Patent classifications
C23C14/5806
METHODS AND APPARATUS FOR SEMI-DYNAMIC BOTTOM UP REFLOW
A method of filling structures on a substrate uses a semi-dynamic reflow process. The method may include depositing a metallic material on the substrate at a first temperature, heating the substrate to a second temperature higher than the first temperature wherein heating of the substrate causes a static reflow of the deposited metallic material on the substrate, stopping heating of the substrate, and depositing additional metallic material on the substrate causing a dynamic reflow of the deposited additional metallic material on the substrate. RF bias power may be applied during the dynamic reflow to facilitate in maintaining the temperature of the substrate.
COMPONENT AND SEMICONDUCTOR MANUFACTURING DEVICE
A component includes a film containing polycrystalline yttrium oxide. In an X-ray diffraction pattern of the film, a ratio I.sub.m/I.sub.c of a maximum intensity I.sub.m of a peak attributed to monoclinic yttrium oxide to a maximum intensity I.sub.c of a peak attributed to cubic yttrium oxide satisfies an expression: 0≤I.sub.m/I.sub.c≤0.002.
DEPOSITION PROCESS FOR PIEZOELECTRIC COATINGS
A method to deposit a coating including a material with highly oriented microstructure, the method including at least the following sequence of process steps: providing a flat substrate into a first vacuum processing chamber; etching one surface of the substrate by physical vapor etching; depositing a first metallic layer on the etched substrate surface by sputtering in a first metal deposition step; annealing the first metallic layer at an annealing temperature at least 50° C. higher than a compound deposition temperature of the subsequent compound deposition step; depositing a first compound layer at the compound deposition temperature on the outer surface of the first metallic layer by reactive sputtering in a first compound deposition step; and depositing a second metallic layer on the outer surface of the first compound layer by sputtering in a second metal deposition step.
Iron nitride magnetic material including coated nanoparticles
The disclosure describes techniques for forming nanoparticles including Fe.sub.16N.sub.2 phase. In some examples, the nanoparticles may be formed by first forming nanoparticles including iron, nitrogen, and at least one of carbon or boron. The carbon or boron may be incorporated into the nanoparticles such that the iron, nitrogen, and at least one of carbon or boron are mixed. Alternatively, the at least one of carbon or boron may be coated on a surface of a nanoparticle including iron and nitrogen. The nano particle including iron, nitrogen, and at least one of carbon or boron then may be annealed to form at least one phase domain including at least one of Fe.sub.16N.sub.2, Fe.sub.16(NB).sub.2, Fe.sub.16(NC).sub.2, or Fe.sub.16(NCB).sub.2.
Zinc alloy plated steel having excellent weldability and corrosion resistance
Provided are a zinc alloy plated steel and a method for manufacturing same, the zinc alloy plated steel comprising: a base iron; a Zn plated layer formed on top of the base iron; and a Zn—Mg alloy layer formed on top of the Zn plated layer and obtained through mutual diffusion of Zn and Mg, wherein the ratio of the weight of Mg contained in the Zn—Mg alloy layer with respect to the total weight of the Zn plated layer and the Zn—Mg alloy layer is 0.13 to 0.24, and the sum of the adhesion quantity of the Zn layer and the Zn—Mg alloy layer is no more than 40 g/m.sup.2 (more than 0 g/m.sup.2).
ELECTROCHROMIC DEVICES
Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer, which are in direct contact with one another. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. In addition to the improved electrochromic devices and methods for fabrication, integrated deposition systems for forming such improved devices are also disclosed.
METHOD OF FLUORESCENT NANODIAMONDS PRODUCTION
The present invention relates to a fluorescent nanodiamond preparing method including a first operation of preparing nanodiamonds having an average particle diameter of 10 nm or less, a second operation of implanting plasma ions into the nanodiamonds, a third operation of heat-treating the nanodiamonds implanted with the plasma ions under a vacuum or inert gas atmosphere, a fourth operation of oxygen treatment of the heat-treated nanodiamonds under a gas atmosphere including oxygen to oxidize the surfaces of the nanodiamonds, a fifth operation of acid-treating the oxygen-treated nanodiamonds, a sixth operation of centrifuging and cleaning the acid-treated nanodiamonds, and a seventh operation of drying the cleaned nanodiamonds, wherein, in the second operation, the plasma ions are implanted at an incident ion dose of 10.sup.13 ions/cm.sup.2 or more and 10.sup.20 ions/cm.sup.2 or less.
ULTRA-LOW DENSITY METALLIC COATINGS
Forming a porous multilayer material includes forming a multilayer material on a substrate. Forming the multilayer material includes alternately forming a sacrificial layer and a semi-sacrificial layer, where the sacrificial layer includes a first metal and the semi-sacrificial layer includes the first metal and a second metal or metallic alloy. Forming the porous multilayer material further includes removing at least a portion of the first metal from each of the sacrificial and semi-sacrificial layers to yield the porous multilayer material. The porous multilayer material includes a multiplicity of metal-containing layers, each layer having a thickness in a range between about 5 nm and about 100 nm and bonded to an adjacent layer. Each layer includes chromium, niobium, tantalum, vanadium, molybdenum, tungsten, or a combination thereof. A void is defined between each pair of layers, and a density of porous the multilayer material is <1% bulk density.
Counter electrode for electrochromic devices
The embodiments herein relate to electrochromic stacks, electrochromic devices, and methods and apparatus for making such stacks and devices. In various embodiments, an anodically coloring layer in an electrochromic stack or device is fabricated to include a heterogeneous structure, for example a heterogeneous composition and/or morphology. Such heterogeneous anodically coloring layers can be used to better tune the properties of a device.
PROMOTING ADHESION OF THIN FILMS
The invention relates to a method for adhesion of a thin film or functional layer to a substrate by applying a pulsed and/or alternating voltage.