Patent classifications
C08K5/3415
Composition for Preparation of Plating Base and Plating Base Thereof
Provided is a composition for forming a plating base on which plating is applied without a pretreatment, especially any activation process for the plating base, conventionally believed to be necessary, as well as a thus-formed plating base and a method of forming a plating coat over the plating base. The plating base is a coating film formed by applying and drying a metal nanoparticle dispersion liquid or a metal nanoparticle dispersion ink in which metal nanoparticles are protected with a small amount of protecting agent. Thus, a metal film can be formed by plating without operations such as substrate cleaning or catalyst imparting and activating. Since it is not necessary to wash the substrate with acid or base solution or to heat-treat it at a high temperature, many variations of materials become available for the substrate.
Glide agent
A lubricant for increasing the sliding capability of an item of sports equipment, in particular an item of winter sports equipment. The lubricant including an aqueous solution having an aqueous silicone emulsion, an emulsion of a polydimethylsiloxane, and a water-based formulation having methylisothiazolinone and/or benzoisothiazolinone.
Glide agent
A lubricant for increasing the sliding capability of an item of sports equipment, in particular an item of winter sports equipment. The lubricant including an aqueous solution having an aqueous silicone emulsion, an emulsion of a polydimethylsiloxane, and a water-based formulation having methylisothiazolinone and/or benzoisothiazolinone.
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C): ##STR00001##
wherein R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C): ##STR00001##
wherein R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.
THERMOSETTING RESIN COMPOSITION
Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (al) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).
THERMOSETTING RESIN COMPOSITION
Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (al) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).
Back sheet for solar cell module and method for manufacturing the same
Provided are a polyester white film and a back sheet for a solar cell module using the same, and in particular, provided is a polyester white film having improved light reflectance.
Back sheet for solar cell module and method for manufacturing the same
Provided are a polyester white film and a back sheet for a solar cell module using the same, and in particular, provided is a polyester white film having improved light reflectance.
Bio-based polymer additive, a process for preparing the bio-based polymer additive and a biodegradable polymer composition comprising said bio-based polymer additive
The present invention disclosed a bio-based polymer additive, its preparation process and a biodegradable polymer composition comprising the said bio-based polymer additive for use in manufacturing of biodegradable plastic. The said additive is prepared from the biomass of broken microorganism cell such as microalgae, yeast or other microorganisms. In particular, the bio-based polymer additive is for enhancing rheological properties and/or biodegradability of a polymer. In particular, the additive is for use as a pigment.