C23C14/083

Wire grid polarizer with silane protective coating

A wire grid polarizer (WGP) can have a conformal-coating to protect the WGP from at least one of the following: corrosion, dust, and damage due to tensile forces in a liquid on the WGP. The conformal-coating can include a silane conformal-coating with chemical formula (1), chemical formula (2), or combinations thereof: ##STR00001##
A method of applying a conformal-coating over a WGP can include exposing the WGP to Si(R.sup.1).sub.d(R.sup.2).sub.e(R.sup.3).sub.g. In the above WGP and method, X can be a bond to the ribs; each R.sup.1 can be a hydrophobic group; each R.sup.3, if any, can be any chemical element or group; d can be 1, 2, or 3, e can be 1, 2, or 3, g can be 0, 1, or 2, and d+e+g=4; R.sup.2 can be a silane-reactive-group; and each R.sup.6 can be an alkyl group, an aryl group, or combinations thereof.

CMAS-resistant protective layer

The present invention relates to a protective layer against CMAS, to a CMAS-resistant article comprising the protective layer according to the invention, and to a process for preparing a corresponding article.

Catalyst laminate, membrane electrode assembly, electrochemical cell, stack, water electrolyzer, and hydrogen utilizing system

A catalyst laminate includes a plurality of catalyst layers containing at least one of a noble metal and an oxide of the noble metal and at least one of a non-noble metal and an oxide of the non-noble metal, including: two or more first catalyst layers and two or more second catalyst layers. In an atomic percent of the noble metal obtained by using a line analysis by energy dispersive X-ray spectroscopy in a thickness direction of the catalyst laminate. The first catalyst layer is less than an average of a highest value and a lowest value of the atomic percent of the noble metal. The second catalyst layer has an atomic percent of the noble metal equal to or greater than the average of the highest value and the lowest value thereof. The second catalyst layer is present between the first catalyst layers.

METHOD FOR PROTECTING LOW-E GLASS PLATE, METHOD FOR PRODUCING GLASS UNIT, LAMINATE AND PROTECTIVE SHEET FOR LOW-E GLASS PLATE

Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. In the protection method, a protective sheet having a substrate and a PSA layer provided to at least one face of the substrate is applied for protection via the PSA layer to a Low-E glass plate having a Low-E layer that comprises a zinc component. The method is characterized by using the protective sheet wherein the PSA layer is formed from a water-dispersed PSA composition and includes less than 850 μg ammonia per gram of PSA layer weight.

A MULTI-LAYERED ELECTRODE FOR SENSING PH

The invention provides a multi-layered electrode for sensing pH, the electrode comprising: a sensing layer on a substrate, the sensing layer comprising at least one proton-sensitive metal oxide, wherein a pH-dependent potential of the multi-layered electrode is measurable via an electrically conductive connection to the sensing layer; a proton-permeable layer covering at least a portion of the sensing layer, the proton-permeable layer comprising at least one electrically insulating proton-conductive metal oxide; and a carbonaceous layer on the proton-permeable layer, the carbonaceous layer comprising amorphous carbon.

Anti-reflective sputtering stack with low Rv and low Ruv
11592597 · 2023-02-28 · ·

The present invention provides a UV antireflective coating stack for ophthalmic lenses. The antireflective coating stack is deposited by sputtering, which lowers the reflectivity of the antireflective stack in the UV range and maintains low reflectivity in the visible range. The antireflective coating stack offers improved thermo-mechanical performance as compared to evaporation-based UV antireflective stacks.

Laminate and method for producing laminate

A laminate including a glass plate and a coating layer, wherein the coating layer includes one or more components selected from the group consisting of silicon nitride, titanium oxide, alumina, niobium oxide, zirconia, indium tin oxide, silicon oxide, magnesium fluoride, and calcium fluoride, wherein a ratio (dc/dg) of a thickness dc of the coating layer to a thickness dg of the glass plate is in a range of 0.05×10.sup.−3 to 1.2×10.sup.−3, and wherein a radius of curvature r1 of the laminate with negating of self-weight deflection is 10 m to 150 m.

Fabric coloring method and colored fabric

The present application provides a fabric coloring method and a colored fabric, where the fabric coloring method includes: performing radiation drying on a base cloth; sequentially forming an adhesive layer and at least one color-generating layer on a surface of the base cloth after the radiation drying by vacuum deposition, where the adhesive layer contains at least one of Ti, Cr, Si and Ni, and a thickness of the adhesive layer ranges from 1 nm to 2000 nm; the color-generating layer contains at least one of Al, Ti, Cu, Fe, Mo, Zn, Ag, Au, and Mg, and the total thickness of the color-generating layer ranges from 1 nm to 4000 nm. The fabric coloring method can not only produce rich colors and make the colored fabric have good color fastness, but also reduce the sensitivity of color of the colored fabric to thickness of the film, thus improving the industrial operability.

Handling for high resistivity substrates
11594441 · 2023-02-28 · ·

A method of modifying a high-resistivity substrate so that the substrate may be electrostatically clamped to a chuck is disclosed. The bottom surface is implanted with a resistivity-reducing species. In this way, resistivity of the bottom surface of the substrate may be greatly reduced. In some embodiments, to implant the bottom surface, a coating is applied to the top surface. After application of the coating, the substrate is flipped so that the front surface contacts the top surface of the chuck. The ions are then implanted into the exposed bottom surface to create the low resistivity layer. The resistivity of the low resistivity layer proximate the bottom surface after implant may be less than 1000 ohm-cm. Once the bottom surface has been implanted, the substrate may be processed conventionally. The low resistivity layer may later be removed by wafer backside thinning processes.

METHOD FOR PROTECTING LOW-E GLASS PLATE, METHOD FOR PRODUCING GLASS UNIT, LAMINATE AND PROTECTIVE SHEET FOR LOW-E GLASS PLATE

Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a zinc component. Here, the protective sheet has a PSA layer. The Low-E layer comprises a zinc component. The PSA layer includes ammonia and an acid or acid salt capable of forming a counterion to an ammonium ion.