Devices, systems, and methods are contemplated for depositing metals to the surface of a substrate. A first precursor ink including a metal is applied to a surface of the substrate, and the precursor ink is reduced to deposit the metal to the substrate, preferably by thermal reduction, forming a first metal layer. A second precursor ink having a second metal is then applied to the substrate, at least partially over the first metal layer. The second precursor ink is then reduced, typically by chemical reduction, depositing the second metal over the first metal layer in a globular fashion. Precursor inks are also disclosed having an alkyl metal carboxylate, a cyclic amine, and at least one of an ester, a hydrocarbon, or an ether.

The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) sealing the package provided in step (ii). The present invention also pertains to said package, to a process for the manufacture of said package and to uses of said package in various applications.

The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) sealing the package provided in step (ii). The present invention also pertains to said package, to a process for the manufacture of said package and to uses of said package in various applications.

A low-alloy and corrosion-resistant steel for a vehicle, may include about 0.001 wt % to about 0.1 wt % of C, about 0.01 wt % to about 0.5 wt % of Si, about 0.1 wt % to about 0.6 wt % of Mn, more than 0 wt % and about 0.18 wt % or less of P, more than 0 wt % and less than about 0.02 wt % of S, about 0.001 wt % to about 0.03 wt % of Nb, more than 0 wt % and about 0.03 wt % or less of Cr, about 0.05 wt % to about 0.3 wt % of Cu, about 0.05 wt % to about 0.2 wt % of Ni, and more than 0 wt % and about 0.2 wt % or less of a combined weight of Sn and Sb, and the balance iron and inevitable impurities.

A low-alloy and corrosion-resistant steel for a vehicle, may include about 0.001 wt % to about 0.1 wt % of C, about 0.01 wt % to about 0.5 wt % of Si, about 0.1 wt % to about 0.6 wt % of Mn, more than 0 wt % and about 0.18 wt % or less of P, more than 0 wt % and less than about 0.02 wt % of S, about 0.001 wt % to about 0.03 wt % of Nb, more than 0 wt % and about 0.03 wt % or less of Cr, about 0.05 wt % to about 0.3 wt % of Cu, about 0.05 wt % to about 0.2 wt % of Ni, and more than 0 wt % and about 0.2 wt % or less of a combined weight of Sn and Sb, and the balance iron and inevitable impurities.

This chemical conversion-treated steel sheet (10) has a chemical conversion treatment coating (12) upon a plating layer (17) of a steel sheet (11). The chemical conversion treatment coating (12) contains a fluororesin, a base resin which is a resin other than a fluororesin, metal flakes (13), and a chemical conversion treatment component. The content of the fluororesin in relation to the total quantity of resins is 3.0 mass % or more in terms of fluorine atoms, the content of the base resin in relation to 100 parts by mass of the fluororesin is 10 parts by mass or more, and the content of metal flakes (13) in the chemical conversion treatment coating (12) is more than 20 mass % but at most 60 mass %.

This chemical conversion-treated steel sheet (10) has a chemical conversion treatment coating (12) upon a plating layer (17) of a steel sheet (11). The chemical conversion treatment coating (12) contains a fluororesin, a base resin which is a resin other than a fluororesin, metal flakes (13), and a chemical conversion treatment component. The content of the fluororesin in relation to the total quantity of resins is 3.0 mass % or more in terms of fluorine atoms, the content of the base resin in relation to 100 parts by mass of the fluororesin is 10 parts by mass or more, and the content of metal flakes (13) in the chemical conversion treatment coating (12) is more than 20 mass % but at most 60 mass %.

An oxygen-free or oxygen-poor solution for the electroless deposition of a platinum group metal is described. The solution includes a ruthenium (II) amine complex having a first oxidation potential, and a platinum group metal compound having a reduction potential larger than the opposite of the oxidation potential of the ruthenium (II) amine complex.

Techniques are disclosed for providing cladded metal interconnects. Given an interconnect trench, a barrier layer is conformally deposited onto the bottom and sidewalls of the trench. A first layer of a bilayer adhesion liner is selectively deposited on the barrier layer, and a second layer of the bilayer adhesion liner is selectively deposited on the first layer. An interconnect metal is deposited into the trench above the bilayer adhesion liner. Any excess interconnect metal is recessed to get the top surface of the interconnect metal to a proper plane. Recessing the excess interconnect metal may include recessing previously deposited excess adhesion liner and barrier layer materials. The exposed top surface of the interconnect metal in the trench is then capped with the bilayer adhesion liner materials to provide a cladded metal interconnect core. In some embodiments, the adhesion liner is a single layer adhesion liner.

Techniques are disclosed for providing cladded metal interconnects. Given an interconnect trench, a barrier layer is conformally deposited onto the bottom and sidewalls of the trench. A first layer of a bilayer adhesion liner is selectively deposited on the barrier layer, and a second layer of the bilayer adhesion liner is selectively deposited on the first layer. An interconnect metal is deposited into the trench above the bilayer adhesion liner. Any excess interconnect metal is recessed to get the top surface of the interconnect metal to a proper plane. Recessing the excess interconnect metal may include recessing previously deposited excess adhesion liner and barrier layer materials. The exposed top surface of the interconnect metal in the trench is then capped with the bilayer adhesion liner materials to provide a cladded metal interconnect core. In some embodiments, the adhesion liner is a single layer adhesion liner.