A capacitor that includes a conductive porous substrate having a porous portion; a dielectric layer on the porous portion and containing an oxygen element and at least metal element; and an upper electrode on the dielectric layer. The porous portion has a path integral value of 1 m/m.sup.2 to 16 m/m.sup.2, and a porosity of 20% to 90%, and a ratio Z expressed by (1) below is 0.79 or more, $\begin{array}{cc}Z=\frac{O_d/M_d}{O_r/M_r}& \left(1\right)\end{array}$
where O.sub.d and M.sub.d respectively represent signal intensities of the oxygen element and the metal element when the dielectric layer is analyzed by energy dispersive X-ray spectroscopy (EDS), and where O.sub.r and M.sub.r respectively represent signal intensities of the oxygen element and the metal element when a reference material having stoichiometric composition of the oxygen element and the at least one metal element constituting the dielectric layer is analyzed by the EDS.

A capacitor that includes a conductive porous substrate having a porous portion; a dielectric layer on the porous portion and containing an oxygen element and at least metal element; and an upper electrode on the dielectric layer. The porous portion has a path integral value of 1 m/m.sup.2 to 16 m/m.sup.2, and a porosity of 20% to 90%, and a ratio Z expressed by (1) below is 0.79 or more, $\begin{array}{cc}Z=\frac{O_d/M_d}{O_r/M_r}& \left(1\right)\end{array}$
where O.sub.d and M.sub.d respectively represent signal intensities of the oxygen element and the metal element when the dielectric layer is analyzed by energy dispersive X-ray spectroscopy (EDS), and where O.sub.r and M.sub.r respectively represent signal intensities of the oxygen element and the metal element when a reference material having stoichiometric composition of the oxygen element and the at least one metal element constituting the dielectric layer is analyzed by the EDS.

An electronic component includes a multilayer body, first to fourth outer electrodes, a pair of first insulating coating portions, and a pair of second insulating coating portions. The pair of first insulating coating portions is in at least one of a state in which inner end portions are in contact with the third outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode. The pair of second insulating coating portions is in at least one of a state in which inner end portions are in contact with the fourth outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode.

A fan-out semiconductor package may include a support member having a through-hole, a semiconductor chip disposed in the through-hole, a component embedded structure disposed adjacent to and spaced apart from the semiconductor chip in the through-hole by a predetermined distance, an encapsulant, and a connection member. The semiconductor chip has an active surface having connection pads disposed thereon and an inactive surface opposing the active surface. The component embedded structure has a plurality of passive components embedded therein. The encapsulant encapsulates at least portions of the support member, the component embedded structure, and the semiconductor chip. The connection member is disposed on the support member, the component embedded structure, and the active surface of the semiconductor chip. The connection member includes redistribution layers and vias electrically connecting the redistribution layers to the plurality of passive components and the connection pads of the semiconductor chip.

A capacitor includes a body, first and second external electrodes, and first and second auxiliary external electrodes. The body includes first and second internal electrodes each having first and second lead portions exposed to one surface of the body. The first and second external electrodes are disposed on the one surface of the body and electrically connected to the first and second internal electrodes, respectively. The first and second auxiliary external electrodes are electrically connected to the first and second external electrodes, respectively, and cover portions of surfaces of the body connected to the one surface of the body.

A multilayer fringe capacitor includes first and second interdigitated capacitor electrodes, both parallel to and intersecting a first planar surface; third and fourth interdigitated capacitor electrodes, the first and second electrodes parallel to and separated by a non-zero distance from the third and fourth electrodes; a first set of coupling vias that electrically couples the first electrode to the third electrode; and a second set of coupling vias that electrically couples the second electrode to the fourth electrode.

A multilayer fringe capacitor includes first and second interdigitated capacitor electrodes, both parallel to and intersecting a first planar surface; third and fourth interdigitated capacitor electrodes, the first and second electrodes parallel to and separated by a non-zero distance from the third and fourth electrodes; a first set of coupling vias that electrically couples the first electrode to the third electrode; and a second set of coupling vias that electrically couples the second electrode to the fourth electrode.

In one embodiment, a system, comprising: a first non-magnetic conductive electrode; a second non-magnetic conductive electrode; a dielectric layer disposed between the first and second electrodes, the dielectric layer extending between the first and second electrodes; and first and second layers comprising plural pairs of magnetically coupled pairings of discrete magnets, the first and second layers separated by a non-magnetic material, wherein the magnets of at least the first layer are conductively connected to the first non-magnetic conductive electrode.

A multilayer electronic component includes: a body including dielectric layers and a plurality of internal electrodes stacked on each other in a first direction, while having the dielectric layer interposed therebetween; margin portions disposed on opposite surfaces of the body in a second direction perpendicular to the first direction; and external electrodes disposed on opposite surfaces of the body in a third direction perpendicular to the first and second directions, and respectively connected to the internal electrodes, wherein the margin portion includes a protection region, in which a plurality of metal particles are disposed, in at least one of upper and lower portions thereof in the first direction.

A film capacitor includes: a capacitor element in which a metallikon electrode is formed at an end; a bus bar connected with the metallikon electrode; a case having a container for housing the capacitor element and the bus bar; a lid member which covers an opening of the container; and a heat conducting member disposed between the bus bar and the lid member. The lid member has a protrusion on a side facing the heat conducting member, the protrusion is in contact with the heat conducting member, and the heat conducting member is in contact with the bus bar.