A capacitor includes an electrically insulating housing that encloses an interior volume, first and second conductive connection pads that are each configured as externally accessible points of electrical contact to internal electrodes of the capacitor that are disposed within the housing, and an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes, the first conductive connection pad having a first planar contact surface that is substantially parallel to a first sidewall of the housing, the second conductive connection pad having a second planar contact surface that is substantially parallel to the first sidewall, the first and second planar contact surfaces being offset from one another in a direction that is orthogonal to the first sidewall.

A capacitor includes an electrically insulating housing that encloses an interior volume, first and second conductive connection pads that are each configured as externally accessible points of electrical contact to internal electrodes of the capacitor that are disposed within the housing, and an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes, the first conductive connection pad having a first planar contact surface that is substantially parallel to a first sidewall of the housing, the second conductive connection pad having a second planar contact surface that is substantially parallel to the first sidewall, the first and second planar contact surfaces being offset from one another in a direction that is orthogonal to the first sidewall.

A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.

An electronic modulating device is provided. The electronic modulating device includes a first substrate, a second substrate, at least one working unit, and at least one adjustment structure. The first substrate includes a recess. The second substrate is disposed opposite to the first substrate. The at least one working unit includes a first cell gap and is disposed between the first substrate and the second substrate. The at least one working unit includes a modulating material. The at least one adjustment structure is disposed corresponding to the recess and includes a second cell gap and is disposed between the first substrate and the second substrate. The second cell gap is greater than the first cell gap.

An electronic modulating device is provided. The electronic modulating device includes a first substrate, a second substrate, at least one working unit, and at least one adjustment structure. The first substrate includes a recess. The second substrate is disposed opposite to the first substrate. The at least one working unit includes a first cell gap and is disposed between the first substrate and the second substrate. The at least one working unit includes a modulating material. The at least one adjustment structure is disposed corresponding to the recess and includes a second cell gap and is disposed between the first substrate and the second substrate. The second cell gap is greater than the first cell gap.

A submodule according to the present invention includes a power pack including a plurality of switching modules, first and second input busbars connected to the plurality of switching modules and protruding to a first outer side of the power pack, first and second connection busbars connected to the plurality of switching modules and protruding to a second outer side of the power pack, a capacitor pack including a capacitor element, and first and second connection units provided at both sides of one surface of the capacitor pack. The first and second connection busbars are inserted into the first and second connection units, respectively, such that the power pack and the capacitor pack are electrically connected to each other.

A submodule according to the present invention includes a power pack including a plurality of switching modules, first and second input busbars connected to the plurality of switching modules and protruding to a first outer side of the power pack, first and second connection busbars connected to the plurality of switching modules and protruding to a second outer side of the power pack, a capacitor pack including a capacitor element, and first and second connection units provided at both sides of one surface of the capacitor pack. The first and second connection busbars are inserted into the first and second connection units, respectively, such that the power pack and the capacitor pack are electrically connected to each other.

A filter component for filtering an interference signal. The filter component includes at least one multilayer ceramic capacitor having a main body, in which multiple ceramic layers and internal electrodes are stacked one above another, and connection contacts are arranged at the main body. The ceramic layers include a lead lanthanum zirconate titanate ceramic, for example.

The present invention relates to a multi-function electronic device having a memristor and a memcapacitor and a method for manufacturing the same. The multi-function electronic device having a memristor and a memcapacitor has a laminated structure of a first insulating layer comprising an organic material/an active layer/a second insulating layer comprising an organic material, and thus has a resistance and capacitance varying with the applied voltage.

The present invention relates to a multi-function electronic device having a memristor and a memcapacitor and a method for manufacturing the same. The multi-function electronic device having a memristor and a memcapacitor has a laminated structure of a first insulating layer comprising an organic material/an active layer/a second insulating layer comprising an organic material, and thus has a resistance and capacitance varying with the applied voltage.