A probe card of a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane. Suitably, the testing head is arranged between the support plate and a first portion of the flexible membrane, which is connected to the support plate through a second portion thereof, the probe card further comprising a plurality of contact tips arranged on a first face of the flexible membrane at the first portion thereof, the second end portion of each contact element being apt to abut onto a second face of the flexible membrane, opposite to the first face, the number and distribution of the contact elements being different to the number and distribution of the contact tips.

A probe card of a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane. Suitably, the testing head is arranged between the support plate and a first portion of the flexible membrane, which is connected to the support plate through a second portion thereof, the probe card further comprising a plurality of contact tips arranged on a first face of the flexible membrane at the first portion thereof, the second end portion of each contact element being apt to abut onto a second face of the flexible membrane, opposite to the first face, the number and distribution of the contact elements being different to the number and distribution of the contact tips.

A method for repairing a test contact arrangement in which a test contact which is disposed on a test contact carrier by means of solder material and is incorrectly positioned is gripped at a body edge by means of a gripping tool in a gripping contact phase, an absorption surface which is realized on an outer surface of the gripping tool is treated with laser radiation during the gripping contact phase, and the gripping tool performs a movement on at least one axis when the temperature is at the softening point of the solder material, in such a manner that the incorrect position is corrected by means of the movement to bring the test contact into a desired position.

A method for repairing a test contact arrangement in which a test contact which is disposed on a test contact carrier by means of solder material and is incorrectly positioned is gripped at a body edge by means of a gripping tool in a gripping contact phase, an absorption surface which is realized on an outer surface of the gripping tool is treated with laser radiation during the gripping contact phase, and the gripping tool performs a movement on at least one axis when the temperature is at the softening point of the solder material, in such a manner that the incorrect position is corrected by means of the movement to bring the test contact into a desired position.

An irrigated electrophysiology catheter has a tip electrode having a shell, and a support member configured to plug the shell and support one or more tip components and/or facilitate their functions. Advantageously, the support member has an electrically-conductive interface portion and an insert-molded portion, wherein the interface portion, typically constructed of a precious metal alloy, is structurally minimized, yet still configured for electrical connection with the shell and the lead wire, so as to reduce the amount and hence the cost of its manufacture, whereas the insert-molded portion is constructed of a significantly less-costly material and is readily configured with micro-complex 3-D geometry adapted to support tip structure and functions including irrigation, force sensing and temperature sensing, as a further cost savings in the manufacturing of the tip electrode by reducing materials, labor and time.

A contact probe comprises a probe body being extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body. Suitably, the end portion comprises at least one indentation adapted to house a material scrap being on the contact probe after a separation from a substrate wherein the contact probe has been realized.

A contact probe comprises a probe body being extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body. Suitably, the end portion comprises at least one indentation adapted to house a material scrap being on the contact probe after a separation from a substrate wherein the contact probe has been realized.

An embodiment of the present invention provides a test socket for a semiconductor device, comprising: a base layer having a first surface and a second surface opposite to the first surface, and having, on the second surface, an external connection pad formed at a pitch corresponding to an electrode terminal of a test board; a plurality of circuit patterns formed to be partially exposed on the surface of the base layer and rearranged at a pitch corresponding to the external connection pad; a plurality of electrode patterns formed on the first surface to be electrically connected to the circuit patterns and an external connection terminal of a semiconductor device, and arranged at a pitch corresponding to the external connection terminal; and an elastic layer covering the electrode patterns such that the electrode patterns are partially exposed.

An embodiment of the present invention provides a test socket for a semiconductor device, comprising: a base layer having a first surface and a second surface opposite to the first surface, and having, on the second surface, an external connection pad formed at a pitch corresponding to an electrode terminal of a test board; a plurality of circuit patterns formed to be partially exposed on the surface of the base layer and rearranged at a pitch corresponding to the external connection pad; a plurality of electrode patterns formed on the first surface to be electrically connected to the circuit patterns and an external connection terminal of a semiconductor device, and arranged at a pitch corresponding to the external connection terminal; and an elastic layer covering the electrode patterns such that the electrode patterns are partially exposed.

Provided is a conduction inspection device member, wherein cracks and voids are less likely to form in conductive parts, conduction performance is less likely to be impaired even when a conduction test is repeated, and contact marks are less likely to remain in the portion of the member in contact with a member to be tested. Also provided is a conduction inspection device comprising the conduction inspection device member. The conduction inspection device member comprises a substrate 13, through holes 11, and conductive parts 12. The multiple through holes 11 are arranged in the substrate 13, the conductive parts 12 are housed inside the through holes 11, and the conductive parts 12 contain conductive particles 2. The conductive particles 2 each comprise a substrate particle 21 and a conductive layer 22 on the surface of the substrate particle 21. The conductive layer 22 has multiple protrusions 23 on the outer surface thereof.