The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused.

The present invention provides agents having efficacy against viruses, allergens, bacteria and odorants, materials including such agents, and methods for producing the agents. An agent according to an embodiment of the present invention includes titanium dioxide particles having low photocatalytic activity, and metal ions of at least one metal selected from gold, silver, platinum and copper that are adsorbed to the surface of the titanium dioxide particles. The agent may further include hydroxyapatite particles, and the metal ions may be adsorbed also to the surface of the hydroxyapatite. The metal ions may be at least partially present in the form of at least one of an oxide of the metal, a hydroxide of the metal, and the elemental metal.

A problem is to provide a sheet which is such that a sintered body produced following sintering has a small amount of remaining organic substances. Solution means relate to a sheet comprising a pre-sintering layer. The pre-sintering layer comprises polycarbonate.

A flowable liquid formulation for 3D printing is described. The formulation comprises from 0.1 to 25 wt. % radiopaque particles, wherein at least 50% by weight of the particles have a diameter of at most 100 nm. The formulation further comprises monomeric, oligomeric and/or polymeric precursors adapted for polymerization to form a solidified article. Also described is an article (100) formed by 3D printing, the article (100) comprising a first 3D printed region (110) having a first radiopacity and a second 3D printed region (120) having a second radiopacity, wherein the first radiopacity is greater than the second radiopacity. Also described is a method of forming the article (100).

A polycarbonate resin composition, according to the present invention, comprises: a polycarbonate resin; a polyester resin; and a metal compound, wherein the content ratio of the polycarbonate resin and polyester resin is from approximately 4:1 to approximately 9:1. The polycarbonate resin composition and a molded product using same have excellent physical properties, such as impact resistance, fluidity and the like, as well as excellent exterior and plating adhesion.

The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 m or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5 C./sec from 80 C. to 300 C. under pressure of 10 MPa, and then held at 300 C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.

A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5 C./sec from 80 C. to 300 C. under pressure of 10 MPa, and then held at 300 C. for 2.5 minutes is in a range of 0.005 m.sup.2 to 0.5 m.sup.2.

Provided is a thermal bonding sheet which suppresses a compositional material of the thermal bonding sheet from protruding during bonding and from creeping up onto the surface of an object to be bonded, and provides a strong sintered layer after sintering. A thermal bonding sheet includes a layer. When the layer is analyzed by a differential thermal balance from 23 C. to 500 C. in an air atmosphere at a heating rate of 10 C./min, a value obtained by subtracting a weight decrease amount (%) at 300 C. from a weight decrease amount (%) at 500 C. is in a range of 1% to 0%.

The present invention relates to materials having antimicrobial properties, said materials comprising a polymer having incorporated therein a synergistic combination of at least two metal oxide powders, comprising a mixed oxidation state oxide of a first metal and a single oxidation state oxide of a second metal, the powders being incorporated substantially uniformly within said polymer, wherein the powders have substantially different specific gravities and substantially similar bulk densities and wherein the ions of the metal powders are in ionic contact upon exposure of said material to moisture. There are further provided methods for the preparation of said materials and uses thereof, including in combating or inhibiting the activity of microbes or microorganisms.