The method for producing a resin composition for a secondary coating of an optical fiber comprises a step of reacting a polyol, a diisocyanate and a hydroxyl group-containing (meth)acrylate in the presence of a (meth)acrylate not having a hydroxyl group to obtain a mixture of urethane (meth)acrylate and the (meth)acrylate not having a hydroxyl group, and a step of adding a photopolymerization initiator to the mixture to obtain a resin composition, and a hydroxyl value of the (meth)acrylate not having a hydroxyl group is 12.0 mgKOH/g or less.

The method for producing a resin composition for a secondary coating of an optical fiber comprises a step of reacting a polyol, a diisocyanate and a hydroxyl group-containing (meth)acrylate in the presence of a (meth)acrylate not having a hydroxyl group to obtain a mixture of urethane (meth)acrylate and the (meth)acrylate not having a hydroxyl group, and a step of adding a photopolymerization initiator to the mixture to obtain a resin composition, and a hydroxyl value of the (meth)acrylate not having a hydroxyl group is 12.0 mgKOH/g or less.

The present invention relates to a continuous high-pressure polymerization process for the preparation of a liquid ethylene copolymer which comprises in polymerized form 20 to 60 wt % of ethylene; and at least 20 wt % of an acrylate, which is selected from C.sub.1-C.sub.22 alkyl (meth)acrylate, where a monomer feed comprising the ethylene and the acrylate is polymerized in the presence of at least 2 wt % of a chain transfer agent. The invention further relates to the liquid ethylene copolymer obtainable by the polymerization process; and to a lubricant comprising the liquid ethylene copolymer obtainable by the polymerization process; and to a method for reducing friction between moving surfaces comprising the step of contacting the surfaces with the lubricant or with the ethylene copolymer.

The present invention relates to a continuous high-pressure polymerization process for the preparation of a liquid ethylene copolymer which comprises in polymerized form 20 to 60 wt % of ethylene; and at least 20 wt % of an acrylate, which is selected from C.sub.1-C.sub.22 alkyl (meth)acrylate, where a monomer feed comprising the ethylene and the acrylate is polymerized in the presence of at least 2 wt % of a chain transfer agent. The invention further relates to the liquid ethylene copolymer obtainable by the polymerization process; and to a lubricant comprising the liquid ethylene copolymer obtainable by the polymerization process; and to a method for reducing friction between moving surfaces comprising the step of contacting the surfaces with the lubricant or with the ethylene copolymer.

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate, and a material for forming an organic film containing the compound. A material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, ##STR00001## noting that in the general formula (1B), when W.sub.1 represents ##STR00002##  R.sub.1 does not represent any of ##STR00003##

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate, and a material for forming an organic film containing the compound. A material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent, ##STR00001## noting that in the general formula (1B), when W.sub.1 represents ##STR00002##  R.sub.1 does not represent any of ##STR00003##

Provided are: a composition for an organic light emitting diode comprising an indole-based photocurable monomer, a non-indole-based photocurable monomer, and an initiator, and an organic light emitting display manufactured therefrom.

Provided are: a composition for an organic light emitting diode comprising an indole-based photocurable monomer, a non-indole-based photocurable monomer, and an initiator, and an organic light emitting display manufactured therefrom.

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, the pressure-sensitive adhesive layer allowing the appearance of a display device and an input device to be unlikely to deteriorate even under low pressure conditions, a pressure-sensitive adhesive layer, a pressure-sensitive adhesive sheet, an optical member, and a touch panel. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A) and a hydrogenated polyolefinic resin (B). The acrylic polymer (A) contains a (meth)acrylic alkyl ester having an alkyl group having 8 or more carbon atoms as a constituent monomer component. The hydrogenated polyolefinic resin (B) contains a hydrogenated polyolefin.

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, the pressure-sensitive adhesive layer allowing the appearance of a display device and an input device to be unlikely to deteriorate even under low pressure conditions, a pressure-sensitive adhesive layer, a pressure-sensitive adhesive sheet, an optical member, and a touch panel. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A) and a hydrogenated polyolefinic resin (B). The acrylic polymer (A) contains a (meth)acrylic alkyl ester having an alkyl group having 8 or more carbon atoms as a constituent monomer component. The hydrogenated polyolefinic resin (B) contains a hydrogenated polyolefin.