Patent classifications
H01F5/00
Coil component
A coil component capable of matching characteristic impedance (Zo) includes an insulating layer in which coil conductors are embedded; a first magnetic member disposed to be in contact with one surface of the insulating layer; and a second magnetic member having permeability lower than that of the first magnetic member and disposed to be in contact with the other surface of the insulating layer. An interval L1 between the second magnetic member and the coil conductors depends on an intended impedance value.
Electronic component
An electronic component includes a magnetic body; internal coil parts including coil conductors disposed on one surface and the other surface of a support member; and a spacer part disposed between the internal coil parts, wherein the internal coil parts include: first and second internal coil parts embedded in the magnetic body to be spaced apart from each other by a predetermined distance in a thickness direction of the magnetic body; and third and fourth internal coil parts embedded in the magnetic body to be spaced apart from each other by a predetermined distance in the thickness direction and to be spaced apart from the first and second internal coil parts by a predetermined distance in a length direction of the magnetic body, and the spacer part is disposed between the first and second internal coil parts and the third and fourth internal coil parts.
High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
THIN FILM COIL AND ELECTRONIC DEVICE HAVING THE SAME
There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.
COIL MODULE, ACTUATOR PROVIDED WITH COIL MODULE, AND METHOD FOR MANUFACTURING COIL MODULE
A coil module includes a conductor layer, at least one element, and a sealing resin. The conductor layer is formed along a predetermined plane and includes a wiring portion and a helical-shaped coil portion. The at least one element is mounted on the wiring portion. The sealing resin covers the conductor layer and the at least one element. The sealing resin is integrally formed of a single type of resin material and has a predetermined thickness in a first direction perpendicular to the plane.
Printed circuit board having a layer structure
The invention relates to a printed circuit board having a layer structure, which accommodates a plurality of electric circuits. The electric circuits are separated from each other by an insulating barrier layer having a minimum thickness (Di) and a minimum distance (D0) between conductive components of the electric circuits.
Printed circuit board having a layer structure
The invention relates to a printed circuit board having a layer structure, which accommodates a plurality of electric circuits. The electric circuits are separated from each other by an insulating barrier layer having a minimum thickness (Di) and a minimum distance (D0) between conductive components of the electric circuits.
Coil component
Disclosed herein is a coil component that includes a substrate having a first surface and a first spiral coil spirally wound in a plurality of turns formed on the first surface of the substrate. Each of the turns has a first circumference region in which a radial position is substantially fixed and a first shift region in which a radial position is shifted. Each of inner and outer peripheral ends of the first spiral coil is positioned at the first shift region.
Magnetic sheet, wireless charging sheet and method for manufacturing magnetic sheet
The present invention relates to a magnetic sheet, a wireless charging sheet, and a method for manufacturing a magnetic sheet. According to an embodiment of the present invention, a magnetic sheet used in a wireless charging sheet, which includes a metal sheet layer consisting of a plurality of divided segments; and an insulating material filled in a dividing space between the segments and forms a magnetic path of a magnetic field generated around a coil, is provided. Further, a wireless charging sheet and a method for manufacturing a magnetic sheet are provided.