An optical image lens system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element has positive refractive power. The second lens element has positive refractive power. The third lens element has positive refractive power. The fourth lens element has refractive power. The fifth lens element with refractive power has an image-side surface being convex in a paraxial region thereof, wherein at least one surface of the fifth lens element is aspheric. The sixth lens element with refractive power has an image-side surface being concave in a paraxial region thereof, wherein at least one surface of the sixth lens element is aspheric, and the image-side surface of the sixth lens element has at least one inflection point thereon.

Color mixing between pixels of different colors is suppressed. A solid-state imaging device includes: a semiconductor layer including a plurality of photoelectric conversion sections partitioned by an isolation region; a shared on-chip lens arranged on a light incident surface side of the semiconductor layer, the shared on-chip lens being shared by the photoelectric conversion sections adjacent to each other with the isolation region interposed between the photoelectric conversion sections, and having a condensing point positioned in the isolation region; and a concave portion provided in an upper portion of the photoelectric conversion sections that share the shared on-chip lens on the light incident surface of the semiconductor layer.

A process is provided for imaging a surface of a specimen with an imaging system that employs a BD objective having a darkfield channel and a bright field channel, the BD objective having a circumference. The specimen is obliquely illuminated through the darkfield channel with a first arced illuminating light that obliquely illuminates the specimen through a first arc of the circumference. The first arced illuminating light reflecting off of the surface of the specimen is recorded as a first image of the specimen from the first arced illuminating light reflecting off the surface of the specimen, and a processor generates a 3D topography of the specimen by processing the first image through a topographical imaging technique. Imaging apparatus is also provided as are further process steps for other embodiments.

A laser processing device for forming vias has a galvo mirror module, a first lens, a second lens, a focusing module, and a laser source. The laser source emits a laser beam through the first lens and the second lens to convert the laser beam into an incident ring beam. The galvo mirror module reflects the incident ring beam into a reflected ring beam into the focusing module to convert the reflected ring beam into a Bessel-like beam. The galvo mirror module has a scanning direction and shifts a reflection direction of the reflected ring beam to move an end of the reflected ring beam along the scanning direction. The focusing module has a third lens linearly slid along the scanning direction to reduce variations in shape and laser fluence of the Bessel-like beam focused at different positions.

The present disclosure relates to a light-emitting device (100), comprising a dielectric layer (110) including a plurality of first quantum dots (112) embedded therein, wherein the plurality of first quantum dots (112) is configured to emit light of a first color; and a metamaterial structure (120) embedded in the dielectric layer (110), wherein the metamaterial structure (120) is configured to convert at least a portion of an energy released by the plurality of first quantum dots into surface plasmons.

An aperture structure for a substrate for an optical device includes an optical cavity layer, a light absorbing layer, and a blocking layer. The optical cavity layer includes a dielectric material and is characterized by a refractive index of about 1.4 or greater, as measured at a wavelength of 550 nm. The light absorbing layer includes a metal or a metal alloy and is characterized by an extinction coefficient k of at least 1, as measured at a wavelength of 550 nm. The blocking layer includes a metal or a metal alloy and is characterized by an optical density of at least 3 at each wavelength of light in the range from 400 nm to 700 nm. The aperture structure includes a reflectance of less than 5% at each wavelength of light in the range from 400 nm to 700 nm, as measured through the substrate.

A high-performance optical absorber is provided having a texturized base layer. The base layer has one or more of a polymer film and a polymer coating. A surface layer is located above and immediately adjacent to the base layer and the surface layer joined to the base layer. The surface layer comprises a plasma-functionalized, non-woven carbon nanotube (CNT) sheet, wherein the base layer texturization comprises one or more of substantially rectangular ridges, substantially triangular ridges, substantially pyramidal ridges, and truncated, substantially pyramidal ridges. The CNT sheet has a thickness greater than or equal to 10×λ, where λ is the wavelength of the incident light. In certain embodiments the base layer has a height above the surface layer greater than or equal to 10×λ, where λ is the wavelength of the incident light.

A display apparatus includes: a display including a display surface on which an image is displayed; and a decorative layer that is arranged on the display surface side of the display and includes a base layer and a design layer each formed to cover the display surface. The base layer includes a light diffusing material. A plurality of microholes are formed through the base layer. The design layer is formed to cover the plurality of microholes and a non-opening portion of the base layer.

This application provides a spoof surface plasmon polariton transmission line structure, a circuit board, and an electronic device, to reduce a size of the SSPP transmission line structure. The SSPP transmission line structure includes a first dielectric substrate, a first metal strip, and a second metal strip. The first metal strip and the second metal strip are respectively disposed on two opposite surfaces of the first dielectric substrate, the first metal strip and the second metal strip separately extend in a first direction, and a length of the first metal strip in the first direction is less than a length of the second metal strip in the first direction. In the first direction, a cross-sectional area of the first metal strip gradually decreases, and at least one side of the second metal strip has a plurality of protrusion parts spaced apart.

This application provides an OLED display module and a display apparatus. The display module includes a display layer and a circular polarizer that are stacked, and a light enhancement layer and a light absorption layer that are stacked. The light enhancement layer and the light absorption layer are stacked between the display layer and the circular polarizer. The display layer has a pixel area and a non-pixel area. The light absorption layer is configured to transmit a light ray emitted from the pixel area and absorb a light ray emitted from the non-pixel area. The light ray that passes through the light absorption layer includes a light ray in a first polarization state and a light ray in a second polarization state.