To provide a composition having a very low refractive index, an organic photoelectronic element using the composition, and simple methods for producing such a composition and an organic photoelectronic element.

A composition comprising a fluorinated polymer, an organic semiconductor material and a dopant.

A color conversion composition includes the following Component (A) and Component (B): Component (A): an organic light-emitting material; and Component (B): at least one of a polyester resin having a partial structure represented by General Formula (1) in its molecular structure of the polyester resin and a resin containing a bisphenol structure represented by General Formula (2): ##STR00001##
where Y is a divalent saturated aliphatic hydrocarbon group having at least one of a tertiary carbon and a quaternary carbon, ##STR00002##
where R.sup.1 and R.sup.2 each represent hydrogen or a C.sub.1-20 organic group; R.sup.1 and R.sup.2 may be the same as or different from each other.

A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.

A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.

An epoxide resin for the manufacture of a fibre-reinforced composite material having fire retardant properties and/or for use as an adhesive or hot-melt adhesive having fire retardant properties, the epoxide resin being halogen-free and phenolic resin-free, the epoxide resin having: A. a mixture of (i) at least one first non-halogenated multifunctional epoxide-containing resin which has an epoxide functionality of greater than 2 and (ii) at least one second non-halogenated multifunctional epoxide-containing resin which has an epoxide functionality of less than or equal to 2; B. at least one catalyst for curing the mixture of epoxide-containing resins to form a cured epoxy resin; and C. a mixture of first, second and third fire retardant additives for reacting together to form an intumescent char when the cured epoxy resin is exposed to a fire, wherein (i) the first fire retardant additive comprises a blowing agent for generating a non-combustible gas, (ii) the second fire retardant additive comprises an acid donor for decomposing to form a phosphoric acid when the cured epoxy resin is exposed to a fire, and (iii) the third fire retardant additive comprises at least one or both of (a) a ceramic or glass material and (b) a ceramic or glass material precursor to form a ceramic or glass material when the cured epoxy resin is exposed to a fire.

This coating composition for an electrical steel sheet is a coating composition for an electrical steel sheet containing an epoxy resin, a high-temperature curing agent, and inorganic fine particles, wherein a content of the high-temperature curing agent with respect to 100 parts by mass of the epoxy resin is 5 to 30 parts by mass, wherein the inorganic fine particles are one or more selected from metal hydroxides, metal oxides that react with water at 25? C. to become metal hydroxides and silicate minerals having a hydroxyl group, wherein the volume average particle diameter of the inorganic fine particles is 0.05 to 2.0 ?m, wherein a content of the epoxy resin with respect to a total mass of the coating composition for an electrical steel sheet is 45 mass % or more, and wherein a content of the inorganic fine particles with respect to 100 parts by mass of the epoxy resin is 1 to 100 parts by mass.

This coating composition for an electrical steel sheet is a coating composition for an electrical steel sheet containing an epoxy resin, a high-temperature curing agent, and inorganic fine particles, wherein a content of the high-temperature curing agent with respect to 100 parts by mass of the epoxy resin is 5 to 30 parts by mass, wherein the inorganic fine particles are one or more selected from metal hydroxides, metal oxides that react with water at 25? C. to become metal hydroxides and silicate minerals having a hydroxyl group, wherein the volume average particle diameter of the inorganic fine particles is 0.05 to 2.0 ?m, wherein a content of the epoxy resin with respect to a total mass of the coating composition for an electrical steel sheet is 45 mass % or more, and wherein a content of the inorganic fine particles with respect to 100 parts by mass of the epoxy resin is 1 to 100 parts by mass.

A composition comprising: a substance (A) comprising at least one metal atom selected from the group consisting of zinc, cobalt, niobium, zirconium, cadmium, copper, nickel, chromium, vanadium, titanium, molybdenum, magnesium, iron and aluminum, with the proviso that a metal organic framework is excluded; an organic substance (B) having at least two metal coordination sites capable of being coordinated to the metal atom to form a crystal, wherein the metal coordination sites are of at least one type selected from the group consisting of a carboxy group and a metal organic framework; and a coordination promoter (C) that undergoes a reaction or a phase transition upon stimulation to promote the coordination of the metal coordination sites of the organic substance (B) to the metal atom of the substance (A).

A composition comprising: a substance (A) comprising at least one metal atom selected from the group consisting of zinc, cobalt, niobium, zirconium, cadmium, copper, nickel, chromium, vanadium, titanium, molybdenum, magnesium, iron and aluminum, with the proviso that a metal organic framework is excluded; an organic substance (B) having at least two metal coordination sites capable of being coordinated to the metal atom to form a crystal, wherein the metal coordination sites are of at least one type selected from the group consisting of a carboxy group and a metal organic framework; and a coordination promoter (C) that undergoes a reaction or a phase transition upon stimulation to promote the coordination of the metal coordination sites of the organic substance (B) to the metal atom of the substance (A).

The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less; a curing agent including a phenol resin having a softening point of 100 C. or higher; and an epoxy resin, wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40% by weight, an adhesive film for a semiconductor including the above adhesive resin composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive film for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.