A ready to use surface veil and surface film integrated prepreg layer suitable to use in a production of lightweight structural parts/panels with class A surfaces includes a curable bottom base resin formulation including a curable bottom base resin, at least one first toughening agent, at least one accelerator, at least one curing agent and at least one hardener. The prepreg layer further includes a release paper coated with the curable bottom base resin formulation to obtained curable bottom base resin formulation coated release paper as a first resin film; a reinforcement fabric; an outer resin formulation including an outer resin, wherein the outer resin is the curable bottom base resin being 10% more viscous than a resin, at least one thermoplastic toughening agent, at least one accelerator, at least one curing agent and at least one hardener agent.

An object is to provide a crosslinkable resin composition having mechanical strength and capable of exhibiting flexibility, repairability, and remoldability in a low-temperature region including room temperature and contributing to prolongation of the life of cured product itself and a decrease in waste. Specifically, used is a crosslinkable resin composition which can form a cured product having a phase-separated structure formed of a continuous phase and a discontinuous phase and in which discontinuous phase has higher tensile elastic modulus than continuous phase, and continuous phase containing a reversible bond. In particular, in crosslinkable resin composition, preferably, the continuous phase contains reaction product of a resin component A containing the reversible bond with a curing agent, the discontinuous phase contains the reaction product of a resin component B with the curing agent, and phase-separated structure contains the reaction product of continuous phase and discontinuous phase with curing agent.

This invention relates to a curable epoxy composition comprising an epoxy resin, a core-shell rubber, a capped polyurethane prepolymer, a hardener, an accelerator, a multifunctional epoxy-terminated prepolymer, along with related methods of making and using the same. The curable epoxy compositions could be used as structural adhesives after curing, for example, in automotive industrial bonding applications, which provides very good impact peel strength within wide temperature range, good storage ability and the curable epoxy compositions could be cured at low temperature.

Disclosed are a structural adhesive tape in which a mesh layer is located on one side or both sides of an adhesive layer, and a method of manufacturing the same. The mesh layer having a specific specification may be used and an adhesive layer including an epoxy resin with a solid phase and a liquid phase and a flame retardant plasticizer may be used introduced so that a tape sagging phenomenon can be solved while minimizing degradation in adhesive strength. In addition, the mesh layer may be used so that a usage temperature range may be extended from a range ranging from about 5 C. to about 35 C. to a range ranging from about 0 C. to about 40 C., and thus workability in high and low temperature ranges may be improved such that tape workability can be improved even in overseas factories with poor temperature conditions.

Disclosed are a structural adhesive tape in which a mesh layer is located on one side or both sides of an adhesive layer, and a method of manufacturing the same. The mesh layer having a specific specification may be used and an adhesive layer including an epoxy resin with a solid phase and a liquid phase and a flame retardant plasticizer may be used introduced so that a tape sagging phenomenon can be solved while minimizing degradation in adhesive strength. In addition, the mesh layer may be used so that a usage temperature range may be extended from a range ranging from about 5 C. to about 35 C. to a range ranging from about 0 C. to about 40 C., and thus workability in high and low temperature ranges may be improved such that tape workability can be improved even in overseas factories with poor temperature conditions.

A packaging film and a preparation method thereof, and a filter chip packaging method are provided. The raw materials of the packaging film include: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant, where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:(7-9). The packaging film has excellent flexibility and adhesion, a low moisture absorption rate, and high heat resistance and is especially suitable for the packaging of filter chips.

A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25 C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.

A fiber-reinforced composite article in which toughness is maintained and a strength and an elastic modulus are improved, and a prepreg for obtaining the fiber-reinforced composite article are provided. The prepreg of the present invention comprises a matrix resin composition comprising at least the following components (A) to (C), and carbon fibers. Component (A): an epoxy resin Component (B): an aliphatic polycarbonate resin Component (C): a curing agent

To provide a thermosetting resin composition which is useful for an antenna module capable of coping with a signal in a high-frequency band and having excellent mesh passability. Specifically disclosed is a thermosetting resin composition containing (A) a thermosetting resin and (B) at least one inorganic filler selected from the group consisting of a titanium-based inorganic filler and a zircon-based inorganic filler, in which in the component (B), a content of particles having a particle diameter of 1.0 m or less is 30% by volume or less based on the component (B). And to provide a prepreg, a resin film, a laminate, a printed wiring board, an antenna device, an antenna module, and a communication device obtained by using the thermosetting resin composition.

A medical grade polyoxymethylene polymer composition is disclosed that has been mass colored. The composition is particularly formulated so as to meet the standards of various governmental and safety requirements needed for use in medical applications and/or in food contact applications. In one embodiment, the polymer composition is formulated to meet the standards of USP Class VI testing and/or ISO 10993 testing.