(6) FIG. 4a shows an apparatus according to the present invention with shafts of transport which are placed outside of the process tank. In addition a barrier 9 is shown the upper edge of which is arranged in a lower position than the filling level of the process tank. The shafts of transport outside the process tank have a smaller diameter than the shafts of support 2 and the closed massive roll 3, their axes of rotation are arranged at the same height as that of the shafts of support 2 and the closed massive shaft 3. So the substrate 1 at the outlet of the process tank is lifted at the back edge. Thus, the risk of a contamination of the upper side of the substrate through bursting gas bubbles is prevented.

(7) FIG. 4b shows a similar principle with the difference that the shafts of transport outside the process tank have indeed nearly the same diameter as the shafts of support 2 and the closed massive shaft 3, but their axes of rotation are arranged in a lower position than that of the shafts of support 2 and that of the closed massive shaft 3.

(8) FIG. 5 shows an apparatus with a barrier 9 at the outlet of the process tank. The upper rim of the barrier 9 is arranged lower than the filling level of the process tank. The last shaft of support 2 before barrier 9 is not designed as a closed massive shaft so that the gas bubbles can drain away under the substrate.

DETAILED DESCRIPTION OF THE INVENTION

(9) The process medium has an alkaline pH value for etching the substrate. During etching a part of the substrate is removed from its surface. For adjusting the alkaline pH value, the process medium preferably contains at least one alkaline component. The alkaline pH value of the process medium facilitates processing of the substrate without the formation of any hazardous vapors.

(10) An alkaline process medium has the advantage that no etching vapors are formed and that the solution is not toxic and not hazardous. The only reaction product which is formed is hydrogen, and the gas phase would only contain water vapor in addition. In the case of the use of an alkaline process medium the evolution of gas is higher than in the case of the use of an acidic medium. To deal with this issue, apparatus modifications are made at the apparatus according to the present invention.

(11) Preferably, the concentration of the alkaline component is in the range of at least 0.1% by weight, based on the process medium. Further preferable are at least 0.5% by weight and particularly preferable are at least 3% by weight. When the concentration of the alkaline component exceeds a certain value, then no further increase of the etching rate can be achieved. Therefore, the content of the alkaline component is preferably at most 50% by weight, further preferably at most 25% by weight, based on the process medium. Particularly preferable are at most 15% by weight.

(12) The alkaline component is preferably selected from organic and inorganic bases as well as mixtures thereof. Preferable bases are hydroxides, in particular metal hydroxides, and amino derivatives. Preferable metal hydroxides are alkali metal hydroxides, in particular sodium hydroxide and potassium hydroxide as well as mixtures thereof. Preferable amino derivatives are ammonia, tetraalkylammonium hydroxide and amines as well as mixtures thereof. These alkaline components are further characterized by the advantage that their price is much lower than that of hydrofluoric acid.

(13) The tendency to creeping of the alkaline process media which are used in this invention is higher than in the case of acidic process media, in particular onto textured and doped silicon surfaces. Therefore, according to the present invention preferably at least one viscosity-increasing substance is used in the process medium. The viscosity-increasing substances reduce the tendency of the process medium to creep at sites of the substrate which should not be etched. It must be guaranteed that the viscosity-increasing substances do not modify the etching reaction, in particular do not or do not substantially slow down the etching reaction, so that the required layer removal, normally 1 to 2 m, could be achieved by etching within industrially practicable process times.

(14) The viscosity-increasing substances may be organic or inorganic substances. Also mixtures of organic and inorganic substances can be used. Preferable viscosity-increasing substances are inorganic salts such as in particular silicates, phosphates and sulfates as well as mixtures thereof.

(15) Further preferable viscosity-increasing substances are polyalcohols, such as in particular ethylene glycol, diethylene glycol, 1,2-propanediol, glycerin, sorbitol and ordinary sugars such as glucose, fructose and their combinations. Thus, preferable viscosity-increasing substances are polyhydric alcohols. In particular ethylene glycol, 1,2-propanediol, glycerol and sorbitol have shown to be particularly effective, even in the case, when the surfaces of the substrates have hydrophilic properties. It was shown that polyalcohols with less than 4, in particular less than 3 hydroxyl groups are particularly advantageous. These polyalcohols have only a negligible influence on the etching process.

(16) Ethylene glycol and 1,2-propanediol do not influence the etching rate of the process medium, also in the case of high concentrations. With glycerin and sorbitol already a reduction of the etching rate which depends on the concentration can be seen, but it is very low and can be controlled very easily.

(17) Many organic long-chain substances have an excellent viscosity-increasing effect, but they strongly inhibit the reaction rate. At moderate process temperatures in the range of e.g. 50 to 60 C. the etching rate is reduced to one-tenth or less in comparison to a solution which contains only an alkaline component. Therefore, such long-chain molecules cannot be used in the method according to the present invention and are preferably not present in the process medium or their proportion in the process medium should be very low, in particular not higher than 5% by weight, further preferably not higher than 1% by weight, more preferably not higher than 0.5% by weight and particularly preferably not higher than 0.1% by weight.

(18) Preferably, the viscosity-increasing substances according to the present invention have high boiling points which are higher than 100 C.

(19) The viscosity-increasing substances are preferably substances with low molecular weight, in particular no polymers. The upper limit of the molecular weight of the viscosity-increasing substances is preferably at most 1,000 g/mol, more preferably at most 500 g/mol and particularly preferably at most 200 g/mol. It was shown that it is possible that additives with higher molecular weight may hamper, i.e. inhibit the etching process very strongly.

(20) Silicates which can be used as a viscosity-increasing component according to the present invention are formed besides hydrogen in the course of the etching reaction of silicon substrates according to the following chemical equation, exemplified with sodium hydroxide as the alkaline component:
Si+2NaOH+H2O.fwdarw.Na2SiO3+2H2

(21) In order that the increase of the viscosity of the process medium is sufficient for the method according to the present invention, a relatively high concentration of silicate is required, normally at least 50 g/L. For producing this concentration of silicate only through the etching reaction, a high throughput and a respective process management is required. The required concentration of silicate will be achieved in an industrial production process at the earliest after a throughput of ca. 30,000 silicon substrates. This corresponds to the production volume of one day of a common production line for wafers. Therefore, according to the present invention it is necessary that silicate as a viscosity-increasing component is directly added to the process medium at the beginning of the process, when it is used as the viscosity-increasing substance. The high concentration of silicate is then maintained by a respective process management.

(22) In preferable embodiments the process medium consists of water, at least one viscosity-increasing substance, at least one alkaline component and at most 10% by weight, further preferably at most 5% by weight and particularly preferably at most 1% by weight of other ingredients.

(23) It is in fact known to use organic additives for the modification of the course of etching in alkaline solutions. One field of application is the texture of silicon wafers.

(24) Mostly, the texture additives are substances with high molecular weight, and they have a strongly inhibiting effect onto the etching reaction, already in small concentrations in the order of 1 g/L. At the moderate process conditions of the present invention no appreciable and no practicable etching would take place. The process temperature of the texturing process is typically in the range of 80 to 95 C., the time of contact is 10 to 30 minutes. Ca. 10 micrometers of silicon on each wafer side are removed by etching.

(25) The purpose of the texture additives is to moderate and to modify the etching reaction such that the surface of monocrystalline wafers is back-etched in an anisotropic but homogenous manner and that a macroscopically uniform surface structure with desirable pyramid size is formed.

(26) Also additives with smaller molecular size such as ethylene glycol, sorbitol and other polyalcohols (C4-C18) are mentioned. Mostly, these additives are used together with isopropanol, and they are capable of positively influencing the anisotropic etching reaction with respect to the homogeneity of back-etching.

(27) Also organic additives are used as organic moderators in alkaline emitter etching solutions, such as described in DE 10 2011 505 903 A1. Here the inhibiting effect of the additives is used. Only few nanometers are removed from the emitter by etching, the strongly doped topmost layer is removed. At 50 C. and with a contact time of 1 minute a layer with a thickness of less than 3 nm is removed by etching. Solutions with etching rates which are so low are not practicable for the process according to the present invention which requires an etching removal of in particular 1 to 2 m. Both, the texture as well as the etching of the emitter are generally conducted in an immersion process.

(28) For the method of the present invention it is required that the process medium facilitates high etching rates together with relatively mild conditions.

(29) The concentration of the viscosity-increasing substances is preferably in the range of at least 3% by weight, based on the process medium. Further preferable are at least 5% by weight and particularly preferable are at least 10% by weight. At concentrations which are higher than a distinct concentration of the viscosity-increasing substance the increase of the viscosity would not result in further advantages. Therefore, the content of the viscosity-increasing substance is preferably at most 50% by weight, further preferably at most 35% by weight, particularly preferably at most 25% by weight, based on the process medium. Further preferable are at most 15% by weight.

(30) As an additional component in the process medium preferably at least one oxidant is used for preventing additional roughening of the substrate during the method which may be caused by the alkaline process medium. Suitable are oxidants which do not or not substantially reduce the etching rate of the process medium at the preferable process conditions, at least in certain concentration ranges.

(31) Suitable oxidants are persulfates and hypochlorites. Sodium persulfate is preferably used. Preferable oxidants are peroxodisulfates and peroxomonosulfates. The concentration is preferably in the range of 5 to 35 g/L and in particular up to 20 g/L. At higher concentrations of sodium persulfate the etching rate is reduced strongly. Other oxidants such as hydrogen peroxide or percarbonates inhibit the etching reaction already in very small concentrations, such as 1 g/L. Therefore, they are preferably not used. Preferably, the process medium is an aqueous one, i.e. water is used as a solvent.

(32) With a longer contact time of the substrate and a process medium which also contains an oxidant, i.e. in the case of higher amounts of etching removal such as for example 3 m, the surface of the substrate is smoothened by the process medium.

(33) A preferable process medium contains the following components in the given proportions: alkaline component 0.5 to 50% by weight, viscosity-increasing substance 2 to 50% by weight and oxidant 0.5 to 10% by weight.

(34) The balance may be a solvent, in particular water, and/or may comprise further alkaline components as well as viscosity-increasing substances.

(35) Preferably, the substrate is a semiconductor substrate, in particular made of silicon, in particular a silicon wafer. The substrate has an upper side and a lower side. The terms upper side and lower side refer to the orientation of the substrate in the apparatus during the method, wherein preferably the upper side is the front side of a solar cell, respectively its emitter side. The lower side is the side facing the process tank. The upper side is the side facing away from the process tank.

(36) The substrate is preferably contacted with the process medium on one side. On one side or one-sided means that in the case of a flat substrate, such as a wafer, one of both main sides, thus the front side or the back side, is not contacted with the process medium. Main sides are the two sides of the substrate which in comparison to the other sides of the substrate have the largest surface areas.

(37) The used substrate already comprises a texture and can also already comprise an emitter. The method according to the present invention is not a texture method and not an emitter etching method. Preferably, the substrate is a crystalline silicon substrate which is preferably mono-or polycrystalline.

(38) The substrate may comprise a glass layer on the surface due to the emitter doping which is preferably conducted before the step of contacting with the process medium according to the present invention. Preferably, before the step of contacting of the substrate with the process medium this glass is removed, preferably in diluted HF solution, in particular in an immersion process. Thus, before the step of contacting of the substrate with the solution, preferably the substrate is treated with HF solution. The surface of the wafer directly after the treatment with HF is hydrophobic which in addition reduces creeping of the solution.

(39) In preferable embodiments, before the step of contacting with the process medium, the substrate is treated with HF solution only on one side, so that on the other side, in particular the upper side, the protecting glass layer is preserved.

(40) In an alternative, before the step of contacting of the substrate with the process medium a step of back-etching of the emitter may be conducted. For the step of back-etching of the emitter an alkaline solution, such as for example described in DE 10 2011 050 903 A1, can be used, wherein before the glass has to be removed in diluted hydrofluoric acid. Also an acidic HF-containing emitter etching solution, such as for example described in DE 10 2011 050 136 A1, can be used. In this case the dissolution of the glass and the step of back-etching of the emitter can be conducted in one process step.

(41) The apparatus for conducting the method according to the present invention comprises a process tank. During the method the process tank contains the process medium.

(42) The apparatus preferably comprises at least one means for transporting the substrate during the method. Preferable means of transport are rolls, shafts and rollers, with which the substrate is moved into one transport direction (FIG. 1 shows the principle). Normally, the apparatus comprises several means of transport.

(43) Here the means of transport can be designed in the form of closed massive cylinders, in particular in the form of closed massive shafts being arranged at right angles to the transport direction. During the course of transport the lower side of the substrate over the whole width of the substrate is periodically in contact with the closed massive roll. In an alternative the closed massive roll may have a smooth or preferably a serrated or structured (with profile pattern) surface.

(44) On the other hand, the means of transport may also be designed in the form of a cylinder with a discontinuous cladding. During the course of transport then the lower side of the substrate is periodically in contact with the shaft only at few parts of the width of the substrate (at the so-called points of support). Therefore, the shafts are also called shafts of support.

(45) For film etching closed massive shafts with suitable profile pattern are used. The process solution is transported to the lower side of the substrate only by the profile pattern of the shaft. Gaseous reaction products can directly escape into the process compartment below and above the substrate. By increasing the filling level of the process medium in the process tank also the meniscus etching can be realized with this kind of shafts. In this case periodically the lower side of the substrate on its whole width is contacted with the shafts. Possible gas bubbles adhering at the lower side (produced by the etching reaction) are shoved by the closed massive shaft to the edge of the wafer which lags behind and then they escape into the process compartment, wherein however splashes of the process medium can reach the upper side of adjacent substrates and can impair the emitter.

(46) For meniscus etching normally shafts of support are used. Since the lower side of the substrate is only contacted with the transport shafts at few points of support, the gas bubbles being formed during the course of the etching process are entrained over the whole length of the process tank.

(47) Preferably, during the method the substrate is transported such that it is moved in one plane which is oriented in parallel direction to the surface of the process medium (transport plane). But in a preferable embodiment at the outlet of the process tank the substrate is transported such that the back edge of the substrate is lifted. With the lifting of the back edge of the substrate it can be prevented that the gas bubbles accumulated at the lower side of the substrate burst.

(48) The back edge of the substrate is the portion of the substrate which last leaves the process tank as a result of the transport of the substrate. The outlet of the process tank is the side of the process tank at which the substrate is taken out from the process tank.

(49) In the case of a process tank with closed massive rolls at the inlet and the outlet, the accumulated gas bubbles which may be produced by the reaction of alkaline component with substrate would be shoved at the outlet roll to the back edge and would burst there. Splashes of the process medium would reach the upper side of the substrate and would etch the emitter (see FIGS. 3b and 3c). In a preferable embodiment the means of transport which is nearest to the outlet of the process tank is not a closed massive roll, but preferably a shaft of support.

(50) With the design of the apparatus according to the present invention etching of the upper side of the substrate can be prevented. According to the present invention the means of transport after the process tank are arranged in such a manner that the edge which lags behind respectively the back edge of the substrate is lifted, before this edge passes the last means of transport before the outlet. This for example can be realized by means of transport with smaller diameters, i.e. after the process tank the substrate is allowed to subside; or by means of transport which are arranged in a lower position than the means of transport above the process tank (see FIGS. 4a and 4b).

(51) A smaller diameter of the means of transport should be compensated by a respective transmission ratio of the power unit, so that the wafers are transported with constant speed. In an alternative means of transport with the same diameter as in the process tank can be arranged in a lower position. In this case the power unit should also be adjusted.

(52) In an alternative the closed massive roll at the outlet of the process tank can be replaced by a roll of support. The boundary of the process tank at the outlet is preferably arranged in a lower position than the transport plane of the wafers so that the solution at the edge which is in front drains away and sweeps the gas bubbles away (see FIG. 5).

(53) The water vapor produced in the process compartment should be withdrawn by suctioning in an effective way for preventing a fast oxidation, i.e. increasing the hydrophilicity of the surface. Thus, preferably means for withdrawing the water vapor by suctioning are provided.

(54) The apparatus is preferably designed such that the transport plane is arranged higher than the filling level of the process medium, wherein this difference is at least 0.5 mm and at most 50 mm. But the transport plane may be arranged at the same height than the filling level of the process medium (distance 0 mm). The substrate may also be slightly immersed into the process medium. But it is important that the level of the process medium is not higher than the upper edge of the substrate so that its upper side is not wetted by the process medium. The transport plane is limited on the one hand by the lower side of the substrate and on the other hand by the sites of contact of the substrate with the means of transport. So in the region of the process tank it is oriented substantially in parallel direction to the surface of the process medium.

(55) The process temperature is preferably at least 30 C., further preferably at least 40 C. and particularly preferably at least 50 C. A temperature which is too low compromises the etching rate of the process medium. Nevertheless, the process temperature should not be too high so that an economic process can be realized. Therefore, the process temperature is preferably limited to at most 95 C., further preferably at most 80 C. and particularly preferably at most 70 C.

(56) The contact time of the substrate with the process medium is preferably at least 0.25 minutes, further preferably at least 0.5 minutes and particularly preferably at least 1 minute. The correct contact time results in the desired removal at the substrate. Therefore, the contact time is preferably limited to at most 10 minutes, further preferably at most 7 minutes and particularly preferably at most 5 minutes.

(57) The method is in particularly conducted such that the selection of the process temperature and the contact time results in a removal at the substrate of preferably at least 0.5 m and further preferably at least 1 m. But the removal should not exceed a value of preferably 5 m, further preferably 3 m and particularly preferably 2 m.

(58) During the course of the method hydrogen is produced which accumulates at the lower side of the substrate in the form of gas bubbles. In the case that the process medium is in continuous contact with the substrate (meniscus etching with shafts of support) the major part of the gas bubbles adheres at its lower side and they are entrained to the end of the process tank.

(59) Also according to the present invention is the use of the process medium which is described here for edge isolation of substrates which are described here.

EMBODIMENT EXAMPLES

Example 1

(60) Determination of the Etching Rate of Diffused Silicon Wafers in Alkaline Solution with Viscosity-Increasing Substances

(61) Monocrystalline substrates of the p-type were textured with alkali and purified. Thereafter on both sides an emitter was formed in a tube diffusion process with POCl3 as doping source. The emitter depth was nearly 0.5 m. For the removal of phosphorus silicate glass the wafers were treated in diluted hydrofluoric acid so long until the surface has become hydrophobic, and subsequently they were rinsed and dried. The wafers were etched in a laboratory-scale arrangement (in a beaker glass) in solutions with 15 g/L NaOH and the respective additive for 2 minutes each at 55 to 58 C.

(62) TABLE-US-00001 TABLE 1 viscosity-increasing substances which can be used in the process according to the present invention. Concentration Additive (mL/L) Etching rate (m/min) no additive 0.5 soda water glass* 100 mL/L 0.38 soda water glass* 200 mL/L 0.36 soda water glass* 300 mL/L 0.32 ethylene glycol 100 mL/L 0.51 ethylene glycol 250 mL/L 0.52 ethylene glycol 500 mL/L 0.46 diethylene glycol 100 mL/L 0.35 diethylene glycol 200 mL/L 0.18 glycerol 100 mL/L 0.47 glycerol 250 mL/L 0.33 sorbitol 100 g/L 0.50 sorbitol 250 g/L 0.11 *soda water glass contains (as a calculated amount) 700 to 750 g/L of sodium silicate Na2SiO3.

Example 2

(63) Determination of the etching rate of diffused silicon wafers in alkaline solution with organic additives with higher molecular weight. These additives can increase the viscosity of the solution, but are not practicable for the process according to the present invention due to the strongly reduced etching rate.

(64) TABLE-US-00002 TABLE 2 etching rates of additives with higher molecular weight Etching rate Additive Concentration (mL/L) (m/min) no additive 0.5 polyethylene glycol 400 50 mL/L 0.07 polyvinylpyrrolidone K30 5 g/L 0.05 hydroxyethylcellulose 1 g/L 0.05 polyvinylalcohol 0.5 g/L 0.04 sodium dodecyl benzene sulfonate 1 g/L 0.05

Example 3

(65) Creeping Behavior of a Solution with and without Glycerol as the Viscosity-Increasing Additive

(66) Wafer sections after diffusion and HF dip were immersed into an alkaline solution with 15 g/L NaOH respectively into a solution with 15 g/L NaOH and 250 mL/L glycerin up to a height of about 1 cm in vertical direction and were etched for 2 minutes at 55-60 C. After rinsing and drying the etched area can be identified by discoloration and modified surface.

(67) A wafer section which has been immersed into the solution with 15 g/L NaOH was uniformly etched up to the immersion height and it was further nonuniformly etched up to 4 mm above the immersion height by creeping of the solution.

(68) A wafer section which has been immersed into the solution with 15 g/L NaOH and 250 mL/L glycerin was uniformly etched up to the immersion height and only minimally beyond that, less than 1 mm.

Example 4

(69) Monocrystalline wafers with Full A1 BSF, KI solution with glycerol

(70) Processsequence Full A1 BSF

(71) 1. Alkaline texture

(72) 2. Purification

(73) 3. Diffusion

(74) 4. Etching sequence i. Diluted hydrofluoric acid ii. Edge isolation iii. Emitter etching iv. Purification (diluted hydrofluoric acid)

(75) 5. Antireflection coating of the front side

(76) 6. Screen process metallization

(77) 7. Sintering

(78) The standard edge isolation with HF/HNO3 solution was conducted in a horizontal facility. The solution according to the present invention was horizontally conducted in a laboratory-scale arrangement in a glass bowl. The wafers were carefully placed on a support apparatus in such a manner that a meniscus to wafer edges was formed and that the lower side of the wafer was in contact with the etching solution.

(79) Process medium: 15 g/L NaOH and 250 mL/L glycerol; contact time 120 s; temperature 55 C.; etching removal: 0.8 m

(80) TABLE-US-00003 TABLE 3 results, measured values of single wafers Contact Removal time Voc Jsc eta Edge isolation m s mV mA/cm2 FF % NaOH + glycerol 0.8 120 0.626 37.36 0.797 18.65 NaOH + glycerol 0.8 120 0.626 37.50 0.799 18.75 HF/HNO3 2 100 0.626 37.38 0.797 18.66 HF/HNO3 2 100 0.625 37.33 0.798 18.64

Example 5

(81) Production of cells with the edge isolation process according to the present invention, type meniscus etching, in comparison to the edge isolation according to prior art with an etching solution on the basis of HF/HNO3; monocrystalline cells of the p-type with aluminumBack Surface Field.

(82) Processsequence Full A1 BSF

(83) a. Alkaline texture

(84) b. Purification

(85) c. Diffusion

(86) d. Etching sequence i. Diluted hydrofluoric acid ii. Edge isolation iii. Emitter etching iv. Purification (normally diluted hydrofluoric acid)

(87) e. Antireflection coating of the front side

(88) f. Screen process metallization

(89) g. Sintering

(90) Test Group 1 (Comparative Example):

(91) The edge isolation was conducted by means of film etching with a process medium of nitric acid and hydrofluoric acid. The edge isolation was conducted with phosphorus silicate glass, i.e. process step d.i. was conducted after process step d.ii. Other processes were unchanged and were the same as in test group 2.

(92) Throughput speed 1.2 m/min; contact time 100 s; temperature 20 C.; etching removal: 2 m

(93) Test Group 2:

(94) The edge isolation was conducted as a one-sided alkaline process in a horizontal facility, after removal of phosphorus silicate glass from the diffusion in diluted HF. The process tank has been configured for meniscus etching, i.e. for the transport of the wafers shafts of support were used, the level of the liquid was adjusted to few millimeters below the plane of the wafer transport. At the inlet and at the outlet of the process tank closed massive rolls with profile pattern were used. After the process tank shafts of transport with decreasing diameter were used so that the wafer edge which lags behind is lifted at the outlet. The process tank arrangement is shown in FIG. 4a.

(95) Process medium: 30 g/L NaOH and 85 mL/L soda water glass; throughput speed 0.5 m/min; contact time 200 s; temperature 58 C.; etching removal: 0.7 m

(96) TABLE-US-00004 TABLE 4 results, mean values of 4 to 5 cells each. R.sub.sheet Removal ohm/ Voc Jsc Eta I02Lf Group m square mV mA/cm2 FF % A 1 2.0 70 0.634 37.39 0.783 18.56 9 2 0.7 65 0.633 37.32 0.789 18.64 6

Example 6

(97) Production of PERC Cells with Alkaline Edge Isolation, Glass Removal on Both Sides or on One Side

(98) ProcessSequence for Cells with Passivated Back Side (Passivated Emitter and Rear Cells)

(99) a. Alkaline texture

(100) b. Smoothing of back side by etching (optional)

(101) c. Purification

(102) d. Diffusion

(103) e. Etching sequence i. Dilution hydrofluoric acid ii. Edge isolation iii. Emitter etching iv. Purification (mostly diluted hydrofluoric acid)

(104) f. Deposition of dielectric passivating layers onto the back side such as silicon oxide, aluminum oxide, silicon nitride

(105) g. Antireflection coating of the front side (also before process step f., when possible)

(106) h. Screen process metallization

(107) i. Sintering

(108) Starting material: monocrystalline wafers, doped with boron, specific resistance 4.1 ohm cm. The wafers were processed according to the PERC sequence. Process step b. was omitted.

(109) Test Group 1

(110) Reference Group; Edge Isolation According to Prior Art

(111) The edge isolation was conducted by means of film etching with a process medium of nitric acid and hydrofluoric acid. The edge isolation was conducted with phosphorus silicate glass, i.e. process step e.i. was conducted after process step e.ii. Other processes were unchanged and were the same as in test groups 2 and 3.

(112) Test Group 2

(113) The edge isolation was conducted as a one-sided alkaline process in a horizontal facility. Before the phosphorus silicate glass from the diffusion was removed in diluted HF in an immersion process. The process tank has been configured for film etching, i.e. for the transport of the wafers closed massive shafts with profile pattern were used, the level of the liquid was adjusted to ca. 15 millimeters below the plane of the wafer transport. At the inlet and at the outlet of the process tank also suitable closed massive rolls with profile pattern were used.

(114) Process medium: 50 g/L NaOH and 85 mL/L soda water glass and 5 g/L sodium peroxodisulfate; throughput speed 0.5 m/min; contact time 100 s; temperature 60 C.; etching removal: 1.3 m

(115) Test Group 3

(116) The process sequence was slightly changed. Process step e.i. was conducted only on one side. After the alkaline edge isolation the wafers were aftertreated in diluted hydrofluoric acid in the immersion process.

(117) e. Modified etching sequence i. Diluted hydrofluoric acid on one side (on the back side) ii. Edge isolation and subsequently diluted hydrofluoric acid in the immersion process (on both sides) iii. Emitter etching iv. Purification (diluted hydrofluoric acid)

(118) Process medium: 50 g/L NaOH and 85 mL/L soda water glass and 5 g/L sodium peroxodisulfate; throughput speed 0.5 m/min; contact time 150 s; temperature 60 C.; etching removal: 1.3 m

(119) TABLE-US-00005 TABLE 5 results, mean values of 4 to 5 cells each. Removal Contact time Voc Jsc Eta Group m s mV mA/cm2 FF % 1 2.0 100 0.644 38.93 0.772 19.27 2 1.2 150 0.643 38.81 0.772 19.24 3 1.3 150 0.642 38.86 0.771 19.26

Example 7

(120) Production of PERC Cells with Alkaline Edge Isolation, with Different Etching Removals and Different NaOH Concentrations.

(121) Processsequence for cells with passivated back side (passivated emitter and rear cells)

(122) a. Alkaline texture

(123) b. Smoothing of back side by etching (optional)

(124) c. Purification

(125) d. Diffusion

(126) e. Etching sequence i. Diluted hydrofluoric acid ii. Edge isolation iii. Emitter etching iv. Purification (mostly diluted hydrofluoric acid)

(127) f. Deposition of dielectric passivating layers onto the back side such as silicon oxide, aluminum oxide, silicon nitride

(128) g. Antireflection coating of the front side (also before process step f., when possible)

(129) h. Screen process metallization

(130) i. Sintering

(131) TABLE-US-00006 TABLE 6 measured values, mean values of 5-6 cells Sodium Edge NaOH NWG* peroxodisulfate Removal Voc Jsc Eta isolation g/L ML/L g/L m mV mA/cm2 FF % Standard HF/HNO.sub.3 2.0 0.641 38.55 0.784 19.37 Alkaline 50 80 15 1.0 0.642 38.66 0.779 19.33 Alkaline 50 80 15 3.1 0.642 38.73 0.779 19.39 Alkaline 100 80 15 1.6 0.641 38.63 0.783 19.39 *soda water glass contains (as a calculated amount) 700 to 750 g/L of sodium silicate Na2SiO3

Example 8

(132) TABLE-US-00007 TABLE 7 Measurement of the viscosity NaOH NWG* Glycerol T Measurement g/L mL/L mL/L C. mPas * s 1 0 0 0 20 1.002 2 50 0 0 20 1.48 3 50 100 0 20 1.82 4 100 0 0 20 2.22 5 100 100 0 20 3.02 6 50 50 100 20 2.53 7 50 50 200 20 3.78 *soda water glass contains (as a calculated amount) 700 to 750 g/L of sodium silicate Na2SiO3

(133) The measurement was conducted with the viscometer of the company Anton Paar, type Physica MCR 101. Cone type used: CP60-0.5.

Example 9

(134) TABLE-US-00008 TABLE 8 Measurement of the reflection as an indication for the smoothing of the back side Sodium NaOH NWG* peroxodisulfate T t Removal Reflection Edge isolation g/L mL/L g/L C. s m % directly after diffusion 10.5 NF/HNO.sub.3 reference 20 80 2.0 25.5 NaOH 50 80 10 60 100 1.6 31.3 NaOH 50 80 10 60 300 3.0 33.1 NaOH 50 80 15 60 100 1.0 29.4 NaOH 50 80 15 60 300 3.1 33.2 NaOH 100 80 15 60 100 1.6 32.5 *soda water glass contains (as a calculated amount) 700 to 750 g/L of sodium silicate Na2SiO3

LIST OF REFERENCE SIGNS

(135) 1 substrate 2 shaft of support 3 closed massive shaft 4 closed massive shaft with profile pattern 5 process medium 6 gas bubbles 7 gas atmosphere 8 film 9 barrier 10 meniscus 11 filling level of the process medium