An optoelectronic device for detecting electromagnetic radiation includes a body of semiconductor material. A first region and a second region that form a junction are provided within the body. A recess extends into the body and is delimited by side arranged transverse to a main surface of the body. The junction is exposed by the sidewall to coupled electromagnetic radiation received in the recess into a photodiode formed by the junction.

A method produces a light-receiving device by growing a light-receiving layer having an undoped multi-quantum well structure; growing a cap layer on the light-receiving layer while the cap layer is doped with a p-type impurity during its growth; growing a mesa structure; growing a protective film on surfaces of the mesa structure; and annealing to form a p-n junction. The mesa structure is defined by a surrounding trench. Alternatively, a selective growth mask can be formed on the light-receiving layer whereafter the cap layer is grown on the light-receiving layer by use of the mask. In the alternative, the p-n junction is formed by diffusing p-type impurity from a p-type contact layer of the cap layer through a concentration adjusting layer thereof to the light-receiving layer.

An optoelectronic semiconductor component including an optoelectronic semiconductor chip having a first surface, wherein the first surface is a radiation emission surface of the optoelectronic semiconductor chip, the semiconductor chip is embedded in a mold body, the first surface is elevated with respect to a top side of the mold body, and a reflective layer is arranged on the top side of the mold body.

An electronic element mounting substrate includes: a first wiring substrate configured to be a frame defining an interior portion as a first through-hole, the first wiring substrate including a lower surface including an external circuit connection electrode; a metal plate disposed on the lower surface of the first wiring substrate so as to cover an opening of the first through-hole, an outer edge thereof being located between an outer edge of the first wiring substrate and an inner edge of the first wiring substrate, an electronic element mounting portion being disposed in a region of an upper surface of the metal plate which region is surrounded by the first wiring substrate; and a second wiring substrate which is disposed in a peripheral region of the metal plate on the lower surface of the first wiring substrate and is electrically connected to the external circuit connection electrode.

Provided are a composition of which dispersibility of particles including a pyrrolopyrrole coloring agent is satisfactory, a method of manufacturing a composition, a curable composition, a cured film using a curable composition, a near-infrared cut filter, a solid-state imaging device, an infrared sensor, and a camera module. The composition includes particles including a coloring agent represented by Formula (1), in which an average secondary particle diameter of the particles is 500 nm or less. R.sup.1a and R.sup.1b each independently represent an alkyl group, an aryl group, or a heteroaryl group, R.sup.2 and R.sup.3 each independently represent a hydrogen atom or a substituent, R.sup.2 and R.sup.3 may be bonded to each other to form a ring, R.sup.4's each independently represent a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, BR.sup.4AR.sup.4B, or a metal atom, R.sup.4's may form a covalent bond or a coordinate bond with at least one selected form R.sup.1a, R.sup.1b, or R.sup.3, and R.sup.4A and R.sup.4B each independently represent a hydrogen atom or a substituent.

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The invention relates to provide an infrared shielding composition that can form an infrared cut filter in which flat coating properties are excellent and the generation of a pattern on the surface is suppressed and that has excellent drying resistance, an infrared cut filter, and a solid-state imaging device. The infrared shielding composition according to the invention includes at least metal containing tungsten oxide particles; a resin binder; a solvent A of which a boiling point is 170 C. to 200 C. at 1 atm; and a solvent B different from the solvent A, in which a content of the solvent A is 0.1 to 20 mass % with respect to a total mass of the infrared shielding composition.

A deployable structure comprises a mast and two storage rollers each supporting a flexible solar generator, the two storage rollers being articulated on the mast. The mast comprises at least one longitudinal rod and two lateral arms, inclined angularly in two opposite directions that are symmetrical relative to the longitudinal rod, each lateral arm comprising an end provided with a hollow guide. Each storage roller has a longitudinal axis comprising a bent end forming a pivot respectively articulated inside the hollow guide of a corresponding lateral arm, the pivot of each storage roller having an axis of revolution different from the longitudinal axis of the corresponding storage roller.

An infrared imaging device includes an imaging element including a plurality of infrared detection pixels which are two-dimensionally arranged, a diaphragm, and a FPN calculation unit which acquires a first captured image data obtained by capturing an image using the imaging element in a state in which an F-number of the diaphragm is set to a first value and a second captured image data obtained by capturing an image using the imaging element in a state in which the F-number is set to a second value while a motion picture is being captured, and calculates fixed pattern noise included in captured image data obtained by capturing an image using the imaging element based on the acquired first captured image data, the acquired second captured image data, the first value, and the second value.

An optical device for detecting a first chemical species and a second chemical species contained in a specimen, which includes: a first optical sensor, which may be optically coupled to an optical source through the specimen and is sensitive to radiation having a wavelength comprised in a first range of wavelengths; and a second optical sensor, which may be optically coupled to the optical source through the specimen and is sensitive to radiation having a wavelength comprised in a second range of wavelengths, different from the first range of wavelengths.

An imaging module includes: a chip size package having an image sensor that has a light receiving unit on a front side of the image sensor, the chip size package having connection lands on a back side of the image sensor; a circuit board having connection electrodes being electrically and mechanically connected to the connection lands of the chip size package through bumps; and an underfill material filled into a gap between the chip size package and the circuit board. The circuit board and the underfill material are provided within a projection plane on which the chip size package is projected in an optical axis direction of the image sensor. The circuit board has a cutout portion on a side surface thereof orthogonal to a connection surface of the circuit board with the chip size package such that the cutout portion is open to at least the connection surface.