Water-based compositions containing a low VOC coalescent, a latex or water-dispersible polymer are described.

The invention relates to flame-retardant polyamide compositions with a glow wire ignition temperature of not less than 775° C., comprising polyamide having a melting point of not more than 290° C. as component A, fillers and/or reinforcers as component B, phosphinic salt of the formula (I) as component C

##STR00001## in which R.sub.1 and R.sub.2 are ethyl, M is Al, Fe, TiO.sub.p or Zn, m is 2 to 3, and p=(4−m)/2 compound selected from the group of the Al, Fe, TiO.sub.p and Zn salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid as component D phosphonic salt of the formula (II) as component E

##STR00002## in which R.sub.3 is ethyl, Met is Al, Fe, TiO.sub.q or Zn, n is 2 to 3, and q=(4−n)/2, and melamine polyphosphate having an average degree of condensation of 2 to 200 as component F.

The polyamide compositions can be used for production of fibers, films and shaped bodies, especially for applications in the electricals and electronics sector.

The invention relates to flame-retardant polyamide compositions with a glow wire ignition temperature of not less than 775° C., comprising polyamide having a melting point of not more than 290° C. as component A, fillers and/or reinforcers as component B, phosphinic salt of the formula (I) as component C

##STR00001## in which R.sub.1 and R.sub.2 are ethyl, M is Al, Fe, TiO.sub.p or Zn, m is 2 to 3, and p=(4−m)/2 compound selected from the group of the Al, Fe, TiO.sub.p and Zn salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid as component D phosphonic salt of the formula (II) as component E

##STR00002## in which R.sub.3 is ethyl, Met is Al, Fe, TiO.sub.q or Zn, n is 2 to 3, and q=(4−n)/2, and melamine polyphosphate having an average degree of condensation of 2 to 200 as component F.

The polyamide compositions can be used for production of fibers, films and shaped bodies, especially for applications in the electricals and electronics sector.

The present application provides a polycarbonate resin composition which has a high refractive index and a low Abbe number, and high thermal stability. The polycarbonate resin composition according to one embodiment of the present application includes a polycarbonate resin and an antioxidant, wherein the polycarbonate resin contains a constituent unit represented by general formula (1) (in general formula (1), X represents an alkylene group having 1-4 carbon atoms, and a and b each independently represent an integer of 1-10), and the antioxidant content is 1-3000 ppm.

##STR00001##

The present application provides a polycarbonate resin composition which has a high refractive index and a low Abbe number, and high thermal stability. The polycarbonate resin composition according to one embodiment of the present application includes a polycarbonate resin and an antioxidant, wherein the polycarbonate resin contains a constituent unit represented by general formula (1) (in general formula (1), X represents an alkylene group having 1-4 carbon atoms, and a and b each independently represent an integer of 1-10), and the antioxidant content is 1-3000 ppm.

##STR00001##

A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight.

##STR00001##

In Formula (F-1) and Formula (F-2), the definition of R.sup.1, R.sup.3, R.sup.4, Y, Z, m, n and p are the same as defined in the detailed description.

A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight.

##STR00001##

In Formula (F-1) and Formula (F-2), the definition of R.sup.1, R.sup.3, R.sup.4, Y, Z, m, n and p are the same as defined in the detailed description.

A compound of formula (I) ##STR00001##
wherein R.sub.1 and R.sub.2 independently of one another are hydrogen, C.sub.1-C.sub.22alkyl, —O—, —OH, —CH.sub.2CN, C.sub.1-C.sub.18alkoxy, C.sub.2-C.sub.18alkoxy substituted by —OH; C.sub.5-C.sub.12cycloalkoxy, C.sub.3-C.sub.6alkenyl, C.sub.3-C.sub.6alkenyloxy, C.sub.7-C.sub.9phenylalkyl unsubstituted or substituted on the phenyl by 1, 2 or 3 C.sub.1-C.sub.4alkyl; or C.sub.1-C.sub.8acyl; and R.sub.3 and R.sub.4 independently of one another are C.sub.1-C.sub.22alkyl or a group of the formula (Ia) ##STR00002##
wherein R.sub.0 has one of the meanings of R.sub.1 and R.sub.2.

A compound of formula (I) ##STR00001##
wherein R.sub.1 and R.sub.2 independently of one another are hydrogen, C.sub.1-C.sub.22alkyl, —O—, —OH, —CH.sub.2CN, C.sub.1-C.sub.18alkoxy, C.sub.2-C.sub.18alkoxy substituted by —OH; C.sub.5-C.sub.12cycloalkoxy, C.sub.3-C.sub.6alkenyl, C.sub.3-C.sub.6alkenyloxy, C.sub.7-C.sub.9phenylalkyl unsubstituted or substituted on the phenyl by 1, 2 or 3 C.sub.1-C.sub.4alkyl; or C.sub.1-C.sub.8acyl; and R.sub.3 and R.sub.4 independently of one another are C.sub.1-C.sub.22alkyl or a group of the formula (Ia) ##STR00002##
wherein R.sub.0 has one of the meanings of R.sub.1 and R.sub.2.

A polymer composition with a polymer of ethylene with a comonomer with silane group(s) containing units and an additive that is an organic compound with at least one amine moiety that has a gel content less than 10 wt % after 7 days at ambient conditions and a gel content of at least 15 wt % gel content after 14 days at 100° C. The film can be used in a laminate.