A coated article includes a substrate and a coating applied over at least a portion of the substrate. The coating includes at least one metallic layer formed from one or more silver compounds doped with at least one metal selected from Groups 3 to 15 of the periodic table of the elements. Also disclosed are capsules that can absorb electromagnetic energy as well as a process of forming an antimony-doped tin oxide coating layer.

A deposition method relating to semiconductor technology is presented. The deposition method includes: conducting a first deposition in a reaction chamber at a first deposition temperature; conducting a cool-down process on the reaction chamber, and conducting a second deposition during the cool-down process. In the first deposition, the thin-films deposited on the periphery of a wafer are thicker than those deposited on the center of a wafer, while in the second deposition, the thin-films deposited on the periphery of a wafer are thinner that those deposited on the center of a wafer. Therefore the thin-films deposited by this deposition method are more homogeneous in thickness that those deposited with conventional methods.

An evaporator includes at least one feeding member and a heating member. Each feeding member is configured to transfer a source material in a transfer speed that is adjustable, and the heating member is configured to heat the source material transferred by the feeding member for evaporation to thereby generate a source material vapor. An evaporation coating apparatus further includes a coating chamber, an object holder, and a controller configured to control the transfer speed, wherein the evaporator and the object holder are both disposed inside the coating chamber, the object holder is configured to provide a platform for placing an object to be coated thereon, and the coating chamber is configured to provide an environment for the source material vapor vented out from the evaporator to attach to the object to thereby form a film of the source material onto the object.

The present disclosure relates to a field of semiconductor production device, and more particularly to a cooling member and a vacuum coating device. The cooling member includes a cooling plate and a rotating mechanism. The cooling plate includes at least one cooling strip communicated with a cooling liquid pipeline. The rotating mechanism includes a driving member and a rotating shaft, the driving member is connected with one end of the rotating shaft, and the other end of the rotating shaft is connected with the at least one cooling strip. The rotating mechanism drives the cooling strip in the cooling plate to rotate. In a cooling state, the cooling strip is parallel to a substrate in a chamber, the cooling area is increased, and the cooling efficiency is increased.

Several embodiments of the present technology are directed to actively controlling a temperature of a substrate in a chamber during manufacturing of a material or thin film. In some embodiments, the method can include cooling or heating the substrate to have a temperature within a target range, depositing a material over a surface of the substrate, and controlling the temperature of the substrate while the material is being deposited. In some embodiments, controlling the temperature of the substrate can include removing thermal energy from the substrate by directing a fluid over the substrate to maintain the temperature of the substrate within a target range throughout the deposition process.

A film formation apparatus includes a rotary table provided in a processing container; a mounting table mounting a substrate and revolved by rotation of the rotary table; a film formation gas supply part configured to supply a film formation gas to a region through which the mounting table passes by the rotation of the rotary table; a spinning shaft rotatably provided on a portion rotating together with the rotary table; a driven gear provided on the spinning shaft; a driving gear configured to rotate while facing a revolution orbit of the driven gear and provided along an entire circumference of the revolution orbit so as to constitute a magnetic gear mechanism with the driven gear, and a relative-distance-changing mechanism configured to change a relative distance between the revolution orbit of the driven gear and the driving gear.

The invention provides a thin film deposition system and a method, and relates to the field of thin film deposition. The deposition method comprises the following steps: 1) heating metal substrate; carrying out deposition. The method is characterized in the step 1) that a current is conducted into the metal substrate at one end of the growth zone by one electrode, and out of the metal substrate at the other end of the growth zone by the other electrode, so that the metal substrate is heated by the heat emitting of the resistant of the metal substrate itself. According to the method, the quality of the prepared thin film is improved, while the preparation cost of the thin film is reduced. In addition, the consistent double-sided thin films can be easily prepared on two surfaces of the metal substrate by employing the system and method.

There is provided a mounting table system which includes: a mounting table rotatably installed so as to mount a substrate thereon; a plurality of heating parts installed in the mounting table, and configured to heat the mounting table; a single power source configured to supply an electric power to the plurality of heating parts; and a power switching part configured to switch from a first heating part among the plurality of heating parts to which the electric power is supplied from the single power source, to a second heating part among the plurality of heating parts, depending on a rotational angle of the mounting table.

The present disclosure relates to the technical filed of cooling equipment in the vacuum coating filed, and discloses a cooling plate, including a cooling plate body and a circulating water channel arranged in the cooling plate body; wherein a water-inlet channel and a water-return channel of the circulating water channel are in parallel. By arranging the circulating water channel in which the water-inlet channel and the water-return channel are in parallel in the cooling plate body, the cooling plate provided by the present disclosure improves the heat exchange efficiency and solves the problem of the temperature non-uniformity of the entire cooling plate due to the temperature difference between the inlet water and returned water.

A substrate treatment apparatus for treating substrates has a plate-shaped substrate carrier and at least one plate-shaped tempering device, which is arranged parallel to the substrate carrier. The substrate carrier has a substrate carrier front side for supporting at least one laminar substrate and a substrate carrier back side, which faces the tempering device. The object of the present invention is to provide a substrate treatment apparatus which enables a heat distribution as evenly as possible in the substrate carrier. For that purpose, there is provided at least one spacer element for forming a distance between the substrate carrier and the tempering device at the substrate carrier back side and/or a surface of the tempering device facing the substrate carrier.