A resin composition for a solar cell encapsulant that is used for forming a solar cell encapsulant, the resin composition including at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene-α-olefin copolymer (B), and a metal inactivating agent (C).

A resin composition for a solar cell encapsulant that is used for forming a solar cell encapsulant, the resin composition including at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene-α-olefin copolymer (B), and a metal inactivating agent (C).

A resin composition for a solar cell encapsulant that is used for forming a solar cell encapsulant, the resin composition including at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene-α-olefin copolymer (B), and a metal inactivating agent (C).

A resin composition having favorable heat stability while capable of primary curing at 140° C or lower, and having excellent heat resistance after curing, and a pre-preg having excellent heat resistance while a molded product after molding maintains mechanical characteristics are provided. The resin composition of the present invention comprises a constituent element (A): a cyanate ester resin, a constituent element (B): an imidazole compound, and a constituent element (C): silica, in which an average particle size of the silica is 0.4 μm or less. The pre-preg of the present invention comprises carbon fibers, and the resin composition of the present invention.

A resin composition having favorable heat stability while capable of primary curing at 140° C or lower, and having excellent heat resistance after curing, and a pre-preg having excellent heat resistance while a molded product after molding maintains mechanical characteristics are provided. The resin composition of the present invention comprises a constituent element (A): a cyanate ester resin, a constituent element (B): an imidazole compound, and a constituent element (C): silica, in which an average particle size of the silica is 0.4 μm or less. The pre-preg of the present invention comprises carbon fibers, and the resin composition of the present invention.

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

The presently claimed invention relates to aramid pulp comprising a plurality of fibrils having a coating of polyalkyleneimine disposed thereon. The presently claimed invention further relates to a method of coating the aramid pulp with polyalkyleneimine. The presently claimed invention also relates to a rubber composition comprising the coated aramid pulp and rubber as well as to a method for preparing the rubber composition.

The presently claimed invention relates to aramid pulp comprising a plurality of fibrils having a coating of polyalkyleneimine disposed thereon. The presently claimed invention further relates to a method of coating the aramid pulp with polyalkyleneimine. The presently claimed invention also relates to a rubber composition comprising the coated aramid pulp and rubber as well as to a method for preparing the rubber composition.