B81B1/00

LIQUID HANDLING DEVICE
20170314704 · 2017-11-02 · ·

A liquid handling device has an accommodation part for accommodating a liquid, two or more flow paths each opening to a lower part of a side wall surface of the accommodation part, and a liquid movement suppression part that is disposed in the lower part of the side wall between the openings of two of the flow paths that are adjacent to each other and slows or stops the movement of the liquid along the corner formed by the lower surface of the accommodation part and the side wall surface.

LIQUID HANDLING DEVICE
20170314704 · 2017-11-02 · ·

A liquid handling device has an accommodation part for accommodating a liquid, two or more flow paths each opening to a lower part of a side wall surface of the accommodation part, and a liquid movement suppression part that is disposed in the lower part of the side wall between the openings of two of the flow paths that are adjacent to each other and slows or stops the movement of the liquid along the corner formed by the lower surface of the accommodation part and the side wall surface.

Modular 3-D printed devices for sample delivery and method

A microfluidic device for use in a serial crystallography apparatus includes a modular 3D-printed nozzle having an inlet, an outlet, and a first snap engagement feature. The microfluidic device further includes a modular 3D-printed fiber holder having an outlet and a second snap engagement feature. The first snap engagement feature is configured to engage the second snap engagement feature to removably couple the nozzle to the fiber holder. The outlet of the fiber holder is aligned with the inlet of the nozzle when the first snap engagement feature is coupled to the second snap engagement feature.

VERTICAL MICROFLUIDIC PROBE HEAD WITH LARGE SCALE SURFACE PROCESSING APERTURES
20170304821 · 2017-10-26 ·

One or more embodiments of the present invention are directed to a vertical microfluidic probe head, which comprises a middle layer of material and two outer layers. The middle layer comprises two opposite, main surfaces, which are, each, grooved up to a same edge surface that adjoins each of the main surfaces, so as to form two sets of n microchannel cavities, n≧1, on each of the opposite main surfaces. The middle layer is furthermore arranged between the two outer layers, which (at least partly) close the microchannel cavities grooved on the two main surfaces. This way, two sets of n microchannels are formed, which are, each, open on the edge surface, such that two opposite sets of n orifices are formed on the edge surface. Thus, the length of the apertures is not limited by the thickness of the middle layer.

Particle extraction apparatus and particle extraction method

Provided is microparticle extraction technology capable of stably extracting only a target microparticle at high speed from a sheath flow flowing through a flow path. A particle extraction apparatus includes: a first extraction unit for extracting, from a whole sample containing a target particle, an extraction sample containing the target particle without performing abort processing; and a second extraction unit for subjecting the extraction sample to abort processing and extracting only the target particle.

Particle extraction apparatus and particle extraction method

Provided is microparticle extraction technology capable of stably extracting only a target microparticle at high speed from a sheath flow flowing through a flow path. A particle extraction apparatus includes: a first extraction unit for extracting, from a whole sample containing a target particle, an extraction sample containing the target particle without performing abort processing; and a second extraction unit for subjecting the extraction sample to abort processing and extracting only the target particle.

METHOD FOR MANUFACTURING IMPLANTABLE ELECTRODES AND ELECTRODES MADE BY SUCH METHODS
20230174372 · 2023-06-08 · ·

A method of manufacturing a plurality of neural probes from a silicon wafer in which after neural probes are formed on one side of a silicon wafer, the other side of the silicon wafter is subject to a dicing process that separates and adjusts the thickness of the neural probes.

Preparation method of bionic adhesive material with tip-expanded microstructural array

A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.

Disposable cartridge for microfluidics systems

A disposable cartridge used in a digital microfluidics system has a bottom layer with first hydrophobic surface, a rigid cover plate with second hydrophobic surface, and a gap there-between. The bottom layer is a flexible film on an uppermost surface of a cartridge accommodation site of a system, attracted to and spread over the uppermost surface by an underpressure. A lower surface of the plate and the flexible bottom layer are sealed to each other. The assembled cartridge is removed from the cartridge accommodation site in one piece and potentially includes samples and processing fluids. The system has a base unit and a cartridge accommodation site with an electrode array of individual electrodes and a central control unit for controlling selection of individual electrodes and for providing these electrodes with individual voltage pulses for manipulating liquid droplets within the gap by electrowetting.

ELECTRONIC PACKAGE INCLUDING CAVITY FORMED BY REMOVAL OF SACRIFICIAL MATERIAL FROM WITHIN A CAP

A method of fabricating an electronic component includes forming a functional unit on a main surface of a substrate, forming a sacrificial layer covering the functional unit on the main surface, forming a cap layer covering the sacrificial layer, the cap layer forming a periphery enclosing the cavity on the main surface, forming holes through the cap layer, forming a cavity by removing the sacrificial layer using a wet etching process through the holes, the holes including a peripheral hole communicating an inside of the cavity with an outside of the cavity along the main surface, and forming a first resin layer covering the cap layer and the main surface.