Patent classifications
C08F220/1805
Active-energy-ray-curable composition, active-energy-ray-curable ink composition, composition stored container, two-dimensional or three-dimensional image forming apparatus, method for forming two-dimensional or three-dimensional image, cured product, and laminated cured product
An active-energy-ray-curable composition including at least one monofunctional (meth)acrylate, at least one multifunctional (meth)acrylate, and at least one chlorinated-olefin-structure-containing polymer.
Active-energy-ray-curable composition, active-energy-ray-curable ink composition, composition stored container, two-dimensional or three-dimensional image forming apparatus, method for forming two-dimensional or three-dimensional image, cured product, and laminated cured product
An active-energy-ray-curable composition including at least one monofunctional (meth)acrylate, at least one multifunctional (meth)acrylate, and at least one chlorinated-olefin-structure-containing polymer.
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RESIN
The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition in which fewer defects are generated in any development treatment of alkali development and organic solvent development, a pattern forming method, a method for manufacturing an electronic device, and a resin. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin having a repeating unit represented by Formula (1) and a repeating unit having an acid-decomposable group, and a photoacid generator.
##STR00001##
RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST PATTERN-FORMING METHOD
A radiation-sensitive resin composition includes a polymer including a phenolic hydroxyl group, a compound represented by formula (1-1) or formula (1-2), and a compound represented by formula (2). In the formula (1-1), a sum of a, b, and c is no less than 1; at least one of R.sup.1, R.sup.2, and R.sup.3 represents a fluorine atom or the like; and R.sup.4 and R.sup.5 each independently represent a hydrogen atom, a fluorine atom, or the like. In the formula (1-2), in a case in which d is 1, R.sup.6 represents a fluorine atom or the like, and in a case in which d is no less than 2, at least one of the plurality of R.sup.6s represents a fluorine atom or the like; and R.sup.8 represents a single bond or a divalent organic group having 1 to 20 carbon atoms.
##STR00001##
RESIST COMPOSITION AND PATTERNING PROCESS
A resist composition comprising a base polymer and a salt is provided. The salt consisting of an anion derived from an iodized or brominated phenol and a cation derived from a 2,5,8,9-tetraaza-1-phosphabicyclo[3.3.3]undecane, biguanide or phosphazene compound. The resist composition exerts a high sensitizing effect and an acid diffusion suppressing effect, causes no film thickness loss after development, and is improved in resolution, LWR and CDU when a pattern is formed therefrom by lithography.
Photocurable composition
Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.
Photocurable composition
Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.
RADIATION-SENSITIVE RESIN COMPOSITION, RESIST PATTERN-FORMING METHOD, COMPOUND, AND METHOD OF CONTROLLING ACID DIFFUSION
The radiation-sensitive resin composition contains: a polymer having a structural unit that includes an acid-labile group; and a compound represented by formula (1). In the formula (1), Ar.sup.1 represents a group obtained by removing (m+n+2) hydrogen atoms from an aromatic ring of an arene having 6 to 30 carbon atoms; OH and COO are bonded at ortho positions to each other on a same benzene ring on Ar.sup.1; and R.sup.G represents a group represented by formula (V-1), a group represented by formula (V-2), a group including a lactone structure, a group including a cyclic carbonate structure, a group including a sultone structure, a group including a ketonic carbonyl group, a group including a thiocarbonate group, or a group including a group represented by formula (V-3), or the like.
##STR00001##
NEW BIFUNCTIONAL (METH)ACRYLATE COMPOUND AND POLYMER
Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1):
##STR00001##
(wherein R.sub.1 represents a hydrogen atom or a methyl group, R.sub.2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).
NEW BIFUNCTIONAL (METH)ACRYLATE COMPOUND AND POLYMER
Provided is a compound that can be used for a resin for a resist having excellent sensitivity, resolution, and etching resistance, or the like, by a compound represented by the following formula (1):
##STR00001##
(wherein R.sub.1 represents a hydrogen atom or a methyl group, R.sub.2 represents an aliphatic hydrocarbon group having 1 to 6 carbon atoms, m represents an integer of 0 to 5, and n represents an integer of 0 to 4).