The present invention relates to a composition comprising; components a) b) and d); wherein, component a) is a metal compound having the structure (I), component b) is a spin on high carbon polymer, having a polymer backbone comprising mono-cyclic aromatic hydrocarbon, fused-ring ring hydrocarbon moieties, or mixtures of these, having a wt. % of carbon from about 81 wt. % to about 94 wt. %, which is soluble to at least about 5 wt. % in a spin casting solvent, and wherein at least one, of said mono-cyclic aromatic hydrocarbon or said fused-ring ring hydrocarbon moieties, present in said spin on high carbon polymer, is functionalized with at least one alkynyloxy moiety of structure (VIII), and component d) is a spin casting solvent. The present invention further relates to using this composition in methods for manufacturing electronic devices through either the formation of a patterned films of high K material comprised of a metal oxide on a semiconductor substrate, or through the formation of patterned metal oxide comprised layer overlaying a semiconductor substrate which may be used to selectively etch the semiconductor substrate with a fluorine plasma.

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The present invention relates to a composition comprising; components a) b) and d); wherein, component a) is a metal compound having the structure (I), component b) is a spin on high carbon polymer, having a polymer backbone comprising mono-cyclic aromatic hydrocarbon, fused-ring ring hydrocarbon moieties, or mixtures of these, having a wt. % of carbon from about 81 wt. % to about 94 wt. %, which is soluble to at least about 5 wt. % in a spin casting solvent, and wherein at least one, of said mono-cyclic aromatic hydrocarbon or said fused-ring ring hydrocarbon moieties, present in said spin on high carbon polymer, is functionalized with at least one alkynyloxy moiety of structure (VIII), and component d) is a spin casting solvent. The present invention further relates to using this composition in methods for manufacturing electronic devices through either the formation of a patterned films of high K material comprised of a metal oxide on a semiconductor substrate, or through the formation of patterned metal oxide comprised layer overlaying a semiconductor substrate which may be used to selectively etch the semiconductor substrate with a fluorine plasma.

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Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 μm is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m.Math.K or more and less than 5.5 W/m.Math.K, has a coefficient of viscosity measured by a spiral viscometer at a rotation frequency of 10 rpm of 5 to 800 Pa.Math.s, has insulation properties and high thermal conductivity, and has excellent flowability, workability, and heat dissipation properties.

A pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing, as monomer units, at least a (meth)acrylic polymer (A) that contains an alkyl (meth)acrylate, and a silicon compound (B), wherein: the silicon compound (B) is one or more silicon compounds selected from the group consisting of alkoxysilane compounds and organopolysiloxane compounds having an acidic group or an acid anhydride group derived from an acidic group and having no polyether group in the molecule, and/or a hydrolytic condensate thereof; and the pressure-sensitive adhesive layer satisfies the conditions of the resistance value change ratio represented by general formula (1). Formula (1): R.sub.250/R.sub.i≤3.0. This pressure-sensitive adhesive layer has reworkability with respect to a transparent conductive layer, corrosion resistance, and high durability.

A pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing, as monomer units, at least a (meth)acrylic polymer (A) that contains an alkyl (meth)acrylate, and a silicon compound (B), wherein: the silicon compound (B) is one or more silicon compounds selected from the group consisting of alkoxysilane compounds and organopolysiloxane compounds having an acidic group or an acid anhydride group derived from an acidic group and having no polyether group in the molecule, and/or a hydrolytic condensate thereof; and the pressure-sensitive adhesive layer satisfies the conditions of the resistance value change ratio represented by general formula (1). Formula (1): R.sub.250/R.sub.i≤3.0. This pressure-sensitive adhesive layer has reworkability with respect to a transparent conductive layer, corrosion resistance, and high durability.

A pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing, as monomer units, at least a (meth)acrylic polymer (A) that contains an alkyl (meth)acrylate, and a silicon compound (B), wherein: the silicon compound (B) is one or more silicon compounds selected from the group consisting of alkoxysilane compounds and organopolysiloxane compounds having an acidic group or an acid anhydride group derived from an acidic group and having no polyether group in the molecule, and/or a hydrolytic condensate thereof; and the pressure-sensitive adhesive layer satisfies the conditions of the resistance value change ratio represented by general formula (1). Formula (1): R.sub.250/R.sub.i≤3.0. This pressure-sensitive adhesive layer has reworkability with respect to a transparent conductive layer, corrosion resistance, and high durability.

The present invention provides a coating composition capable of forming a coating film having a good appearance and design of a coating film and having coating film properties such as scratch resistance with a good balance. Furthermore, the present invention provides a method for forming a multilayer coating film including forming a coating film using the coating composition of the present invention.

The present invention provides a coating composition capable of forming a coating film having a good appearance and design of a coating film and having coating film properties such as scratch resistance with a good balance. Furthermore, the present invention provides a method for forming a multilayer coating film including forming a coating film using the coating composition of the present invention.

What are described are (a) a composition suitable for production of rigid polyurethane foam, comprising at least one isocyanate component, a polyol component, optionally a catalyst that catalyses the formation of a urethane or isocyanurate bond, optionally blowing agents, where the composition additionally comprises polyalkylsiloxane (PAS) containing no polyether modification, and polyether-modified siloxane, (b) a process for producing rigid polyurethane foam using polyalkylsiloxanes and polyether-modified siloxane, (c) the rigid polyurethane foam Thus obtainable and (d) the use thereof.

What are described are (a) a composition suitable for production of rigid polyurethane foam, comprising at least one isocyanate component, a polyol component, optionally a catalyst that catalyses the formation of a urethane or isocyanurate bond, optionally blowing agents, where the composition additionally comprises polyalkylsiloxane (PAS) containing no polyether modification, and polyether-modified siloxane, (b) a process for producing rigid polyurethane foam using polyalkylsiloxanes and polyether-modified siloxane, (c) the rigid polyurethane foam Thus obtainable and (d) the use thereof.