A method and a device for stringing together objects in transport systems, preferably in coating systems, for adjusting the distance between two objects, preferably substrates or substrate holders, being arranged one behind the other, wherein the front object moves at a process speed v.sub.p in the transport system and the rear object is at an undefined distance from the front object. The method comprises the following steps: (a) accelerating the rear substrate to an initial speed v.sub.x>v.sub.p; (b) detecting an increase in the driving torque when the rear substrate moves against the front substrate; (c) delaying the rear substrate by a predetermined value in order to establish a predetermined distance a.sub.p from the front substrate; and (d) adjusting the speed of the rear substrate to the process speed v.sub.p.

A method and a device for stringing together objects in transport systems, preferably in coating systems, for adjusting the distance between two objects, preferably substrates or substrate holders, being arranged one behind the other, wherein the front object moves at a process speed v.sub.p in the transport system and the rear object is at an undefined distance from the front object. The method comprises the following steps: (a) accelerating the rear substrate to an initial speed v.sub.x>v.sub.p; (b) detecting an increase in the driving torque when the rear substrate moves against the front substrate; (c) delaying the rear substrate by a predetermined value in order to establish a predetermined distance a.sub.p from the front substrate; and (d) adjusting the speed of the rear substrate to the process speed v.sub.p.

An incremental forming tool of the present invention includes a holding portion attached to an incremental forming apparatus and a free curved surface part for pressing a metal plate.

The free curved surface part is made of at least a hard metal base material and a surface of the free curved surface part is covered with a hard film.

The surface of the hard film has an Rpk of 0.15 μm or less, the Rpk is defined by JIS B 0671 and is calculated from a material ratio curve of a roughness curve, and has an Ra of 0.2 μm or less, the Ra is defined by JIS B 0601 and is calculated from a roughness curve. Therefore, a molded product having a smooth worked surface with no roughness can be produced without adding any extra equipment for preventing adhesion.

An electronic device manufacturing system capable of obtaining metrology data generated using metrology equipment located within a process chamber that performs a deposition process on a substrate according to a process recipe, wherein the process recipe comprises a plurality of setting parameters, and wherein the deposition process generates a plurality of film layers on a surface of the substrate. The manufacturing system can further generate a correction profile based on the metrology data. The manufacturing system can further generate an updated process recipe by applying the correction profile to the process recipe. The manufacturing system can further cause an etch process to be performed on the substrate according to the updated process recipe.

Provided is a plasma treatment apparatus capable of uniform substrate treatment by correction of unevenness in a plasma density distribution. The apparatus has a configuration such that a substrate is treated with plasma, and an evacuated container is provided with an annular antenna arranged around an outer periphery of the container, and is formed of a power supply container, and a process container where the substrate is placed, which communicates with an internal space of the power supply container. The plasma is generated in the power supply container by radio-frequency power supplied to the antenna. The plasma is diffused into the process container by a magnetic field of solenoid coils arranged around an outer periphery of the antenna. The inclination of the magnetic field is adjusted by an inclination adjustment means for adjusting the inclination of the solenoid coils with respect to the process substrate.

A jet-black coating that resists wear; first, at least one DLC layer with a high degree of hardness is applied to a component and then a gradient layer, whose density decreases in the direction toward the surface, is applied to this DLC layer. By means of the refraction index progression that this produces in the gradient layer, the gradient layer functions as a reflection-reducing layer.

An apparatus and method for arranging a precursor vapor flow through a vertical atomic layer deposition (ALD) cartridge along a top-to-bottom vertical channel in a central area of the cartridge, and for moving particulate material to be ALD processed in the cartridge upwards, upon rotation, by a threaded area substantially extending from the vertical channel to a side wall of the cartridge, and downwards along the vertical channel to cause the particulate material to cycle during ALD processing.

Provided are a purge gas spraying plate and a fume removing apparatus, and more particularly, a purge gas spraying plate capable of spraying a purge gas, which sprays the purge gas along a curvature of a wafer and efficiently removes fumes remaining on the wafer because a concave portion is formed at one side thereof and a spraying hole and a support member configured to support the wafer are formed in the concave portion, and a fume removing apparatus having the same.

Methods for selectively depositing on non-metallic surfaces are disclosed. Some embodiments of the disclosure utilize an unsaturated hydrocarbon to form a blocking layer on metallic surfaces. Deposition is performed to selectively deposit on the unblocked non-metallic surfaces. Some embodiments of the disclosure relate to methods of forming metallic vias with decreased resistance.

The present invention relates generally to the field of microelectronics, and more particularly to a structure and method of forming a biosensor having a nucleotide attracting surface tailored to reduce false detection of nucleotides and enabling optical detection of nucleotides. The biosensor may include an analyte-affinity layer on an upper surface of a dielectric layer. The analyte-affinity layer may include a plurality of cylindrical gold portions with dimensions tailored for a target analyte. A distance between adjacent portions of the plurality of portions may range from approximately 50% of a length of a target analyte to approximately 300% of a length of a target analyte. The plurality of portions of the analyte-affinity layer have an upper surface with a diameter ranging from approximately 3 nm to approximately 20 nm.