The present invention provides a light curable (meth)acrylate resin composition for thermoplastic elastomer bonding. The light curable (meth)acrylate resin composition of the present invention comprises: a (meth)acrylic monomer, a polyolefin (meth)acrylate oligomer having a viscosity of 200 000 to 2 500 000 mPa*s at 25° C., and a photoinitiator. The present invention also provides a cured product of the light curable (meth)acrylate resin composition and a use of the composition.

A bio-electrode composition contains (A) an ionic polymer material. The component (A) is a polymer compound containing: a repeating unit-a having a structure selected from the group consisting of salts of ammonium, sodium, potassium, and silver formed with any of fluorosulfonic acid, fluorosulfonimide, and N-carbonyl-fluorosulfonamide; and a repeating unit-b having a side chain with a radical-polymerizable double bond in a structure selected from the group consisting of (meth)acrylate, vinyl ether, and styrene. Thus, the present invention provides: a bio-electrode composition capable of forming a living body contact layer for a bio-electrode to enable signal collection immediately after attachment to skin and prevention of residue on the skin after peeling from the skin; a bio-electrode including a living body contact layer formed of the bio-electrode composition; and a method for manufacturing the bio-electrode.

An adhesive skin patch including a substrate and an adhesive layer, wherein the substrate is formed of a foam sheet having breaking elongation of 100% or more, breaking strength of 20 N/20 mm or less, a density of 0.5 g/cm.sup.3 or less and a thickness of 0.300 mm or more, the adhesive layer is formed on one side of the substrate, and the adhesive layer contains an acrylic copolymer and a liquid or pasty component at room temperature.

An adhesive skin patch including a substrate and an adhesive layer, wherein the substrate is formed of a foam sheet having breaking elongation of 100% or more, breaking strength of 20 N/20 mm or less, a density of 0.5 g/cm.sup.3 or less and a thickness of 0.300 mm or more, the adhesive layer is formed on one side of the substrate, and the adhesive layer contains an acrylic copolymer and a liquid or pasty component at room temperature.

A resist composition including a polymeric compound having a structural unit in which a compound represented by formula (a0-1) has a polymerizable group within the W.sup.1 portion converted into a main chain, and a compound represented by formula (b1-1) in which W.sup.1 represents a polymerizable group-containing group; C.sup.t represents a tertiary carbon atom, and the α-position of C.sup.t is a carbon atom which constitutes a carbon-carbon unsaturated bond; R.sup.11 represents an aromatic hydrocarbon group or a chain hydrocarbon group; R.sup.12 and R.sup.13 are mutually bonded to form a 5-membered aliphatic monocyclic group, or a condensed polycyclic hydrocarbon group containing a 5-membered aliphatic monocyclic ring; R.sup.b11 represents a cyclic group; R.sup.b10, R.sup.b20 and R.sup.b30 each independently represents a substituent; n.sub.b1 represents an integer of 0 to 4; n.sub.b2 represents an integer of 0 to 5; n.sub.b3 represents an integer of 0 to 5; and X.sup.− represents a counteranion. ##STR00001##

The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

A thermosetting composition comprising: (A) a (meth)acrylate compound having a viscosity at 25° C. of 1 to 300 mPa.Math.s with which a substituted or unsubstituted aliphatic hydrocarbon group including 6 or more carbon atoms is ester-bonded; (B) spherical silica; and (C) a white pigment, and having a shear viscosity at 25° C. and 10 s.sup.−1 of 1 Pa.Math.s or more and 500 Pa.Math.s or less and a shear velocity at 25° C. and 100 s.sup.−1 of 0.3 Pa.Math.s or more and 100 Pa.Math.s or less.

A thermosetting composition comprising: (A) a (meth)acrylate compound having a viscosity at 25° C. of 1 to 300 mPa.Math.s with which a substituted or unsubstituted aliphatic hydrocarbon group including 6 or more carbon atoms is ester-bonded; (B) spherical silica; and (C) a white pigment, and having a shear viscosity at 25° C. and 10 s.sup.−1 of 1 Pa.Math.s or more and 500 Pa.Math.s or less and a shear velocity at 25° C. and 100 s.sup.−1 of 0.3 Pa.Math.s or more and 100 Pa.Math.s or less.

A decorative film including a base film layer, a printed layer disposed on the base film layer, and a protective layer disposed on the printed layer and having a texture is described. The protective layer includes a cured product of a radiation curable inkjet ink which is obtained by inkjet printing, and the impact resistance of the decorative film at 10° C. is greater than or equal to 40 in-lbs. The decorative film is not cracked in a bending resistance test in accordance with JIS K 5600-5-1:1999.