Patent classifications
H01F17/00
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
An electronic component includes a body, an inner conductor inside the body, and an outer electrode that lies on part of at least a first main surface of the body and includes an underlying electrode and a plating electrode with which the underlying electrode is covered. The underlying electrode includes a first underlying electrode on part of the first main surface and connected directly to the inner conductor and a second underlying electrode at part of the first main surface away from the first underlying electrode and closer than the first underlying electrode to the center of the body in the length direction and not connected directly to the inner conductor. The plating electrode includes first and second plating electrodes. The first underlying electrode is covered with the first plating electrode, and the second underlying electrode is covered with the second plating electrode.
INDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF
An inductor component comprising a base body including first and second magnetic layers laminated in order along a first direction; and an inductor wire between the first and second magnetic layers and on a plane that is orthogonal to the first direction. The first magnetic layer is in a reverse direction to the first direction of the inductor wire, the second magnetic layer is in the first direction of the inductor wire and in a direction that is orthogonal to the first direction, and when a main surface of the second magnetic layer is viewed from a direction which is orthogonal to the main surface of the second magnetic layer in the first direction, the second magnetic layer includes a dark region corresponding to the inductor wire and a bright region whose brightness is higher than that of the dark region.
Multilayer substrate and electronic device
A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.
Inductor device
An inductor device includes a first inductor unit and a second inductor unit. The first inductor unit includes a first side to a fourth side, a first wire, and a first input terminal. The first wire is winded to form a plurality of circles. The first wire is winded in an interlaced manner at one of the first to fourth sides of the first inductor unit. The first input terminal is disposed on one of the first to fourth sides. The second inductor unit includes a fifth side to an eighth side, a second wire, and a second input terminal. The second wire is winded to form a plurality of circles. The second wire is winded in an interlaced manner at one of the fifth to eighth sides of the second inductor unit. The second input terminal is disposed on one of the fifth to eighth sides.
LC composite component
An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.
COIL COMPONENT AND MANUFACTURING METHOD THEREFOR
To improve magnetic characteristics of a coil component having a structure in which an interlayer insulating film is provided between a spiral coil pattern and a magnetic element body. A coil component 1 includes: an interlayer insulating film 41 covering coil patterns CP1 to CP3 from one side in the axial direction of the coil patterns; a magnetic element body M1 filled in the inner diameter areas of the coil patterns CP1 to CP3; and a magnetic element body M2 covering the coil patterns CP1 to CP3 from the one side in the axial direction through the interlayer insulating film 41. The interlayer insulating film 41 has a protruding part 41A radially protruding to the inner diameter area, and the protruding part 41A is curved to the other side in the axial direction. Since the protruding part 41A is curved in the axial direction, the entrance of a magnetic path passing through the inner diameter area is made wider than when the protruding part 41A linearly protrudes to the inner diameter area. This suppresses deterioration in magnetic characteristics due to the presence of the protruding part 41A.
Magnetic Inlay With An Adjustable Inductance Value for a Component Carrier and a Manufacturing Method
A magnetic inlay for a component carrier includes a magnetic matrix and an electrically conductive structure embedded horizontally in the magnetic matrix. The electrically conductive structure is configured as an inductive element. The magnetic inlay is configured so that, depending on the geometrical properties of the electrically conductive structure, a specific inductance value is provided for the magnetic inlay.
Component Carrier With a Magnetic Element and a Manufacturing Method
A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.
Differential mode choke coil component
A differential mode choke coil component includes a substantially drum-shaped core, a substantially plate-shaped core, and first and second wires. The plate-shaped core is secured to each of the first and second flanges by using an adhesive with the first major surface facing the top surface of each of the first and second flanges with a spacing. The spacing has a mean value greater than or equal to about 20 μm between the first major surface and the top surface of each of the first and second flanges.
Inductive humidity sensor and method
Described examples include devices and methods for measuring relative humidity of an environment using inductance. The devices can include a resonant circuit, including a capacitor and an inductor. The inductor includes a moisture-absorbing core with at least a portion thereof exposed to an environment, with at least one magnetic property of the core being variable in response to changing levels of moisture in the environment. An excitation circuit provides an AC excitation signal to the resonant circuit. A sense circuit determines an inductance of the inductor according to a sense signal from the resonant circuit. The sense circuit is coupled to generate an output signal that indicates a humidity level of the environment according to the sense signal.