A thin film inductor is disclosed, which includes a thin film magnetic core. The thin film magnetic core includes at least one magnetic thin film. In each magnetic thin film, at least one type-1 gap is provided. A length direction of the type-1 gap is parallel to a direction of hard magnetization of the magnetic thin film. If the thin film magnetic core comprises at least two magnetic thin films, the at least two magnetic thin films are laminated and overlap each other. A sum of widths of all type-1 gaps in each magnetic thin film is the same.

A system includes a magnetic material supply for regulating a magnetic material flow rate of a magnetic material and a binder material supply for regulating a binder material flow rate of a binder material. A nozzle is configured for depositing a deposition mixture of the magnetic material and the binder material on a surface and a preheater is configured to preheat the deposition mixture before depositing on the surface. A controller is in operative communication with the magnetic material supply, the binder material supply, and the preheater. The controller is configured to receive an inductor core design file that represents a geometry and a magnetic permeability distribution of an inductor core, move the nozzle to one or more deposition locations, and adjust the magnetic material flow rate to the binder material flow rate to achieve a deposition mixture having a desired magnetic permeability at the deposition locations.

An assembly includes an electromagnetic coil with a conductor, and a substrate on which the conductor is arranged. The coil has a core and the conductor extends around the core. The core is formed by a ferromagnetic rivet that is fastened to the substrate.

The present disclosure relates to semiconductor structures and, more particularly, to series inductors and methods of manufacture. A structure includes a plurality of wiring levels each of which include a wiring structure connected in series to one another. A second wiring level being located above a first wiring level of the plurality of wiring levels. A wiring structure on the second wiring level being at least partially outside boundaries of the wiring structure of the first wiring level.

A multilayer coil component that includes a multilayer body in which a plurality of insulating layers are stacked in a stacking direction and a coil inside the multilayer body, and outer electrodes that are on surfaces of the multilayer body and are electrically connected to the coil. The insulating layers include a spinel-structure ferrite phase and a ZnFe(BO.sub.3)O-type crystalline phase.

An inductor component comprising a base body comprising a filler; a coil in the base body and helically wound along an axis; and external electrodes in the base body and each electrically connected to the coil, with outer faces of the external electrodes exposed from the base body. The base body comprises external electrode contact parts that each contact one of the external electrodes on an inner side of the base body and are each disposed along one of the external electrodes; and a central part that comprises a center point of the base body and is located away from the coil, the external electrodes, and the external electrode contact parts. A content rate of the filler in the external electrode contact parts is from a 0.9-fold level to a 1.1-fold level of a content rate of the filler in the central part.

An inductor includes a first conductor, a second conductor, an insulation film, and a magnetic body. The first conductor spirally extends in a plane. The second conductor spirally extends in a plane. The second conductor is stacked on and joined to the first conductor. The insulation film covers a surface of the first conductor and a surface of the second conductor. The magnetic body covers a surface of the insulation film and embeds the first conductor and the second conductor. The first conductor and the second conductor are connected to form a helical coil.

A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

The coil substrate may include a substrate; a first conductor layer including a plurality of first and second segments periodically disposed on a top and a bottom of the substrate; a second conductor layer including a plurality of first and second segments periodically overlapping the first conductor layer on the top and the bottom of the substrate; a first connection line that connects the first and second segments of the first conductor layer; and a second connection line that connects the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.

According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.