A stretchable wiring film includes: (A) a stretchable film made of, at least as a top surface of the stretchable film, a cured product of a stretchable film material containing a silicone polyurethane resin; and (B) a stretchable wiring. The top surface of the stretchable film has a repeated uneven pattern formed with depths of 0.1 μm to 5 mm and pitches of 0.1 μm to 10 mm. The stretchable wiring is formed on the top surface of the stretchable film where the repeated uneven pattern is formed. Thus, the present invention provides: a stretchable wiring film having less decrease in electric conductivity in stretching and excellent water repellency on the film top surface; and a method for forming the stretchable wiring film.

Disclosed are a near-infrared absorbing composition, an optical structure, and a camera module and an electronic device including the same. The near-infrared absorbing composition includes a copper salt capable of absorbing light in a near-infrared wavelength region and an amine compound, wherein the amine compound includes a first amine compound having no polymerizable functional group and a second amine compound including at least monofunctional polymerizable functional group.

Disclosed are a near-infrared absorbing composition, an optical structure, and a camera module and an electronic device including the same. The near-infrared absorbing composition includes a copper salt capable of absorbing light in a near-infrared wavelength region and an amine compound, wherein the amine compound includes a first amine compound having no polymerizable functional group and a second amine compound including at least monofunctional polymerizable functional group.

Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al.sub.2O.sub.3, CaO/SiO.sub.2-doped Al.sub.2O.sub.3, MgO-doped Al.sub.2O.sub.3, SiO.sub.2-doped ZrO.sub.2, and TiO.sub.2-doped ZrO.sub.2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a better anti-PID effect, photoelectric conversion efficiency and encapsulation performance.

Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al.sub.2O.sub.3, CaO/SiO.sub.2-doped Al.sub.2O.sub.3, MgO-doped Al.sub.2O.sub.3, SiO.sub.2-doped ZrO.sub.2, and TiO.sub.2-doped ZrO.sub.2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker. The adhesive film has a better anti-PID effect, photoelectric conversion efficiency and encapsulation performance.

The present invention provides a curable composition capable of securing delayed curing time for carrying out a work such as laminating or tightening after carrying out irradiation with an energy ray or heating and capable of exhibiting delayed curing property after that, regardless of whether an adherend is transparent or not. The present invention is a curable composition comprising components (A) to (C): a component (A): a compound having a (meth)acryloyl group in a molecule; a component (B): saccharin; and a component (C): at least one of a photocationic catalyst as a component (C-1) and a thermal cationic catalyst as a component (C-2).

The present invention provides a curable composition capable of securing delayed curing time for carrying out a work such as laminating or tightening after carrying out irradiation with an energy ray or heating and capable of exhibiting delayed curing property after that, regardless of whether an adherend is transparent or not. The present invention is a curable composition comprising components (A) to (C): a component (A): a compound having a (meth)acryloyl group in a molecule; a component (B): saccharin; and a component (C): at least one of a photocationic catalyst as a component (C-1) and a thermal cationic catalyst as a component (C-2).

A photosensitive resin composition is provided. The photosensitive resin composition is applied in a technical field of flexible display devices. The photosensitive resin composition comprises 5 to 50 parts by weight of an acrylate crosslink monomer, 0.2 to 0.6 parts by weight of an initiator, 5 to 8 parts by weight of a liquid pigment solid substance, 5 to 8 parts by weight of a resin, and 20 to 70 parts by weight of a solvent. The initiator is a radical initiator having a decomposition temperature less than 40° C. The acrylate crosslink monomer comprises a copolymerization two of aromatic group-containing and triol-containing acrylate polymerizable monomers for lowering a temperature of a following color filter preparing process. A method of preparing the photosensitive resin composition and a display device comprising the photosensitive resin composition are also provided.

The present invention provides a resin composition for stereolithography that enables easy stereolithographical fabrication; and that can produce a cured object having desirable strain recovery, desirable toughness, and desirable water resistance. The present invention relates to a resin composition for stereolithography comprising a polymerizable compound (A) whose homopolymer has a glass transition temperature (Tg) of 37° C. or higher; and a photopolymerization initiator (B), and having a tan δ at 37° C. of 0.3 or less after cure.

The present invention provides a resin composition for stereolithography that enables easy stereolithographical fabrication; and that can produce a cured object having desirable strain recovery, desirable toughness, and desirable water resistance. The present invention relates to a resin composition for stereolithography comprising a polymerizable compound (A) whose homopolymer has a glass transition temperature (Tg) of 37° C. or higher; and a photopolymerization initiator (B), and having a tan δ at 37° C. of 0.3 or less after cure.