Patent classifications
C08K5/3475
Polycarbonate resin composition
Provided is a polycarbonate resin composition that can block ultraviolet light as well as light on the visible light side therefrom at wavelengths of 400 to 420 nm, and that is free of the problem of gas generation during molding. The polycarbonate resin composition characteristically comprises, per 100 parts by mass of a polycarbonate resin (A), (i) 0.02 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B1) having a maximum absorption wavelength of at least 375 nm in the absorption curve determined according to JIS K 7105 using the following formula, or (ii) 0.08 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B2) having a maximum absorption wavelength of at least 360 nm and less than 375 nm in the absorption curve determined according to JIS K 7105 using the following formula; and 0.01 to 0.5% by mass of a stabilizer (C).
Polycarbonate resin composition
Provided is a polycarbonate resin composition that can block ultraviolet light as well as light on the visible light side therefrom at wavelengths of 400 to 420 nm, and that is free of the problem of gas generation during molding. The polycarbonate resin composition characteristically comprises, per 100 parts by mass of a polycarbonate resin (A), (i) 0.02 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B1) having a maximum absorption wavelength of at least 375 nm in the absorption curve determined according to JIS K 7105 using the following formula, or (ii) 0.08 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B2) having a maximum absorption wavelength of at least 360 nm and less than 375 nm in the absorption curve determined according to JIS K 7105 using the following formula; and 0.01 to 0.5% by mass of a stabilizer (C).
Resin composition for stereolithography
The present invention provides a resin composition for stereolithography that, with its low consistency, enables easy fabrication while ensuring good shape accuracy and desirable color masking properties in the cured product. The present invention relates to a resin composition for stereolithography comprising: an 80 to 99 mass % polymerizable monomer (a); a 0.1 to 10 mass % photopolymerization initiator (b); a 0.1 to 5.0 mass % inorganic particle (c) having an average particle diameter of 5 to 200 nm; and a 0.01 to 10 mass % metal oxide particle (d) having an average particle diameter of 0.1 to 10 μm, the inorganic particle (c) being different from the metal oxide particle (d).
Resin composition for stereolithography
The present invention provides a resin composition for stereolithography that, with its low consistency, enables easy fabrication while ensuring good shape accuracy and desirable color masking properties in the cured product. The present invention relates to a resin composition for stereolithography comprising: an 80 to 99 mass % polymerizable monomer (a); a 0.1 to 10 mass % photopolymerization initiator (b); a 0.1 to 5.0 mass % inorganic particle (c) having an average particle diameter of 5 to 200 nm; and a 0.01 to 10 mass % metal oxide particle (d) having an average particle diameter of 0.1 to 10 μm, the inorganic particle (c) being different from the metal oxide particle (d).
Methacrylic resin composition, molded article, and film
The present invention provides a methacrylic resin composition comprising 75 to 99.8 mass % of a methacrylic resin [A], 0.1 to 15 mass % of a UV absorber [B], and 0.1 to 10 mass % of a polymer [C] having an SP value of 6.0 to 9.7 (cal/cm.sup.3).sup.1/2 calculated by the Fedors method.
Polyamide composition containing a metallic pigment
The polymer composition containing a polyamide resin, a metallic pigment, and a carrier is disclosed that exhibits a metallic appearance.
Polyamide composition containing a metallic pigment
The polymer composition containing a polyamide resin, a metallic pigment, and a carrier is disclosed that exhibits a metallic appearance.
Polycarbonate resin composition
Provided is a polycarbonate resin composition that can block ultraviolet light as well as light on the visible light side therefrom at wavelengths of 400 to 420 nm, and that is free of the problem of gas generation during molding. The polycarbonate resin composition characteristically comprises, per 100 parts by mass of a polycarbonate resin (A), (i) 0.02 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B1) having a maximum absorption wavelength of at least 375 nm in the absorption curve determined according to JIS K 7105 using the following formula, or (ii) 0.08 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B2) having a maximum absorption wavelength of at least 360 nm and less than 375 nm in the absorption curve determined according to JIS K 7105 using the following formula; and 0.01 to 0.5% by mass of a stabilizer (C).
Polycarbonate resin composition
Provided is a polycarbonate resin composition that can block ultraviolet light as well as light on the visible light side therefrom at wavelengths of 400 to 420 nm, and that is free of the problem of gas generation during molding. The polycarbonate resin composition characteristically comprises, per 100 parts by mass of a polycarbonate resin (A), (i) 0.02 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B1) having a maximum absorption wavelength of at least 375 nm in the absorption curve determined according to JIS K 7105 using the following formula, or (ii) 0.08 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B2) having a maximum absorption wavelength of at least 360 nm and less than 375 nm in the absorption curve determined according to JIS K 7105 using the following formula; and 0.01 to 0.5% by mass of a stabilizer (C).
Polycarbonate resin composition
Provided is a polycarbonate resin composition that can block ultraviolet light as well as light on the visible light side therefrom at wavelengths of 400 to 420 nm, and that is free of the problem of gas generation during molding. The polycarbonate resin composition characteristically comprises, per 100 parts by mass of a polycarbonate resin (A), (i) 0.02 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B1) having a maximum absorption wavelength of at least 375 nm in the absorption curve determined according to JIS K 7105 using the following formula, or (ii) 0.08 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B2) having a maximum absorption wavelength of at least 360 nm and less than 375 nm in the absorption curve determined according to JIS K 7105 using the following formula; and 0.01 to 0.5% by mass of a stabilizer (C).