IGBT and manufacturing method therefor

Abstract

An IGBT and a manufacturing method therefor, wherein a target region in the IGBT is doped with first ions; the target region comprises at least one of a P-type substrate (11), a P-type well region (13), and a P-type source region (14); and the diffusion coefficient of the first ions is greater than the diffusion coefficients of boron ions. A PN junction formed by means of the present invention is a gradual junction, thereby improving breakdown voltage, shortening turn-off time, and improving anti-latch capability.

Claims

1. A method for manufacturing an Insulated Gate Bipolar Transistor (IGBT), the method comprising: doping a target region of the IGBT with first ions, wherein the first ions are doped into the target region through at least one of ion evaporation and sputtering; doping the target region with second ions, wherein the second ions are doped into the target region through at least one of ion diffusion, evaporation, and sputtering; and doping a contact surface between the target region and other regions in the IGBT with boron ions, wherein the target region comprises one of a P-type substrate, a P-type well region, and a P-type source region, and a diffusion coefficient of the first ions is greater than a diffusion coefficient of boron ions, wherein a diffusion coefficient of the second ions is greater than or equal to the diffusion coefficient of boron ions, and wherein the first ions and the second ions are P-type ions.

2. The method for manufacturing an IGBT according to claim 1, wherein the first ions are selected from aluminum ions, gallium ions, indium ions, and thallium ions.

3. The method for manufacturing an IGBT according to claim 1, wherein the first ions and the second ions are located in different layers.

4. The method for manufacturing an IGBT according to claim 3, wherein: the first ions are selected from aluminum ions, gallium ions, indium ions, and thallium ions; and the second ions are selected from boron ions, aluminum ions, gallium ions, indium ions, and thallium ions.

5. The method for manufacturing an IGBT according to claim 4, wherein the first ions are aluminum ions, and the second ions are gallium ions.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic structural diagram of an IGBT according to embodiment 1 of the present invention.

(2) FIG. 2 is a flowchart of a method for manufacturing IGBT according to embodiment 2 of the present invention.

(3) FIG. 3 is a flowchart of a method for manufacturing IGBT according to embodiment 4 of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

(4) The present invention will be further illustrated by the following embodiments, but the present invention is not limited thereto.

Embodiment 1

(5) This embodiment provides an IGBT, and FIG. 1 shows a schematic structural diagram of this embodiment. Referring to FIG. 1, the IGBT of this embodiment comprises from bottom to top:

(6) A collector C on the back surface of the IGBT, a P-type substrate 11, an N-type drift region 12, a P-type well region 13 at both ends of the N-type drift region 12, a P-type source region 14 and an N-type source region 15 above the P-type well region 13, an emitter electrode E located above the P-type source region 14 and a part of the N-type source region 15, and a gate electrode G located above a part of the N-type source region 15, a part of the P-type well region 13 and a part of the N-type drift region 12.

(7) In the IGBT of this embodiment, a target region comprises at least one of the P-type substrate 11, the P-type well region 13, and the P-type source region 14. In this embodiment, the doping impurities of the target region are first ions, which have a diffusion coefficient greater than the diffusion coefficient of boron ions. Specifically, the first ions may be, but not limited to, aluminum ions, gallium ions, indium ions, and thallium ions.

(8) In this embodiment, the doping concentration and depth of the first ions can be customized according to specific applications.

(9) Since the first ions as doping impurities in this embodiment are the above-mentioned metal ions, thereby boron ions can be further doped on the contact surface between the target region and other regions, in other words, a layer of boron ions is covered on the surface of the target region, to avoid metal contamination caused by doped metal ions.

(10) In this embodiment, the diffusion coefficient of the first ions doped in the target region of the IGBT is greater than the diffusion coefficient of boron ions, unlike the prior art that uses boron ions as doping impurities, so that the impurity distribution morphology formed under the same conditions is more gradual, that is, the formed PN junction is a gradual junction, thereby increasing the breakdown voltage, shortening the turn-off time, improving the anti-latch-up ability, and further improving the performance of the IGBT. In addition, due to the large impurity diffusion coefficient of the present invention, a wider and deeper PN junction can be formed at a lower temperature and in a shorter time, which has certain cost advantages.

Embodiment 2

(11) This embodiment provides a method for manufacturing IGBT, which is used for manufacturing the IGBT of embodiment 1, FIG. 2 shows a flowchart of this embodiment. Referring to FIG. 2, the method of this embodiment comprises:

(12) S101, doping the target region of the IGBT with first ions;

(13) S102, doping the contact surface between the target region and other regions in the IGBT with boron ions.

(14) Therefore, according to the selection of the target region in embodiment 1, the corresponding P-type substrate 11, P-type well region 13, and P-type source region 14 can be specifically formed, wherein the first ions can be doped into the target region through but not limited to any one of ion implantation, diffusion, evaporation, and sputtering. In addition, boron ions can also be doped to specific contact surface through but not limited to the above-mentioned methods, to avoid metal contamination caused by doped metal ions.

Embodiment 3

(15) This embodiment provides an IGBT on the basis of embodiment 1. Specifically, the improvement of the IGBT of this embodiment over embodiment 1 lies in that the target region of this embodiment, that is, at least one of the P-type substrate 11, the P-type well region 13, and the P-type source region 14, in addition to being doped with the first ions, it is also doped with second ions, the diffusion coefficient of the second ions is not less than the diffusion coefficient of the boron ions. Specifically, the second ions may be, but not limited to, boron ions, aluminum ions, gallium ions, indium ions, thallium ions.

(16) In this embodiment, the first ions are preferably aluminum ions, and the second ions are preferably gallium ions, or the first ions are preferably gallium ions, and the second ions are preferably aluminum ions. In addition, the first ions and the second ions can be doped with each other, or distributed in different layers according to specific applications. The doping concentration and depth of the second ions can also be customized according to specific applications.

(17) In this embodiment, the diffusion coefficient of the first ions and the second ions doped in the target region of the IGBT are both not less than the diffusion coefficient of boron ions, unlike the prior art that uses boron ions as doping impurities, so that the impurity distribution morphology formed under the same conditions is more gradual, that is, the formed PN junction is a gradual junction, thereby increasing the breakdown voltage, shortening the turn-off time, improving the anti-latch-up ability, and further improving the performance of the IGBT. In addition, due to the large impurity diffusion coefficient of the present invention, a wider and deeper PN junction can be formed at a lower temperature and in a shorter time, which has certain cost advantages.

Embodiment 4

(18) This embodiment provides a method for manufacturing IGBT, which is used for manufacturing the IGBT of embodiment 3, FIG. 3 shows a flowchart of this embodiment. Referring to FIG. 3, the method of this embodiment comprises:

(19) S201, doping the target region with first ions;

(20) S202, doping the target region with second ions;

(21) S203, doping the contact surface between the target region and other regions in the IGBT with boron ions.

(22) Therefore, according to the selection of the target region in embodiment 3, the corresponding P-type substrate 11, P-type well region 13, and P-type source region 14 can be specifically formed, wherein the first ions and the second ions can be doped into the target region through but not limited to any one of ion implantation, diffusion, evaporation, and sputtering. In addition, boron ions can also be doped to specific contact surface through but not limited to the above-mentioned methods, to avoid metal contamination caused by doped metal ions.

(23) Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only an example, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention. Therefore, the protection scope of the present invention is defined by the appended claims.