The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less; a curing agent including a phenol resin having a softening point of 100 C. or higher; and an epoxy resin, wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40% by weight, an adhesive film for a semiconductor including the above adhesive resin composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive film for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

A color conversion composition includes the following Component (A) and Component (B): Component (A): an organic light-emitting material; and Component (B): at least one of a polyester resin having a partial structure represented by General Formula (1) in its molecular structure of the polyester resin and a resin containing a bisphenol structure represented by General Formula (2):

##STR00001##

(where Y is a divalent saturated aliphatic hydrocarbon group having at least one of a tertiary carbon and a quaternary carbon,

##STR00002##

where R.sup.1 and R.sup.2 each represent hydrogen or a C.sub.1-20 organic group; R.sup.1 and R.sup.2 may be the same as or different from each other.

The present invention provides a resin composition, a polyimide preparation method and related products. The resin composition consists of the following components: polyimide which is a soluble product generated by a reaction of monomer groups containing aromatic tetracarboxylic dianhydride and diacid dihydrazide, a main chain of the polyimide containing a hydrazide structure; and a curing agent which comprises one or more of multifunctional epoxy resin, a primary amine compound with three or more functional groups, and polyisocyanate, wherein a mass ratio of the curing agent to the soluble polyimide is 0-20%. The resin composition in the present invention utilizes the hydrazide structure in the polyimide to prepare an adhesive with excellent heat resistance, adhesive performance, and solubility, overcoming the shortcomings of existing polyimide-based adhesives during processing or application.

A thermoset modified additive for asphalt mixture includes the following raw materials: resin, curing agent, promoter, flow agent, filler and additive, wherein the weight part proportions of the raw materials are: resin 35-70, curing agent 1-35, promoter 0-2.5, flow agent 0-6, filler 20-40 and additive 0-2. The asphalt mixture includes thermoset modified additive for asphalt mixture, matrix asphalt or modified asphalt and mineral aggregate, wherein the weight part proportions of the raw materials are: thermoset modified additive for asphalt mixture 1-5, matrix asphalt 2-8 and mineral aggregate 87-97. The thermoset modified additive for asphalt mixture is prepared by dry process modification technology; the prepared modified additive is powdery, has small particle size, and is easy to disperse in asphalt mixture; and the asphalt mixture prepared from the modified additive has simple operation process and low cost, and can be subjected to continuous production.

Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer, with which it is possible to obtain an interlayer insulating layer having exceptional adhesion to a circuit board even after accelerated environmental testing, and exceptional heat resistance, dielectric characteristics, and low thermal expansion. Specifically: an interlayer insulating resin film containing an epoxy resin (A), a cyanate resin (B), and a dicyandiamide (C); an interlayer insulating resin film having an adhesive auxiliary layer, the adhesive auxiliary layer being provided on one surface of the above-mentioned interlayer insulating resin film, wherein the adhesive auxiliary layer having an adhesive auxiliary layer contains an epoxy resin (a), a cyanate resin (b), and an inorganic filer (c); and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer.

Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer, with which it is possible to obtain an interlayer insulating layer having exceptional adhesion to a circuit board even after accelerated environmental testing, and exceptional heat resistance, dielectric characteristics, and low thermal expansion. Specifically: an interlayer insulating resin film containing an epoxy resin (A), a cyanate resin (B), and a dicyandiamide (C); an interlayer insulating resin film having an adhesive auxiliary layer, the adhesive auxiliary layer being provided on one surface of the above-mentioned interlayer insulating resin film, wherein the adhesive auxiliary layer having an adhesive auxiliary layer contains an epoxy resin (a), a cyanate resin (b), and an inorganic filer (c); and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer.

A ready to use surface veil and surface film integrated prepreg layer suitable to use in a production of lightweight structural parts/panels with class A surfaces includes a curable bottom base resin formulation including a curable bottom base resin, at least one first toughening agent, at least one accelerator, at least one curing agent and at least one hardener. The prepreg layer further includes a release paper coated with the curable bottom base resin formulation to obtained curable bottom base resin formulation coated release paper as a first resin film; a reinforcement fabric; an outer resin formulation including an outer resin, wherein the outer resin is the curable bottom base resin being 10% more viscous than a resin, at least one thermoplastic toughening agent, at least one accelerator, at least one curing agent and at least one hardener agent.

There is provided a resin composition having long-term heat resistance and a low change ratio of adhesive strength. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide, and (C) bismaleimides.

Epoxy-based adhesive compositions are provided, exhibiting improved uncured humidity resistance, cured humidity resistance and improved wash-off resistance, which upon curing result in crash durable and stress resistant cured bonds on steel and low surface tension surfaces, e.g. ZnMgAl, hot dipped galvanized (HDG) and treated aluminum surfaces. Also provided are bonded assemblies comprising pre-cure or fully cured epoxy-based adhesives, methods of making the epoxy-based adhesives, methods of bonding assemblies and articles of manufacture comprising the bonded assemblies.

Provided are polysiloxane structure-containing rubber particles and composite particles having a high degradability; and manufacturing methods therefor. The rubber particles are comprised of a copolymer containing a structural unit derived from (A) a silicone-polyester copolymer having at least two radically polymerizable unsaturated groups per molecule. The composite particles are those with the surfaces of these rubber particles being coated with polyorganosilsesquioxane and/or silica.