A heat pipe or a bundle of heat pipes for transporting geothermal heat in a well is provided. As the temperature rises at one end of the heat pipe, the operating fluid turns to a vapor which absorbs the latent heat. The hot vapor within the heat pipe flows to the cooler end of the heat pipe where it then condenses and releases the latent heat. The condensed fluid then flows back to the hot side of the heat pipe and the process repeats itself.

A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.

An evaporator that changes at least a part of a working fluid from a liquid phase into a gas phase by using heat of a heat-generating element includes: a housing including at least one working fluid inlet and at least one working fluid outlet and defining a working fluid-receiving chamber that receives the working fluid; a heat-absorbing element located at a bottom surface of the housing and thermally connected to the heat-generating element; and a wall structure rising from a boiling surface in the working fluid-receiving chamber and dividing a bottom region of the working fluid-receiving chamber into a plurality of segments to form a plurality of recesses located in the bottom region of the working fluid to trap the working medium.

A cooling pipe system, including an evaporation pipe slantly arranged, a water inlet pipe, and a water removal assembly. An output end of the water inlet pipe is connected to an input end of the evaporation pipe, the water inlet pipe is connected to a three-way valve for introducing low molecular weight gas into the evaporation pipe. The water removal assembly is located below the evaporation pipe and includes a water sealing cavity, the output end of the evaporation pipe is connected to the water sealing cavity by means of a recovery pipe, the water sealing cavity is connected to a first pipeline extending upwards and communicated with the input end of the evaporation pipe, a lower end of the first pipeline is connected to a molecular sieve for preventing water vapor from passing through, and the water removal assembly is configured for absorbing the water vapor.

In a dual material vapor chamber and an upper shell thereof, the dual material vapor chamber includes an upper shell, a copper lower shell, and a working fluid. The upper shell includes an aluminum substrate and plural aluminum fins. The aluminum substrate has an outer surface and an inner wall. The aluminum fins individually extend from the outer surface and are formed integrally. A copper deposition layer is coated on the inner wall. The copper lower shell is sealed to the upper shell correspondingly. A chamber is formed between the upper shell and the copper lower shell. The working fluid is filled in the chamber. Therefore, the weight and material cost of the whole vapor chamber can be reduced, and the packing combination between the upper shell and the copper lower shell can be simplified.

A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.

A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.

An apparatus for dissipating thermal energy including a baseplate including a first body having a first groove and a second groove intersecting one another, the first groove and the second groove formed in and only accessible from a first side of the baseplate. The apparatus including a first heat pipe and a second heat pipe arranged and disposed to provide both an overlapping arrangement and a nonoverlapping arrangement within the first groove and the second groove of the baseplate.

The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.