The present invention relates to the field of chemical compositions and flame retardants. Specifically, the invention relates to a composition for imparting flame retardancy comprising an organic salt as a fire-retardant compound, a binder and a surfactant. Also, the present invention relates to a method for manufacturing said composition and a method of imparting flame retardancy to a substrate comprising applying said composition to the substrate. And still, the invention relates to uses of said composition e.g. for imparting flame retardancy to a substrate. Furthermore, the invention relates to products comprising said composition.

Provided are a method for forming a resist pattern that demonstrates excellent performance in sensitivity, resolution, etc. in an exposure step when a next-generation exposure technique is applied, and a radiation-sensitive resin composition. The method for forming a resist pattern includes step (1) of forming a resist film in which a content of a radiation-sensitive acid generator (C) is 0.1% by mass or less, step (2) of exposing the resist film to EUV or an electron beam (EB), and step (3) of developing the resist film exposed in the step (2).

A positive resist material contains an acid generator, and a base polymer containing a repeating unit having two carboxyl groups whose hydrogen atoms are substituted with two tertiary carbon atoms each bonded to a double bond or triple bond. The repeating unit having two carboxyl groups whose hydrogen atoms are substituted with two tertiary carbon atoms each bonded to a double bond or triple bond is represented by a repeating unit-a in the following formula (1). Thus, the present invention provides: a positive resist material having higher sensitivity than conventional positive resist materials and smaller dimensional variation; and a patterning process.

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The present invention relates to a novel copolymer, to processes for preparation thereof and to the use thereof.

Crosslinked pressure-sensitive adhesives (PSAs) based on polymers of branched macromolecules each comprising a main chain and one or more sidechains pendent to the main chain, the constitutional units thereof originating from a) X wt % of one or more acrylic and/or methacrylic esters, with 80<=X<=99.5; b) Y wt % of radically copolymerizable monomers having at least one acid function, with 0.5<=Y<=15; c) Z wt % of vinyl compounds, with 0<=Z<=5, at least one sidechain pendent to the main chain having a number-average molar mass >=1000 g/mol, and the respective amounts of constitutional units originating from a), b) and c) can be the same in each case or differ by not more than 1%, and where a), b) and c) may in each case be the same or different monomers, have detachment properties which can be set independently of one another.

Crosslinked pressure-sensitive adhesives (PSAs) based on polymers of branched macromolecules each comprising a main chain and one or more sidechains pendent to the main chain, the constitutional units thereof originating from a) X wt % of one or more acrylic and/or methacrylic esters, with 80<=X<=99.5; b) Y wt % of radically copolymerizable monomers having at least one acid function, with 0.5<=Y<=15; c) Z wt % of vinyl compounds, with 0<=Z<=5, at least one sidechain pendent to the main chain having a number-average molar mass >=1000 g/mol, and the respective amounts of constitutional units originating from a), b) and c) can be the same in each case or differ by not more than 1%, and where a), b) and c) may in each case be the same or different monomers, have detachment properties which can be set independently of one another.

The radiation-sensitive resin composition contains: a polymer having a structural unit that includes an acid-labile group; and a compound represented by formula (1). In the formula (1), Ar.sup.1 represents a group obtained by removing (m+n+2) hydrogen atoms from an aromatic ring of an arene having 6 to 30 carbon atoms; —OH and —COO— are bonded at ortho positions to each other on a same benzene ring on Ar.sup.1; and R.sup.G represents a group represented by formula (V-1), a group represented by formula (V-2), a group including a lactone structure, a group including a cyclic carbonate structure, a group including a sultone structure, a group including a ketonic carbonyl group, a group including a thiocarbonate group, or a group including a group represented by formula (V-3), or the like. ##STR00001##

The preparation method for the diester structure monomer includes the following steps: dissolving glycolate in a reaction solvent to prepare a glycolate solution; mixing the glycolate solution with triethylamine in a protective atmosphere, and cooling to form a mixture; and keeping the protective atmosphere unchanged, and adding the methacryloyl chloride to the mixture for esterification to generate a diester structure monomer. The diester structure monomer generated by the preparation method for the diester structure monomer has a long diester side chain and a group with a small volume and high acid sensitivity. As a result, a resin synthesized from the diester structure monomer has good adhesive force and film-forming property, high deprotection efficiency and plasticity, and the hardness and brittleness of the resin are improved. Moreover, the prepared diester acid protected structure monomer has the advantages of high yield, low by-product content and easy separation and purification.

The preparation method for the diester structure monomer includes the following steps: dissolving glycolate in a reaction solvent to prepare a glycolate solution; mixing the glycolate solution with triethylamine in a protective atmosphere, and cooling to form a mixture; and keeping the protective atmosphere unchanged, and adding the methacryloyl chloride to the mixture for esterification to generate a diester structure monomer. The diester structure monomer generated by the preparation method for the diester structure monomer has a long diester side chain and a group with a small volume and high acid sensitivity. As a result, a resin synthesized from the diester structure monomer has good adhesive force and film-forming property, high deprotection efficiency and plasticity, and the hardness and brittleness of the resin are improved. Moreover, the prepared diester acid protected structure monomer has the advantages of high yield, low by-product content and easy separation and purification.

A radiation-sensitive resin composition includes a polymer including a phenolic hydroxyl group, a compound represented by formula (1-1) or formula (1-2), and a compound represented by formula (2). In the formula (1-1), a sum of a, b, and c is no less than 1; at least one of R.sup.1, R.sup.2, and R.sup.3 represents a fluorine atom or the like; and R.sup.4 and R.sup.5 each independently represent a hydrogen atom, a fluorine atom, or the like. In the formula (1-2), in a case in which d is 1, R.sup.6 represents a fluorine atom or the like, and in a case in which d is no less than 2, at least one of the plurality of R.sup.6s represents a fluorine atom or the like; and R.sup.8 represents a single bond or a divalent organic group having 1 to 20 carbon atoms.

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