A coating device for a tube-type PERC solar cell includes a wafer loading area, a furnace body, a gas cabinet, a vacuum system, a heating system, a control system and a graphite boat, wherein the gas cabinet is provided with a first gas line for feeding silane, a second gas line for feeding ammonia, a third gas line for feeding trimethylaluminum, a fourth gas line for feeding nitrous oxide, and a fifth gas line for feeding methane. The graphite boat is employed for loading and unloading a silicon wafer. Pre-processing is performed to the graphite boat before use or after several coating, wherein the pre-processing includes: baking the graphite boat and coating at least one layer of silicon carbide film on a surface of the baked graphite boat. The present application also discloses a coating method for a tube-type PERC solar cell.

An MOCVD system fabricates high quality superconductor tapes with variable thicknesses. The MOCVD system can include a gas flow chamber between two parallel channels in a housing. A substrate tape is heated and then passed through the MOCVD housing such that the gas flow is perpendicular to the tape's surface. Precursors are injected into the gas flow for deposition on the substrate tape. In this way, superconductor tapes can be fabricated with variable thicknesses, uniform precursor deposition, and high critical current densities.

Disclosed is a heat spreader. The heat spreader comprises a copper substrate layer, and at least one layer of graphene deposited on the copper substrate layer.

The present disclosure provides methods for forming diamond nanostructures and diamonds from amorphous carbon nanostructures in ambient temperature and pressure by irradiating carbon nanostructures to an undercooled state and quenching the melted carbon to convert a portion of the nanostructure into diamond.

A method for selectively depositing an amorphous silicon film on a substrate comprising a metallic nitride surface and a metallic oxide surface is disclosed. The method may include; providing a substrate within a reaction chamber, heating the substrate to a deposition temperature, contacting the substrate with silicon iodide precursor, and selectively depositing the amorphous silicon film on the metallic nitride surface relative to the metallic oxide surface. Semiconductor device structures including an amorphous silicon film deposited by selective deposition methods are also disclosed.

A method for manufacturing a functionalized graphene structure includes preparing a substrate having a graphene layer, forming an organic linker layer by providing an organic linker on the graphene layer, and forming a dopant layer by providing a dopant material including a metal on the organic linker layer. The organic linker layer and the dopant layer are formed in-situ.

The present disclosure provides a heat treatment apparatus (100) for use in a vacuum chamber (101). The heat treatment apparatus (100) includes a transport arrangement configured to apply a tension to a flexible substrate (10) in a longitudinal direction, wherein the transport arrangement comprises a drum (110), and a heating device configured to heat the drum (110) for heating the flexible substrate (10) to a first temperature of 120 C. to 180 C.

A method for forming a semiconductor structure is provided. The method includes forming a first material and a second material on a semiconductor substrate. The first material is different from the second material. The method also includes heating the first material to a first temperature and the second material to a second temperature with a laser beam. The first temperature is different from the second temperature. The method also includes depositing a third material on the first material.

An object is to provide a method of producing a semiconductor epitaxial wafer having higher gettering capability and a reduced haze level of the surface of a semiconductor epitaxial layer.

The method of producing a semiconductor epitaxial wafer, according to the present invention includes: a first step of irradiating a semiconductor wafer 10 with cluster ions 16 thereby forming a modifying layer 18 formed from a constituent element of the cluster ions 16 contained as a solid solution, in a surface portion 10A of the semiconductor wafer; a second step of performing heat treatment for crystallinity recovery on the semiconductor wafer 10 after the first step such that the haze level of the semiconductor wafer surface portion 10A is 0.20 ppm or less; and a third step of forming an epitaxial layer 20 on the modifying layer 18 of the semiconductor wafer after the second step.

The instant disclosure is related to the growth of carbon-based nanostructures and associated systems and products. Certain embodiments are related to carbon-based nanostructure growth using active growth materials comprises at least two components that are capable of forming a eutectic composition with each other. In some embodiments, the growth of carbon-based nanostructures is performed using active growth materials comprising at least two types of cations.