C08F220/1805

RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND, AND RESIN
20220206385 · 2022-06-30 ·

A resist composition containing a polymeric compound having a constitutional unit (a01) derived from a compound represented by General Formula (a0-1). In the formula, represents a polymerizable group-containing group, Ra.sup.01 represents a linear or branched hydrocarbon group, and Ra.sup.02 and Ra.sup.03 each independently represents a hydrocarbon group which may have a substituent

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RESIST COMPOSITION AND PATTERNING PROCESS

The present invention is a resist composition, including: a resin (A) having: a repeating unit represented by the general formula (p-1); a repeating unit represented by the general formula (a-1); and a repeating unit represented by the general formula (b-1); a resin (B) having: a repeating unit represented by the general formula (p-2); a repeating unit represented by the general formula (a-1); and a repeating unit represented by the general formula (b-1); and a solvent (D), wherein a content of the resin (A) contained in the resist composition is smaller than a content of the resin (B). This provides a resist composition that reduces roughness and size uniformity of a hole pattern with high resolution exceeding that of conventional resist materials even with a high exposure-dose region, that has good pattern shape after exposure, and that has excellent etching resistance.

RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

A radiation-sensitive resin composition contains a resin including a structural unit having a phenolic hydroxyl group; and a compound represented by formula (1). In the formula (1), Ar is a substituted or unsubstituted aromatic ring having 6 to 20 carbon atoms; n is an integer of 2 to 4; Z.sup.+ is a monovalent onium cation; a plurality of Ys are each independently a polar group; and at least one of the plurality of Ys is an —OH group or an —SH group bonded to a carbon atom adjacent to a carbon atom to which a COO.sup.− group is bonded.

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Method of manufacturing laminated steel plate
11784544 · 2023-10-10 · ·

A method of manufacturing a laminated steel plate capable of simplifying the manufacturing process. This is achieved by a method of manufacturing a laminated steel plate including a step of applying a mixture containing an oil and an adhesive composition for a laminated steel plate including at least one kind of a (meth)acrylate compound compatible with the oil and an organic peroxide to one side or both sides of a strip-like steel plate; and a step of punching a steel plate body from the strip-like steel plate with a punch portion of a press forming device, and laminating and bonding the steel plate bodies.

Method of manufacturing laminated steel plate
11784544 · 2023-10-10 · ·

A method of manufacturing a laminated steel plate capable of simplifying the manufacturing process. This is achieved by a method of manufacturing a laminated steel plate including a step of applying a mixture containing an oil and an adhesive composition for a laminated steel plate including at least one kind of a (meth)acrylate compound compatible with the oil and an organic peroxide to one side or both sides of a strip-like steel plate; and a step of punching a steel plate body from the strip-like steel plate with a punch portion of a press forming device, and laminating and bonding the steel plate bodies.

CONDUCTIVE ADHESIVE COMPOSITION

The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or (2), and having a molecular weight within a range of 150 to 1000, in which the phosphoric acid-containing curable component (C) has a content of 0.01 parts by mass or more and 5 parts by mass or less when a total amount of the conductive powder (A) and the 10 curable component (B) is 100 parts by mass.

CONDUCTIVE ADHESIVE COMPOSITION

The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or (2), and having a molecular weight within a range of 150 to 1000, in which the phosphoric acid-containing curable component (C) has a content of 0.01 parts by mass or more and 5 parts by mass or less when a total amount of the conductive powder (A) and the 10 curable component (B) is 100 parts by mass.

Radiation-Curable Ink Jet Composition And Printing Method
20230332004 · 2023-10-19 ·

A radiation-curable ink jet composition that is a white ink containing a white coloring material or a pale or clear ink containing 1.2% by mass or less of a coloring material contains at least one polymerizable compound including at least one of a monofunctional monomer having a nitrogen-containing heterocyclic structure and a monomer having a hydroxy group. In the composition, the thioxanthone-based photopolymerization initiator content is limited to 0.3% or less relative to the total mass of the radiation-curable ink jet composition.

PROCESS OF COATING WOOD
20230357591 · 2023-11-09 ·

The present invention relates to a process of coating wood with at least two waterbased coating compositions the process comprising: a) applying a coating composition A comprising at least one anionic polymer A with a Hansch parameter ≤1.6, and drying or allowing to dry said aqueous coating composition A, b) applying a coating composition B comprising at least one anionic polymer B with a Hansch parameter ≥1.7 and pigment, and drying or allowing to dry said aqueous coating composition B, with the proviso that the difference of the Hansch Parameters of anionic polymer B and anionic polymer A is at least 0.5. The invention also relates to wood coated accordingly, and the use of a coating composition A, comprising an aqueous anionic polymer A with a Hansch parameter ≤1.6, as an undercoat for coating wood.

MONOMERIC AND POLYMERIC COMPOSITIONS AND METHODS OF PRODUCING AND USING THE SAME

The present disclosure provides photo-polymerizable monomers, photo-curable resins comprising one or more of such monomers, as well as polymeric materials formed from the photo-curable resins. Further provided herein are methods of producing the compositions and using the same for the fabrication of medical devices, such as orthodontic appliances.