A heat treatment apparatus according to one aspect of the present disclosure includes a vertically long process chamber, a heater configured to heat the process chamber, and a cooler configured to cool the process chamber. The cooler includes a plurality of discharge holes provided at intervals along a longitudinal direction of the process chamber to discharge cooling fluid toward the process chamber and a plurality of shutters provided corresponding to the plurality of discharge holes. At least one of the plurality of shutters is configured to move to an open position independently of other shutters.

Apparatus for pyrolyzing or gasifying the organic content of material, including organically coated waste, biomass, industrial waste, municipal solid waste and sludge, having organic content; the apparatus comprising: an oven having a rotatable portion comprising a treatment chamber adapted to receive material for treatment; a plurality of gas inlets in at least one wall (5) of the treatment chamber through which hot gases are introduced to the treatment chamber to heat the material therein so as to cause the organic components thereof to pyrolyze or gasify; and a plurality of pockets (8) having open faces turned inwardly towards the inside of the treatment chamber on at least one wall of the rotatable portion such that, in use, material being pyrolyzed or gasified can be received from the treatment chamber into the plurality of pockets (8) via said open faces, and be substantially retained therein through an initial rotation of the oven of less than 90 degrees.

A heat treatment system includes heating chambers configured to perform heat treatment on objects to be treated, and a conveyance device configured to load each of the objects to be treated into the heating chambers, unload the object to be treated from the heating chambers, and convey the object to be treated under an oxygen-free atmosphere, wherein the conveyance device includes a cooling device configured to perform cooling treatment on the object to be treated.

The present disclosure relates to a device and a method for baking a substrate. The device includes a hot plate, and a supporting member for supporting a substrate to be processed, wherein the supporting member is located between the hot plate and the substrate to be processed, and can move relative to the hot plate so as to adjust the contacting position of the supporting member with the substrate to be processed. With the device, the yield of the substrate can be increased.

A heat treatment apparatus includes: a reaction tube processing a plurality of substrates; a support member supporting the reaction tube; a flange protruding outwardly from a lower end of the reaction tube: a concave portion formed in an outer periphery of the flange; and a rotatable roller installed in a top surface of the support member. The rotatable roller engages the concave portion and positions the reaction tube in a circumferential direction.

The invention relates to a dental firing or press furnace (10) that enables the production of at least one dental restoration part (62). The dental firing or press furnace is provided with a firing space (12) that is heatable with the aid of a heating device (22), preferably, a resistance heating device. A heat-conducting element (50) having a specific thermal conductivity of at least 100 W/mK is arranged on the floor of the firing space (12).

According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: (a) heating a heat insulating plate in a substrate retainer to a processing temperature by an electromagnetic wave, and measuring a temperature change of the heat insulating plate by a non-contact type thermometer until the processing temperature; (b) heating a test object provided with a chip that does not transmit a detection light of the thermometer and accommodated in the substrate retainer to the processing temperature, and measuring a temperature change of the chip by the thermometer until the processing temperature; (c) acquiring a correlation between the temperature change of the heat insulating plate and that of the chip based on measurement results; and (d) controlling a heater to heat the substrate based on the correlation and the temperature of the heat insulating plate measured by the thermometer.

A method includes supporting a wafer on a heating element, wherein the heating element is located in a baking chamber. The method further includes heating the wafer for a first duration using the heating element. The method further includes measuring a temperature of the heating element and a temperature of the wafer during the first duration to obtain temperature information. The method further includes adjusting an amount of heat provided by the heating element during the first duration, wherein the adjusting of the amount of heat includes decreasing the amount of heat provided by the heating element as a rate of change of the temperature information versus time increases.

Methods and systems for providing a short-duration anneal are provided. In one example, the methods and systems can include placing a workpiece in a thermal processing chamber. The workpiece can include a device side surface and an opposing non-device side surface. The methods and systems can include delivering an energy pulse from at least one heat source to the non-device side surface of the workpiece. In another example, the methods and systems can include depositing a layer of semiconductor material onto the semiconductor workpiece at the device side of the semiconductor workpiece. The methods and systems can include doping the layer of semiconductor material with a doping species and annealing the layer for crystallization using solid phase epitaxy.

An oven system includes an oven chamber defined by side walls and a top wall. The oven chamber includes a slot formed in the top wall. A conveyor rail extends longitudinally along the slot at a position outside of the oven chamber. A conveyor hanger is coupled to and movable along the conveyor rail to support a material within the oven chamber. A first support bracket and a second support bracket each extend longitudinally along a length of the top wall of the oven chamber. The second support bracket is spaced from the first support bracket to define the slot that extends longitudinally along the top wall of the oven chamber. A closure mechanism is coupled to the first and second support brackets to inhibit heat from releasing out of the oven chamber.