The present invention relates to a novel copolymer, to processes for preparation thereof and to the use thereof.

A radiation-curing ink jet ink composition includes a urethane (meth)acrylate including one (meth)acryloyl group, the amount of the urethane (meth)acrylate being 5.0% by mass or more and 30.0% by mass or less of the total amount of the ink composition, and a (meth)acrylate including an aromatic ring and one (meth)acryloyl group, the amount of the (meth)acrylate being 4.0% by mass or more and 50.0% by mass or less of the total amount of the ink composition.

A radiation-curing ink jet ink composition includes a urethane (meth)acrylate including one (meth)acryloyl group, the amount of the urethane (meth)acrylate being 5.0% by mass or more and 30.0% by mass or less of the total amount of the ink composition, and a (meth)acrylate including an aromatic ring and one (meth)acryloyl group, the amount of the (meth)acrylate being 4.0% by mass or more and 50.0% by mass or less of the total amount of the ink composition.

The present invention relates to a radiation curable composition. In particular, the present invention relates to a radiation curable composition with hydrophilic nanoparticles for use in barrier stacks for protection of sensitive devices against moisture.

A monomer having an onium salt structure represented by formula (1) gives a polymer which is fully compatible with resist components. A resist composition comprising the polymer has advantages including reduced acid diffusion, high sensitivity, high resolution, a good balance of lithography properties, and less defects, and is quite effective for precise micropatterning.

##STR00001##

A monomer having an onium salt structure represented by formula (1) gives a polymer which is fully compatible with resist components. A resist composition comprising the polymer has advantages including reduced acid diffusion, high sensitivity, high resolution, a good balance of lithography properties, and less defects, and is quite effective for precise micropatterning.

##STR00001##

A monomer has the structure

##STR00001##

wherein R is an organic group comprising a polymerizable carbon-carbon double bond or carbon-carbon triple bond; X and Y are independently at each occurrence hydrogen or a non-hydrogen substituent; EWG1 and EWG2 are independently at each occurrence an electron-withdrawing group; p is 0, 1, 2, 3, or 4; n is 1, 2, 3, or 4; and M.sup.+ is an organic cation. A polymer prepared from monomer is useful as a component of a photoresist composition.

A monomer has the structure

##STR00001##

wherein R is an organic group comprising a polymerizable carbon-carbon double bond or carbon-carbon triple bond; X and Y are independently at each occurrence hydrogen or a non-hydrogen substituent; EWG1 and EWG2 are independently at each occurrence an electron-withdrawing group; p is 0, 1, 2, 3, or 4; n is 1, 2, 3, or 4; and M.sup.+ is an organic cation. A polymer prepared from monomer is useful as a component of a photoresist composition.

Provided are an active-light-sensitive or radiation-sensitive resin composition in which the sensitivity is excellent, and an active-light-sensitive or radiation-sensitive film, a pattern forming method, and a method for manufacturing an electronic device, each using the active-light-sensitive or radiation-sensitive resin composition. The active-light-sensitive or radiation-sensitive resin composition contains a resin (Ab) whose polarity is changed by the action of an acid, and a compound that generates an acid upon irradiation with active light or radiation, in which the resin (Ab) includes a metal ion, and the metal type of the metal ion is at least one of metal types belonging to Groups 1 to 10 and 13 to 16 (here, excluding Mg and Cs).

Provided are an active-light-sensitive or radiation-sensitive resin composition in which the sensitivity is excellent, and an active-light-sensitive or radiation-sensitive film, a pattern forming method, and a method for manufacturing an electronic device, each using the active-light-sensitive or radiation-sensitive resin composition. The active-light-sensitive or radiation-sensitive resin composition contains a resin (Ab) whose polarity is changed by the action of an acid, and a compound that generates an acid upon irradiation with active light or radiation, in which the resin (Ab) includes a metal ion, and the metal type of the metal ion is at least one of metal types belonging to Groups 1 to 10 and 13 to 16 (here, excluding Mg and Cs).