Provided are a wavelength selective absorption filter containing a resin and a dye A, which has a main absorption wavelength band in the wavelength selective absorption filter at a wavelength of 400 to 450 nm, and a dye C, which has a main absorption wavelength band in the wavelength selective absorption filter at a wavelength of 560 to 600 nm, each of which has a main absorption wavelength band in a different wavelength range, as well as a polarizing plate and an organic electroluminescent display device or liquid crystal display device, which include the wavelength selective absorption filter. However, the dye A and the dye C do not have fluorescence.

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.

Provided are a curing accelerator for an oxidative polymerization type unsaturated resin having a high curing accelerating ability, and a printing ink and a coating material each including the curing accelerator for an oxidative polymerization type unsaturated resin. Specifically, there are provided a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A), a ligand compound (C) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal complex (D) and an imidazole compound (B), and a printing ink and a coating material using the curing accelerator for an oxidative polymerization type unsaturated resin.

Provided are a curing accelerator for an oxidative polymerization type unsaturated resin having a high curing accelerating ability, and a printing ink and a coating material each including the curing accelerator for an oxidative polymerization type unsaturated resin. Specifically, there are provided a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A), a ligand compound (C) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal complex (D) and an imidazole compound (B), and a printing ink and a coating material using the curing accelerator for an oxidative polymerization type unsaturated resin.

Provided are a curing accelerator for an oxidative polymerization type unsaturated resin having a high curing accelerating ability, and a printing ink and a coating material each including the curing accelerator for an oxidative polymerization type unsaturated resin. Specifically, there are provided a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A), a ligand compound (C) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal complex (D) and an imidazole compound (B), and a printing ink and a coating material using the curing accelerator for an oxidative polymerization type unsaturated resin.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

A polyacetal resin composition capable of keeping the generation of formaldehyde from a molded article at a very low level and stably keeping mold deposits at a minimum during molding. The polyacetal resin composition includes at least (A) 100 parts by mass of a polyacetal polymer, (B) 0.01-0.50 parts by mass of an aliphatic carboxylic hydrazide, (C) 0.001-0.50 part by mass of a hydantoin compound having two hydrazinocarbonylalkyl groups, and (D) 0.001-0.30 part by mass of an alkaline earth metal salt of an aliphatic carboxylic acid. The total amount of (B) and (C) is 0.03-0.55 part by mass per 100 parts by mass of the (A) polyacetal polymer.

A polyacetal resin composition capable of keeping the generation of formaldehyde from a molded article at a very low level and stably keeping mold deposits at a minimum during molding. The polyacetal resin composition includes at least (A) 100 parts by mass of a polyacetal polymer, (B) 0.01-0.50 parts by mass of an aliphatic carboxylic hydrazide, (C) 0.001-0.50 part by mass of a hydantoin compound having two hydrazinocarbonylalkyl groups, and (D) 0.001-0.30 part by mass of an alkaline earth metal salt of an aliphatic carboxylic acid. The total amount of (B) and (C) is 0.03-0.55 part by mass per 100 parts by mass of the (A) polyacetal polymer.