A vibration generating apparatus comprises a vibration apparatus and a vibration driving circuit including a driving signal generator configured to supply a driving signal to the vibration apparatus, wherein the driving signal generator is configured to adjust a frequency-based gain compensation value based on at least one of a circuit internal temperature value of the vibration driving circuit and a temperature prediction value of the vibration apparatus corresponding to a current value of an n.sup.th driving signal, compensate for a frequency-based gain value based on the adjusted frequency-based gain compensation value, compensate for an (n+1).sup.th driving signal based on the compensated frequency-based gain value, and supply the compensated (n+1).sup.th driving signal to the vibration apparatus.

A method for operating a battery sensor having at least one measuring resistor and at least one voltage capture device for capturing a voltage drop across the measuring resistor and for outputting at least one measured value dependent on the captured voltage drop and an evaluation circuit. The method including determining a correction value for the measured value by the evaluation circuit, and determining a first temperature value of the measuring resistor on the basis of the determined correction value by the evaluation circuit.

The present disclosure relates to a temperature measuring device for measuring a temperature of a pin-shaped electrical contact element, which includes a flexible circuit board with a first thermally conducting and electrically insulating substrate layer. The first substrate layer includes a contact surface that is configured to lie flat against a flange of the pin-shaped electrical contact element and an opening disposed in the contact surface. The pin-shaped electrical contact element is disposed at least partially in the opening. The flexible circuit board further includes a second thermally and electrically conducting layer that is disposed on a sensor surface opposite the contact surface of the first substrate layer and includes a sensor element connected to the sensor surface. The sensor element is configured to record a temperature of the pin-shaped electrical contact element when the pin-shaped electrical contact element is at least partially disposed in the opening.

A vibration generating apparatus comprises a vibration apparatus and a vibration driving circuit including a driving signal generator configured to supply a driving signal to the vibration apparatus, wherein the driving signal generator is configured to adjust a frequency-based gain compensation value based on at least one of a circuit internal temperature value of the vibration driving circuit and a temperature prediction value of the vibration apparatus corresponding to a current value of an n.sup.th driving signal, compensate for a frequency-based gain value based on the adjusted frequency-based gain compensation value, compensate for an (n+1).sup.th driving signal based on the compensated frequency-based gain value, and supply the compensated (n+1).sup.th driving signal to the vibration apparatus.

A method for determining the junction temperature of at least one die of a semiconductor power module, the semiconductor power module being composed of plural dies connected in parallel and switching between conducting and non conductor states according to pattern cycles, the method comprises the steps of: disabling the conducting of the at least one die during at least a fraction of one switching cycle, applying a current limited voltage to the gate of the at least one die during a period of time of the cycle wherein the at least one die is not conducting, the resulting voltage excursion having a value that does not enable the die to be conducting, measuring the voltage at the gate of the die, deriving from the measured voltage a temperature variation of the junction of the at least one die or the temperature of the junction of the die.

A dental oven for treatment of dental materials having one or more electric heating elements which extends adjacent to a heating space and is controlled by a heating controller. The heating controller regulates the temperature in the heating chamber and includes an output terminal for the heating element and an input terminal for temperature detection, which is electrically connected to a temperature detecting device, wherein the temperature detecting device has the one or more heating elements. The temperature sensing device includes a compensation device for compensation of nonlinearities at temperatures above 700° C. or in nonlinearities of the resistance of the heating element. The heating controller controls its output port based on the detected resistance of the heating element and on the compensation device.

Systems and methods are provided for controlling welding. One embodiment is a method for controlling welding. The method includes initiating induction welding by operating an induction coil along a weld interface of a first composite part comprising a matrix of thermoplastic reinforced by fibers, in order to join the first composite part to a second composite part, determining a measured magnetic field strength at a location distinct from the induction coil, and determining a welding temperature at the weld interface of the first composite part based on the measured magnetic field strength.

An integrated circuit includes a memory and peripheral circuits with a temperature sensor used to automatically adjust operating voltages. The temperature sensor includes a first circuit to generate a temperature-dependent voltage (TDV) that is dependent on an operating temperature of the integrated circuit, and a second circuit to generate a plurality of temperature reference voltages, based on or more codes. One or more comparator circuits compare individual ones of the plurality of reference voltages with the TDV, to generate one or more comparison signals that are indicative of the operating temperature of the integrated circuit.

The present invention concerns a method for controlling the temperature of a multi-die power module, a multi-die temperature control device. The multi-die temperature control: obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.

Method for measuring an operating temperature of a power module (10) that is used for operating an electric vehicle drive, the power module (10) comprising a plurality of semiconductor switching elements (14) and drive electronics (16), wherein the semiconductor switching elements (14) can be switched by the drive electronics (16) in such a way that the semiconductor switching elements (14) allow or interrupt a drain-source current in order to convert the direct current fed into the power module (10) at the input side into an output-side alternating current, wherein the method comprises measurement of a voltage present at a point located on a side of a diode (22) that is connected in series with the semiconductor switching element (14) and that faces away from the semiconductor switching element (14), wherein the method comprises measurement of a drain-source current of the semiconductor switching element (14) that is generated by a current source (18), wherein the method comprises determination of a mathematical dependency between the measured voltage and the measured current.