Method for Forming a PN Junction and Associated Semiconductor Device

Abstract

A method can be used to make a semiconductor device. A number of projecting regions are formed over a first semiconductor layer that has a first conductivity type. The first semiconductor layer is located on an insulating layer that overlies a semiconductor substrate. The projecting regions are spaced apart from each other. Using the projecting regions as an implantation mask, dopants having a second conductivity type are implanted into the first semiconductor layer, so as to form a sequence of PN junctions forming diodes in the first semiconductor layer. The diodes vertically extend from an upper surface of the first semiconductor layer to the insulating layer.

Claims

1. A method of making a semiconductor device, the method comprising: forming a plurality of projecting regions over a first semiconductor layer having a first conductivity type, wherein the first semiconductor layer is located on an insulating layer overlying a semiconductor substrate, the projecting regions being spaced apart from each other; and using the projecting regions as an implantation mask, performing a first implantation of dopants having a second conductivity type into the first semiconductor layer, so as to form a sequence of PN junctions forming diodes in the first semiconductor layer, the diodes vertically extending from an upper surface of the first semiconductor layer to the insulating layer.

2. The method according to claim 1, further comprising performing a second implantation of dopants having the first conductivity type in the first semiconductor layer, so that each diode includes a heavily doped region of the first conductivity type that is next to a lightly doped region of the first conductivity type that is next to a doped region of the second conductivity type.

3. The method according to claim 1, further comprising performing a second implantation of dopants having the first conductivity type in the first semiconductor layer, wherein the first and the second implantation of dopants, define respectively, in the first semiconductor layer, first areas of the second conductivity type, overdoped relative to other portions of the first semiconductor layer, and second areas of the first conductivity type, overdoped relative to the other portions of the first semiconductor layer, a first area lying between two second areas and separated from these two second areas by two interleaved regions of the first semiconductor layer located, respectively, under two neighboring projecting regions, each diode including a between a first area and an interleaved region, wherein the first areas are of P+ doped regions and form anodes of the diodes, and wherein the second areas are of N+ doped regions and form, together with the interleaved regions, cathodes of the diodes, the method further comprising forming contacts on the first and second areas.

4. The method according to claim 1, further comprising: forming the insulating layer by performing a shallow trench isolation process; and forming the first semiconductor layer by depositing polysilicon over the insulating layer and implanting dopants of the first conductivity type.

5. The method according to claim 4, further comprising forming the projecting regions by forming a layer of dielectric and then forming a gate material over the layer of dielectric.

6. The method according to claim 5, wherein forming the first semiconductor layer also includes simultaneously forming floating gates of floating gate transistors and wherein forming the projecting regions also includes simultaneously forming control gates of the floating gate transistors.

7. A method of making an integrated circuit, the method comprising: forming an insulating layer over a surface of a semiconductor substrate, the insulating layer defining an active region at a first location of the semiconductor substrate and defining a diode region at a second location of the semiconductor substrate; forming a polysilicon layer having a first conductivity type, the polysilicon layer overlying the insulating layer at the second location; forming a gate dielectric layer over the polysilicon layer; forming a conductive layer over the gate dielectric layer; patterning the polysilicon layer to form a floating gate at the first location, the polysilicon layer being unpatterned at the second location; patterning the conductive layer to form a control gate overlying the floating gate and to form a projecting region overlying the polysilicon layer at the second location; using the projecting regions as a hard mask, implanting dopants of a second conductivity type into first areas of the polysilicon layer so that interleaved regions beneath the projecting regions remain doped with the first conductivity type; and using the projecting regions as a hard mask, implanting dopants of the first conductivity type into second areas of the polysilicon layer, the second areas of the polysilicon layer being more heavily doped than the interleaved regions.

8. The method according to claim 7, wherein PN junctions are formed at interfaces between the first areas and the interleaved regions, the interfaces adjacent edges of the projecting regions.

9. The method according to claim 7, wherein a plurality of diodes are formed within the polysilicon layer, each diode comprising a heavily doped region of the first conductivity type that abuts a lightly doped region of the first conductivity type that abuts a doped region of the second conductivity type.

10. The method according to claim 7, further comprising forming spacers of a dielectric material of the projecting regions and the control gates.

11. The method according to claim 7, further comprising forming a plurality of dummy control gate structures, the projecting regions comprising ones of the dummy control gate structures.

12. The method according to claim 7, wherein the dopants of the second conductivity type are diffused throughout the polysilicon layer and extend to the insulating layer and wherein the dopants of the first conductivity type are diffused throughout the polysilicon layer and extend to the insulating layer.

13. An integrated circuit comprising: a semiconductor substrate; an insulating layer overlying the semiconductor substrate; a semiconductor layer of a first conductivity type overlying the insulating layer; a plurality of projecting regions that are spaced apart from each other overlying the semiconductor layer; and a sequence of PN junctions in the semiconductor layer, each PN junction located at an edge of an associated projecting region and vertically extending from an upper surface of the semiconductor layer to the insulating layer.

14. The integrated circuit according to claim 13, wherein the sequence of PN junctions forms a plurality of diodes, each diode including a heavily doped region of the first conductivity type that abuts a lightly doped region of the first conductivity type that abuts a doped region of a second conductivity type.

15. The integrated circuit according to claim 14, wherein some of the diodes form a current bridge rectifier.

16. The integrated circuit according to claim 15, wherein the current bridge rectifier comprises a Graetz bridge.

17. The integrated circuit according to claim 13, wherein the sequence of PN junctions comprises first areas of a second conductivity type overdoped relative to other portions of the semiconductor layer, and second areas of the first conductivity type overdoped relative to the other portions of the semiconductor layer, a first area lying between two second areas and separated from these two second areas by two interleaved regions of the semiconductor layer located, respectively, under two neighboring projecting regions, each junction between a first area and an interleaved region forming a diode, wherein the first areas comprise P+ doped areas that form anodes of the diodes, and wherein the second areas comprise N+ doped areas that, together with the interleaved regions, form cathodes of the diodes.

18. The integrated circuit according to claim 13, wherein the semiconductor layer is a polysilicon layer.

19. The integrated circuit according to claim 13, wherein the projecting regions comprise a layer of dielectric and a gate material overlying the layer of dielectric.

20. The integrated circuit according to claim 13, further comprising floating gate transistors laterally spaced from the sequence of PN junctions, each floating gate transistor comprising a floating gate and a control gate, wherein the semiconductor layer is located at the same level as the floating gates of the floating gate transistors, and the projecting regions are located at the same level as the control gates of the floating gate transistors.

21. An integrated circuit comprising: a semiconductor substrate; an insulating layer overlying the semiconductor substrate; a semiconductor layer overlying the insulating layer; a plurality of projecting regions that are spaced apart from each other overlying the semiconductor layer; a plurality of interleaved regions disposed within the semiconductor layer, each interleaved region being located beneath and associated projecting region and being lightly doped with dopants of a first conductivity type; a plurality of first areas disposed within the semiconductor layer, each first area abutting an associated interleaved region at a location near a first edge of the associated projecting region, each first area being heavily doped with dopants of the first conductivity type and extending from an upper surface of the semiconductor layer to the insulating layer; and a plurality of second areas disposed within the semiconductor layer, each second area abutting an associated interleaved region at a location near a second edge of the associated projecting region, each second area being heavily doped with dopants of a second conductivity type and extending from the upper surface of the semiconductor layer to the insulating layer.

22. The integrated circuit according to claim 21, wherein the interleaved regions, the first areas, and the second areas form diodes that are connected to form a current bridge rectifier.

23. The integrated circuit according to claim 21, further comprising floating gate transistors laterally spaced from the projecting regions, each floating gate transistor comprising a floating gate and a control gate, wherein the semiconductor layer is located at the same level as the floating gates of the floating gate transistors, and the projecting regions are located at the same level as the control gates of the floating gate transistors.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Other advantages and characteristics of the invention will be apparent from a perusal of modes of construction and embodiment of the invention, which are not limiting in any way, and the appended drawings, in which:

[0035] FIG. 1, described above, shows a conventional electronic circuit comprising a diode bridge,

[0036] FIG. 2 shows a sectional view of a mode of construction of an integrated circuit according to the invention, and

[0037] FIG. 3 shows an embodiment of a method according to the invention, and corresponds to a top view of the section of FIG. 2.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0038] FIG. 2 is a sectional view of an integrated circuit comprising three diodes D1, D2, D3 formed on a semiconductor substrate 1. The semiconductor substrate 1 may be, with reference to FIG. 1, the substrate PSUB itself or a box structure formed in the substrate, for example the box structure N-ISO, again with reference to FIG. 1.

[0039] Different manufacturing steps of a method for producing this structure will now be described with reference to FIGS. 2 and 3.

[0040] An insulating layer 3 has been formed on the surface of the substrate 1, for example, by a method similar to a conventional known method for forming a shallow insulating trench.

[0041] A first semiconductor layer 5, for example a layer of polysilicon doped with a first type of conductivity, of the N-type for example, is then formed on the insulating layer 3.

[0042] In a customary method for manufacturing non-volatile memories, this step can be executed jointly with a step of forming polysilicon floating gates of floating-gate transistors.

[0043] In the customary method for manufacturing non-volatile memories, control gates of the floating-gate transistors are then formed, usually comprising a layer of dielectric surmounted by a layer of polysilicon. The control gates are, for example, formed in strips extending in a direction orthogonal to the section plane of FIG. 2.

[0044] The control gates may also be formed from any other gate material, such as a metal.

[0045] Additionally, structures known as “dummies” are commonly added to the functional structures, notably in order to avoid breaks in periodicity which are harmful in some steps of the manufacture of integrated circuits, but they do not usually have any supplementary function.

[0046] In the method of forming the diodes D1, D2, D3, a layer of dielectric 7 surmounted by a layer of polysilicon 9 is formed on the surface of the first polysilicon layer 5, forming projecting regions CGf on the surface of the first polysilicon layer.

[0047] The projecting regions CGf may advantageously be dummy control gates specified in the context of a method of manufacturing floating-gate transistors.

[0048] In this embodiment, the projecting regions CGf are used as a hard mask for forming implantations of dopants in the first polysilicon layer 5.

[0049] As illustrated in FIG. 3, the projecting regions CGf are arranged here in strips extending in a direction orthogonal to the section plane of FIG. 2, represented by the line II-II.

[0050] An implantation of dopants having the second type of conductivity (P+) is carried out along first implantation surfaces 10 so as to form first areas 11-11′ which are overdoped relative to the doping of the first polysilicon layer 5, for example by having a concentration which is higher by a factor of 100.

[0051] The implantation surfaces 10 cover the parts of the first polysilicon layer 5 located between two projecting regions CGf, and may overflow on to a portion of the strips of projecting regions CGf.

[0052] This is because, even if the implantation surfaces 10 are poorly aligned relative to a specified implantation surface (that is to say, the polysilicon surface 5 between two projecting regions CGf), the first resulting implanted areas 11-11′ will be delimited precisely and regularly by the edges bCGf of the projecting regions CGf.

[0053] Consequently, the implantation requires no supplementary critical masking step, particularly in a method including the forming of floating-gate transistors.

[0054] This permits a good degree of control of the implantation surfaces, and consequently the lateral distribution of the dopants in the polysilicon layer 5.

[0055] The regions of the first polysilicon layer 5 located under the projecting regions CGf are therefore not implanted, and form regions 12 called interleaved regions.

[0056] On the other hand, the thickness of the first polysilicon layer 5 and the depth of implantation of the dopants are advantageously designed to be such that the implantation 10 is diffused throughout the thickness of the first polysilicon layer 5, as far as the insulating layer 3.

[0057] As a result of the diffusion, the first areas 11-11′ comprise a very strongly doped region 11 close to the surface and a deeper less strongly doped region 11′, reaching the insulating layer 3.

[0058] Thus PN junctions between the first areas 11-11′ and the interleaved regions 12 extend to the insulating layer 3 and are located on the edges of the projecting regions bCGf in the first polysilicon layer 5.

[0059] Since the dopant implantations are not isotropic, the term “edges of the projecting regions” signifies a region adjacent, or close, to the geometric projection of the contour of the projecting regions in the first polysilicon layer 5.

[0060] Implantations of dopants having the first type of conductivity (N+) are carried out in a corresponding manner along second implantation surfaces 13 so as to form second areas 14-14′ which are overdoped relative to the doping of the first polysilicon layer 5.

[0061] The implantation surfaces 13 cover the parts of the first polysilicon layer 5 located between the edges bCGf of two projecting regions CGf, and may also overflow on to a portion of the projecting regions CGf.

[0062] Similarly, the thickness of the first polysilicon layer 5 and the depth of implantation of the dopants are advantageously designed to be such that the implantation is diffused throughout the thickness of the second polysilicon layer 5, forming a very strongly doped region 14 and a less strongly doped region 14′ reaching the insulating layer 3.

[0063] In this mode of construction and embodiment, one region out of every two regions located between two strips of projecting regions CGf is doped with the first type of conductivity, while the other is doped with the second type of conductivity.

[0064] The first areas 11-11′ form, with the interleaved regions 12 of the first polycrystalline silicon layer 5, PN junctions extending to the insulating layer 3.

[0065] Thus the first areas 11-11′ form anode regions and the second areas 14-14′ form, with the interleaved regions 12, cathode regions of diodes D1, D2, D3 constructed in this way.

[0066] It is then possible to form, in a conventional manner, spacers 15 of a dielectric material placed on the sides of the projecting regions (or dummy control gates) CGf, and contact terminals for the cathodes 17 and anodes 19, for example by siliciding the surfaces of the anode and cathode regions which are not covered by the spacers 15 or the projecting regions CGf, on which metallic cathode contacts 21 and anode contacts 23 are respectively formed.

[0067] Thus diodes D1, D2, D3 are produced, formed by a PN junction extending to the insulating layer 3, between an anode formed by a first overdoped area 11-11′ and a cathode formed by a second overdoped area 14-14′ and an interleaved region 12.

[0068] The diodes D1, D2, D3 are therefore completely insulated from the semiconductor substrate 1.

[0069] Additionally, in this embodiment, at least one cathode region 14-14′ is common to two different diodes, for example the diodes D1 and D2, and lies between two respective anode regions 11-11′. Also, at least one anode region 11-11′ is common to two different diodes, for example the diodes D2 and D3, and lies between two respective cathode regions 14-14′.

[0070] This configuration with common electrodes is particularly advantageous for the construction of a diode bridge of the Graetz bridge type, having an anode node common to two diodes and a cathode node common to two diodes.

[0071] Furthermore, the invention is not limited to the present description, but embraces all variants thereof.

[0072] For example, it is feasible for the second implantation 13 to be an implantation of dopants having the second type of conductivity, in a similar manner to the first implantation 10, forming a series of diodes head to tail between the implanted areas and the interleaved areas, the various cathodes being electrically connectable via contacts extending in a plane other than the planes of the attached figures.