Quantum dot SOA-silicon external cavity multi-wavelength laser
09831635 · 2017-11-28
Assignee
Inventors
- Yi Zhang (Jersey City, NJ, US)
- Shuyu Yang (Jersey City, NJ, US)
- Michael J. Hochberg (New York, NY)
- Thomas Wetteland Baehr-Jones (Arcadia, CA)
Cpc classification
H01S5/06804
ELECTRICITY
H01S5/141
ELECTRICITY
H01S5/343
ELECTRICITY
H01S5/1032
ELECTRICITY
H01S3/005
ELECTRICITY
H01S5/4062
ELECTRICITY
International classification
H01S3/10
ELECTRICITY
H01S5/02
ELECTRICITY
H01S5/343
ELECTRICITY
H01S5/10
ELECTRICITY
H01S5/34
ELECTRICITY
H01S5/40
ELECTRICITY
Abstract
A hybrid external cavity multi-wavelength laser using a QD RSOA and a silicon photonics chip is demonstrated. Four lasing modes at 2 nm spacing and less than 3 dB power non-uniformity were observed, with over 20 mW of total output power. Each lasing peak can be successfully modulated at 10 Gb/s. At 10.sup.−9 BER, the receiver power penalty is less than 2.6 dB compared to a conventional commercial laser. An expected application is the provision of a comb laser source for WDM transmission in optical interconnection systems.
Claims
1. An optical cavity, comprising: a substrate; an output optical port configured to output an optical output beam including a plurality of different, spaced-apart selected wavelength channels; a first partial reflector comprising a submicron waveguide on said substrate at a first end of the optical cavity optically coupled to the output port, said first partial reflector comprising a first transmittance and a first reflectivity, for passing a portion of light in the optical cavity as the optical output beam and reflecting a portion of the light back into the optical cavity; an optical gain element configured to amplify the light at the plurality of selected wavelength channels; and a filter element on said substrate having multiple passbands configured to pass light at the plurality of selected wavelength channels therethrough, and to reflect light at wavelengths other than the plurality of selected wavelength channels away from the optical gain element; and a second reflector at a second end of the optical cavity, the second reflector comprising a second transmittance and a second reflectivity for reflecting the plurality of selected wavelength channels back through the optical gain element.
2. The optical cavity of claim 1, wherein the optical gain element comprises an optical gain medium provided in a gain cavity on the substrate.
3. The optical cavity of claim 2, wherein the second reflector comprises a submicron waveguide on the substrate in the form of a Sagnac loop mirror.
4. The optical cavity of claim 1, wherein the first partial reflector and the filter element are provided on the substrate comprising a first half-cavity chip; and wherein the optical gain element comprises a semiconductor optical amplifier (SOA) provided on a second half-cavity chip coupled to the first half-cavity chip.
5. The optical cavity of claim 4, further comprising a waveguide coupler for coupling the first half-cavity chip to the second half-cavity chip; wherein the waveguide coupler comprises a silicon waveguide with a gradually tapering down width coupled to a silicon nitride waveguide with a gradually increasing width.
6. The optical cavity of claim 4, wherein the second reflector comprises a facet on the SOA.
7. The optical cavity of claim 5, wherein the facet includes a reflective optical coating.
8. The optical cavity of claim 4, wherein said SOA comprises a quantum dot reflective semiconductor optical amplifier.
9. The optical cavity of claim 1, wherein said first partial reflector comprises a Sagnac loop mirror.
10. The optical cavity of claim 9, wherein said first reflectance increases as the wavelength of light increases.
11. The optical cavity of claim 1, wherein said first reflectance decreases as the wavelength of light increases.
12. The optical cavity of claim 1, wherein said first reflectance is constant as the wavelength of light increases.
13. The optical cavity of claim 9, wherein said first partial reflector is configured to be adjustable for adjusting the first reflectance and transmittance.
14. The optical cavity of claim 1, wherein said filter element includes an FSR matching a laser mode spacing of the plurality of selected wavelength channels.
15. The optical cavity of claim 14, wherein the laser mode spacing is between 1 nm and 8 nm.
16. The optical cavity of claim 14, wherein said filter element comprises a micro-ring based filter.
17. The optical cavity of claim 15, wherein said filter element comprises a thermally tunable filter.
18. The optical cavity of claim 1, wherein said first reflectance is between 35% and 65% of the light in the optical cavity.
19. The optical cavity of claim 1, wherein said second reflectance is greater than 95% of the light in the optical cavity.
20. The optical cavity of claim 1, wherein said substrate comprises silicon; and wherein the first partial reflector and the filter element comprise silicon on insulator.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The objects and features of the invention can be better understood with reference to the drawings described below, and the claims. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the drawings, like numerals are used to indicate like parts throughout the various views.
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DETAILED DESCRIPTION
(39) Acronyms
(40) A list of acronyms and their usual meanings in the present document (unless otherwise explicitly stated to denote a different thing) are presented below.
(41) AMR Adabatic Micro-Ring
(42) APD Avalanche Photodetector
(43) ARM Anti-Reflection Microstructure
(44) ASE Amplified Spontaneous Emission
(45) BER Bit Error Rate
(46) BOX Buried Oxide
(47) CMOS Complementary Metal-Oxide-Semiconductor
(48) CMP Chemical-Mechanical Planarization
(49) DBR Distributed Bragg Reflector
(50) DC (optics) Directional Coupler
(51) DC (electronics) Direct Current
(52) DCA Digital Communication Analyzer
(53) DRC Design Rule Checking
(54) DUT Device Under Test
(55) ECL External Cavity Laser
(56) FDTD Finite Difference Time Domain
(57) FOM Figure of Merit
(58) FSR Free Spectral Range
(59) FWHM Full Width at Half Maximum
(60) GaAs Gallium Arsenide
(61) InP Indium Phosphide
(62) LiNO.sub.3 Lithium Niobate
(63) LIV Light intensity(L)-Current(I)-Voltage(V)
(64) MFD Mode Field Diameter
(65) MPW Multi Project Wafer
(66) NRZ Non-Return to Zero
(67) PIC Photonic Integrated Circuits
(68) PRBS Pseudo Random Bit Sequence
(69) PDFA Praseodymium-Doped-Fiber-Amplifier
(70) PSO Particle Swarm Optimization
(71) Q Quality factor
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(73) QD Quantum Dot
(74) RSOA Reflective Semiconductor Optical Amplifier
(75) SOI Silicon on Insulator
(76) SEM Scanning Electron Microscope
(77) SMSR Single-Mode Suppression Ratio
(78) TEC Thermal Electric Cooler
(79) WDM Wavelength Division Multiplexing
(80) Hybrid Laser Integration
(81) A high quality laser is critical to the performance of any optical data links. Because silicon doesn't lase at optical wavelengths used for telecommunication, external gain material has to be integrated in a CMOS compatible manner. Silicon waveguide distributed Bragg gratings require sub-50 nm feature size and are difficult to manufacture. A reliable cavity is also needed to provide feedback for lasing operation. We describe a novel laser cavity configuration utilizing a Sagnac loop mirror and micro-ring resonator. Hybrid lasers based on such cavity are demonstrated with 1.2 MHz linewidth, 4.8 mW on-chip output power, and over 40 dB side mode suppression ratio.
(82) High Index Contrast Silicon Waveguides
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(85) Sagnac Loop and Micro-Ring External Cavity Laser
(86) The device was fabricated by a foundry. The Sagnac loop mirror transmittance and reflectivity can be predicted analytically as it contains only a directional coupler other than a routing waveguide.
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(88) In
(89) A gain medium is provided in a gain cavity 220. As shown in the embodiment of
(90) In the embodiment illustrated in
(91) In some embodiments, the specific structure of the optical cavity can include a reflector that is situated on a silicon chip for example fabricated from an SOI wafer and the gain region is provided by a III/V semiconductor material. The coupling can include one or more of butt-coupling, using tapers or inverse tapers for expanded beam coupling, using lenses for coupling or lens arrays for coupling.
(92) In some embodiments, the optical cavity can be operated using uncooled operation, in which the temperature is allowed to be free-running In some embodiments, the optical cavity can be operated nonhermetically. In some embodiments, one or more components of the optical cavity can be hermetically sealed at the die level.
(93) In some embodiments, there are included one or more optical coatings on an optical facet, either on the silicon side or on the III/V side or both.
(94) In various embodiments, the optical cavity provides an optical output beam that can comprise a single wavelength of interest, or a plurality of wavelengths of interest. In some embodiments the optical cavity provides an optical output beam that is a narrow linewidth optical output beam
(95) Laser Physics
(96) An optical cavity or optical resonator comprises mirrors that form a standing wave cavity resonator for light waves. Optical cavities are a major component of lasers, surrounding the gain medium and providing feedback of the laser light. They are also used in optical parametric oscillators and some interferometers. Light confined in the cavity reflects (or passes) multiple times between the mirrors, producing standing waves for certain resonance frequencies. The standing wave patterns produced are referred to as modes. Longitudinal modes differ only in frequency while transverse modes differ for different frequencies and have different intensity patterns across the cross section of the beam.
(97) In a laser, there is a gain medium which amplifies light. Laser pumping involves energy transfer from an external source into the gain medium of a laser. Different gain media can be pumped by various methods, which can include the provision of energy from electrical sources, optical sources, or even chemical sources. The gain medium absorbs energy and creates excited atomic states. When the number of particles in one excited state exceeds the number of particles in the ground state or a less-excited state, population inversion is achieved. When the excited atomic states relax (return to the ground state) a photon is emitted in lasers, the emission from the excited states can be caused to happen by the presence of photons having energy that matches the energy difference between the excited state and the ground state. The emitted photons have the same wavelength and direction and are in phase with the light that stimulates the excited state to emit, which condition is termed coherency. The emission process in lasers is termed stimulated emission, which is the reason why the name LASER (Light Amplification by Stimulated Emission of Radiation) was selected. In order for laser operation to occur, the pump power must be higher than the lasing threshold of the laser.
(98) In operation, light passes back and forth in the optical cavity between Mirror A 240 and Mirror B 210. The gain medium in the gaiun cavity 220 amplifies the light so that the intensty increases each time the light passes through the gain medium. The filter 230 filters out the wavelengths that are not of interest, so that stimulated emission of those wavelengths is suppressed. To the extent that the filter 230 can be used to select one or nore discrete wavelengths to pass, the wavelength of the laser light can be tuned.
(99) Depending on the type of gain medium that is employed, the power to pump the gain medium can be selected from any convenient power source having the proper characteristics (e.g., electrical power, optical power, or the like). In various embodiments of the invention, the gain medium can be an electrically pumped gain medium, an optically pumped gain medium, or even a chemically pumped gain medium. The gain medium can be a solid, a liquid, or a gas.
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(101) From the diagram in
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where L is the 100% coupling length, and φ represents the contribution of coupling from waveguide bends. Reflectivity equals to 1-T since excess loss of DC is negligible. To characterize the Sagnac loop mirror transmittance or reflectivity, structures shown as Mirror A 240 in
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(106) The diced silicon chip was first polished to create a flat and smooth sidewall for edge coupling. An ultra-thin edge coupler was employed to match the SOA mode for low coupling loss, using the methods described in S. Yang, Y. Zhang, D. W. Grund, G. A. Ejzak, Y. Liu, A. Novack, D. Prather, A. E-J Lim, G-Q Lo, T. Baehr-Jones, and M. Hochberg, “A single adiabatic microring-based laser in 220 nm silicon-on-insulator,” Opt. Express 22(1), 1172-1180 (2013). A half-cavity on silicon chip was aligned to the SOA using a six-axis stage.
(107) An image of the testing setup is shown in
(108) On the silicon chip, the output grating coupler is first connected to a y-junction, which has 3 dB intrinsic loss due to power splitting and 0.3 dB excess loss. One branch of the y-junction is connected to another grating coupler 127 μm away, matching the fiber pitch in the fiber array, while the other branch lead to the output waveguide of the hybrid laser. With the hybrid laser turned off, the fiber array was actively aligned to the grating coupler loop using an Agilent laser and power meter. The grating coupler loss was simultaneously characterized to be 8.5 dB, which is higher than is typically seen during wafer scale testing, because it was kept further to the chip surface as precaution. Then the Agilent laser was turned off and hybrid laser turned on, a sharp threshold behavior near 60 mA was observed when varying the pump current.
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(110) The measured spectrum at 170 mA pump current using an optical spectrum analyzer with 0.1 nm resolution is plotted in
(111) We performed heterodyne experiments to measure the laser linewidth. Our laser output from the fiber array was combined with the output of a narrow linewidth laser (Agilent 81600B, linewidth about 100 kHz) by a 2×2 fiber coupler. The combined optical signal (or combined optical beams) was converted into an electrical domain signal by a photodetector, whose photocurrent was fed into an RF spectrum analyzer. The heterodyne spectrum data is plotted in
(112) Lithographic Micro-Ring Resonant Wavelength Control
(113) As shown in
(114) A potential drawback of micro-rings is their sensitivity to fabrication variations. For wafers processed in a commercial CMOS fab, it has been reported that the cross-wafer spread in resonant wavelength is as large as its FSR. If the micro-ring is used as a WDM modulator, the ring resonance can be thermally tuned to the nearest grid channel, thus mitigating the fabrication sensitivity to a certain extent. However, if the micro-ring is used inside a laser cavity, the non-predictability of lasing wavelength may impede the practical application of such a device.
(115) The effect of waveguide geometry variation on micro-ring resonance wavelength can be modeled as a perturbation to the waveguide effective index. The FSR depends on the group index of the waveguide, which is immune to fabrication errors and can be accurately controlled among wafers and process lots. If the FSR is increased to be significantly larger than the random spread of wavelengths, that spread determines the range of possible lasing wavelengths. The spread depends on ring waveguide design, the SOI wafer, and silicon processing. We chose an adiabatically widened micro-ring (AMR), which has a large FSR and is more robust against fabrication variations. In an AMR, the waveguide is narrow near the coupling region to ensure single mode operation, and then is gradually widened to support tight bend geometries and a possible need to form a metal contact. For an AMR of 2 μm radius, the FSR is as large as 54 nm.
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(117) As shown in
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(120) The resonant wavelength distribution contours are shown in
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(122) To further validate the predictability of resonant wavelength, AMRs with slightly different radii on the same wafer were also measured, and the results are summarized in
(123) Si.sub.3N.sub.4 Edge Coupler
(124) In some embodiments, one may need to address the low output power because of the coupling loss at the chip interface as a result of mode mismatch between the silicon waveguide and the RSOA waveguide. The cross-section of a typical silicon waveguide is shown in
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(126) TABLE-US-00001 TABLE 1 Quartiles 100% Maximum 1535.42 75% 3.sup.rd Quartile 1531.63 50% Median 1528.36 25% 1.sup.st Quartile 1526.09 0% Minimum 5122.57 Summary Statistics Mean 1528.7597 Standard Deviation 3.3156392 Standard Mean Error 0.5955064 N 31
(127) TABLE-US-00002 TABLE 2 ΔR (nm) 0 15 25 35 45 55 65 Min 1522.57 1529.71 1533.52 1538.47 1543.00 1552.70 1556.80 Max 1535.42 1542.8 1548.42 1553.70 1559.30 1565.00 1570.41 Range 12.85 13.09 14.90 15.23 16.30 12.30 13.61 Std Dev. 3.32 3.38 3.59 3.75 3.78 3.47 3.62
(128) TABLE-US-00003 TABLE 3 Band Description Wavelength range O Original 1260-1360 nm E Extended 1360-1460 nm S short wavelengths 1460-1530 nm C conventional (“erbium window”) 1530-1565 nm L long wavelengths 1565-1625 nm U ultralong wavelengths 1625-1675 nm
(129) Light is coupled from silicon waveguide to nitride waveguide using a push-pull coupler, as shown in
(130) The alignment and measurement procedure previously described were repeated with the ARM and improved edge coupler. After the SOI chip, the RSOA chip and the fiber array were properly aligned and the RSOA pump current was turned on. A sharp threshold behavior near 60 mA was observed when increasing the pump current. At 170 mA, about 3 times the threshold current, optical power measured from the power meter is −5 dBm, which corresponds to on-chip power of 6.8 dBm or 4.8 mW after normalizing the 8.5 dB grating coupler insertion loss and 3.3 dB Y-junction insertion loss. The optical spectrum is plotted in
(131) QD O-Band Laser
(132) One major application of silicon photonics is high-speed data communications, such as optical interconnect in data centers. Short reach systems have standardized in the O-Band, the lowest dispersion wavelength window of standard single mode fibers. Table 3 lists the wavelength ranges of selected bands that are used in optical communication systems. Thus O-Band silicon photonics devices are of great interest. However, almost all devices demonstrated up to date operate at C-Band, the fiber low loss window, because of the wider availability of lasers, amplifiers, and other testing apparatus at this wavelength range.
(133) To first order, passive device geometry scales with wavelength, free carrier plasma effect used for modulation is not wavelength sensitive, and germanium in photodetectors has stronger absorption at O-Band. The gain spectrum of typical materials cannot cover both wavelengths, so a different gain medium needs to be considered. Conventional quantum well lasers can be used, but QD lasers have better performance in terms of low threshold current and low thermal sensitivity.
(134) A QD based RSOA was employed. It is based on indium arsenide quantum dots in gallium arsenide with aluminum gallium arsenide barriers and commercially available off-the-shelf, for example from Innolume GmbH, Konrad-Adenauer-Allee 11, 44263 Dortmund, Germany. Facet reflectivity is >99% for the high reflective end and <1% for the anti-reflective end. The silicon chip layout and alignment procedure is similar to the previous device. It inherits the unique advantages of QD lasers, and maintains the maturity of a commercial RSOA, and the CMOS compatibility of the silicon photonics chip.
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(137) The threshold is at 90 mA. Some kinks due to mode hopping when current is swept are also available, which is common to hybrid silicon photonics lasers. The kink near 250 mA is irregular and most likely due to mechanically or thermally induced alignment perturbations. Lasing peak appears at 1302 nm and over 50 dB SMSR is obtained.
(138) Data transmission experiments were performed to further verify the viability of the hybrid external cavity laser. The laser output is non-return to zero (NRZ) modulated using a Lithium Niobate (LiNO.sub.3) Mach-Zehnder modulator, and detected using an InGaAs photodetector. The photocurrent is amplified and displayed on a digital communication analyzer (DCA).
(139) The data rate was then increased to 40 Gb/s. A commercial DFB laser (Agere Systems A1611A/B) was used as a control. Longer rise and fall time is observed because of system bandwidth limitation.
(140) The same tests were repeated using the hybrid silicon external cavity laser.
(141) The growing volume of Internet traffic due to the ever-increasing popularity of mobile devices, high-definition video, big data, and cloud computing provides a demand for high-speed, low-cost and low power consumption communication technology. Silicon photonics is a promising technology that is expected to address such needs because it enables compact device footprints using a platform which is compatible with the manufacturing facilities used for complementary metal-oxide-semiconductor (CMOS) electronics.
(142) The micro-ring is a unique device enabled by submicron silicon waveguides and the high index contrast between silicon and silicon oxide. Microring modulators can be more energy efficient, and orders of magnitude smaller than travelling wave Mache-Zehnder modulators. Microrings are also widely used as wavelength filters and multiplexers, which are compact and thermally tunable. High-order ring filters with flattened top and steep out-of-band rejection have also been reported. Ring resonance stabilization that mitigates thermal and fabrication sensitivity has been demonstrated as well.
(143) Another advantage of the micro-ring is its intrinsic wavelength division multiplexing (WDM) capability.
(144) Having an integrated comb source is advantageous to the micro-ring based WDM transceiver, but such sources remain elusive in the literature. The comb source could be made of an array of lasers followed by a wavelength multiplexer, but laser arrays are usually expensive due to the limited yield and relatively low manufacturing volumes of III/V single-mode compound devices.
(145) The other option is to use a single laser that simultaneously generates multiple lasing lines at different wavelengths. One way to build such a multi-wavelength laser is to utilize fiber nonlinearity. Successful generation of 1520 nm wavelengths and 31.8 Tb/s transmission was demonstrated by V. Ataie, et al. However nonlinear fiber based comb sources are bulky and hard to integrate. Conventional semiconductor Fabry-Perot (FP) lasers support multiple longitudinal modes, but amplitude of each mode can fluctuate significantly even if the total power is stable, due to competition for optical gain among different longitudinal modes, which is called mode partitioning. Thus an individual longitudinal mode in FP lasers cannot be modulated for data transmission. More recently, it was reported that quantum dot (QD) FP lasers have much lower mode partition noise due to strong spectral hole burning. While promising, lasing wavelengths of such FP QD laser are determined by the cavity length, which necessitates accurate cleaving of materials and is difficult to fabricate using traditional methods.
(146) We now describe what we believe is the first hybrid integrated external cavity, multi-wavelength laser fabricated by integrating a QD reflective semiconductor optical amplifier (RSOA) and a silicon photonics chip. The device comprises a quantum dot reflective semiconductor optical amplifier and a silicon-on-insulator chip with a Sagnac loop mirror and micro-ring wavelength filter. The QD RSOA is the gain medium with low mode partition noise, while a half-cavity on the silicon chip provides lithographically defined wavelength selective reflection. We demonstrate four major lasing peaks near 1300 nm from a single cavity with less than 3 dB power uniformity. We also demonstrate error-free 4×10 Gb/s data transmission, that is, simultaneous error-free data transmission on each wavelength.
(147) Device Design
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(149) The half-cavity on the silicon chip 1605 comprises a Sagnac loop mirror 1640 and a micro-ring wavelength filter 1630. The Sagnac loop mirror 1640 is made by connecting two waveguide on one side of a directional coupler, which is a simple and robust way to build on-chip mirrors in silicon photonics. Its reflectivity can be accurately controlled by setting proper coupling length in the directional coupler. In this device, the two strip waveguides in the directional coupler are 500 nm wide, 220 nm thick, and separated by 200 nm edge to edge. The coupling length is set to 15 μm to achieve 50% reflection. However, a Sagnac loop mirror 1640 only provides broadband reflection, so a micro-ring wavelength filter 1630 is inserted in the cavity for wavelength selection. In the embodiment illustrated, the ring radius is 35 μm, with 2 μm straight waveguide in coupling region, corresponding to a free spectral range (FSR) of 2 nm. The measured transmission spectrum of this micro-ring filter 1630 is shown as a dashed line in
(150) To reduce coupling loss at the RSOA/silicon interface, light in the submicron silicon waveguide is first coupled into a silicon nitride waveguide using an inverse taper. The silicon nitride waveguide is adiabatically tapered wider in the horizontal direction to match the RSOA waveguide width. In the vertical dimension, the nitride waveguide is only 200 nm thick. This leads to a much lower confinement factor and allows the modal field to extend into the oxide cladding to better matches the RSOA mode. The designed nitride waveguide mode field diameter is 3.5 μm×0.7 μm, a typical SOA mode size.
(151) Device Characterization
(152) Chip Alignment
(153) The silicon chip was polished after wafer dicing to create a flat and smooth facet for butt coupling. No anti-reflective coating was applied on the silicon chip. The RSOA and the silicon chip were mounted on six-axis stages for alignment. The RSOA chip was kept at 25° C. using a thermo-electric cooler (TEC), while the silicon chip remained at ambient temperature of the metal stage. 210 mA of pump current was provided to the RSOA from a DC source during alignment. A lensed fiber coupled to the 0.1% anti-reflective facet was used to monitor the cavity ASE or lasing power as a feedback for active alignment. After the QD RSOA and silicon chip were properly aligned, a fiber array was brought in to capture the output from the grating coupler.
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(157) Laser Spectrum and LIV
(158) The output of the fiber array was connected to an optical spectrum analyzer.
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(160) Demonstration of Data Transmission
(161) To validate the viability of the multi-wavelength laser for WDM data communication applications, each laser peak was filtered out using a commercial tunable filter and modulated using a commercial Lithium Niobate Mache-Zehnder modulator, as illustrated in
(162) The eye diagrams from the 4 lasing peaks are shown
(163) Design and Fabrication
(164) Methods of designing and fabricating devices having elements similar to those described herein are described in one or more of U.S. Pat. Nos. 7,200,308, 7,339,724, 7,424,192, 7,480,434, 7,643,714, 7,760,970, 7,894,696, 8,031,985, 8,067,724, 8,098,965, 8,203,115, 8,237,102, 8,258,476, 8,270,778, 8,280,211, 8,311,374, 8,340,486, 8,380,016, 8,390,922, 8,798,406, and 8,818,141, each of which documents is hereby incorporated by reference herein in its entirety.
Definitions
(165) As used herein, the term “optical communication channel” is intended to denote a single optical channel, such as light that can carry information using a specific carrier wavelength in a wavelength division multiplexed (WDM) system.
(166) As used herein, the term “optical carrier” is intended to denote a medium or a structure through which any number of optical signals including WDM signals can propagate, which by way of example can include gases such as air, a void such as a vacuum or extraterrestrial space, and structures such as optical fibers and optical waveguides.
(167) As used herein, the term “optical signal” is intended to denote an optical wave or an optical beam having at least one wavelength. Unless otherwise restricted, the term “optical signal” can mean, when read in context, any of a broadband signal spanning a range of wavelengths, an optical signal having a very narrow wavelength range, or an optical signal such as a laser signal having substantially a single wavelength.
THEORETICAL DISCUSSION
(168) Although the theoretical description given herein is thought to be correct, the operation of the devices described and claimed herein does not depend upon the accuracy or validity of the theoretical description. That is, later theoretical developments that may explain the observed results on a basis different from the theory presented herein will not detract from the inventions described herein.
INCORPORATION BY REFERENCE
(169) Any patent, patent application, patent application publication, journal article, book, published paper, or other publicly available material identified in the specification is hereby incorporated by reference herein in its entirety. Any material, or portion thereof, that is said to be incorporated by reference herein, but which conflicts with existing definitions, statements, or other disclosure material explicitly set forth herein is only incorporated to the extent that no conflict arises between that incorporated material and the present disclosure material. In the event of a conflict, the conflict is to be resolved in favor of the present disclosure as the preferred disclosure.
(170) While the present invention has been particularly shown and described with reference to the preferred mode as illustrated in the drawing, it will be understood by one skilled in the art that various changes in detail may be affected therein without departing from the spirit and scope of the invention as defined by the claims.