The invention relates to a pixel matrix of a thermal pattern sensor comprising several rows and several columns of pixels, said matrix comprising: an active thermal element formed by a thermosensitive material disposed between a lower layer and an upper layer, the lower layer being constituted by a plurality of first tracks made of electrically conductive material and extending along a first direction, said first tracks forming pixel columns; a heating element, disposed on the active thermal element and forming a serpentine path, said heating element being constituted by a plurality of second tracks (L1, L2, L3, L4, L5, L6) made of electrically conductive material and connecting segments (w1, w2, w3, w4, w5, w6) made of electrically conductive material connected to the ends of the second tracks (L1, L2, L3, L4, L5, L6), said second tracks (L1, L2, L3, L4, L5, L6) extending in a second direction different from the first direction and forming lines of pixels, the second tracks being connected except for the first and last second tracks (L1, L2, L3, L4, L5, L6), by their respective ends to one of the ends of a second preceding track and a second following track by way of said connecting segments (w1, w2, w3, w4, w5, w6), the first and last second tracks each having a free end connected to a connecting segment.

The invention relates to a pixel matrix of a thermal pattern sensor comprising several rows and several columns of pixels, said matrix comprising: an active thermal element formed by a thermosensitive material disposed between a lower layer and an upper layer, the lower layer being constituted by a plurality of first tracks made of electrically conductive material and extending along a first direction, said first tracks forming pixel columns; a heating element, disposed on the active thermal element and forming a serpentine path, said heating element being constituted by a plurality of second tracks (L1, L2, L3, L4, L5, L6) made of electrically conductive material and connecting segments (w1, w2, w3, w4, w5, w6) made of electrically conductive material connected to the ends of the second tracks (L1, L2, L3, L4, L5, L6), said second tracks (L1, L2, L3, L4, L5, L6) extending in a second direction different from the first direction and forming lines of pixels, the second tracks being connected except for the first and last second tracks (L1, L2, L3, L4, L5, L6), by their respective ends to one of the ends of a second preceding track and a second following track by way of said connecting segments (w1, w2, w3, w4, w5, w6), the first and last second tracks each having a free end connected to a connecting segment.

A sensor of thermal patterns of an object, of papillary print sensor type, including a contact surface to apply the object thereon. The sensor includes at least one capsule sealed under vacuum, arranged between a substrate and the contact surface, suited to exchanging heat with the object and to emitting electromagnetic radiation as a function of its temperature; inside each capsule, at least one bolometric plate, to convert incident electromagnetic radiation into heat; at least one optical filter, to stop electromagnetic radiation in the infrared, each capsule being covered by an optical filter; with reading the electrical resistances of the bolometric plates. Such a print sensor offers both good insulation between the substrate and the sensitive elements, and good mechanical strength.

Optical microcavity resonance measurements can have readout noise matching the fundamental limit set by thermal fluctuations in the cavity. Small-heat-capacity, wavelength-scale microcavities can be used as bolometers that bypass the limitations of other bolometer technologies. The microcavities can be implemented as photonic crystal cavities or micro-disks that are thermally coupled to strong mid-IR or LWIR absorbers, such as pyrolytic carbon columns. Each microcavity and the associated absorber(s) rest on hollow pillars that extend from a substrate and thermally isolate the cavity and the absorber(s) from the rest of the bolometer. This ensures that thermal transfer to the absorbers is predominantly from radiation as opposed to from conduction. As the absorbers absorb thermal radiation, they shift the resonance wavelength of the cavity. The cavity transduces this thermal change into an optical signal by reflecting or scattering more (or less) near-infrared (NIR) probe light as a function of the resonance wavelength shift.

Optical microcavity resonance measurements can have readout noise matching the fundamental limit set by thermal fluctuations in the cavity. Small-heat-capacity, wavelength-scale microcavities can be used as bolometers that bypass the limitations of other bolometer technologies. The microcavities can be implemented as photonic crystal cavities or micro-disks that are thermally coupled to strong mid-IR or LWIR absorbers, such as pyrolytic carbon columns. Each microcavity and the associated absorber(s) rest on hollow pillars that extend from a substrate and thermally isolate the cavity and the absorber(s) from the rest of the bolometer. This ensures that thermal transfer to the absorbers is predominantly from radiation as opposed to from conduction. As the absorbers absorb thermal radiation, they shift the resonance wavelength of the cavity. The cavity transduces this thermal change into an optical signal by reflecting or scattering more (or less) near-infrared (NIR) probe light as a function of the resonance wavelength shift.

A sensor (1) which consists of a first electrode (3a), a ferroelectric layer (2) and a second electrode (3b) is described. The second electrode (3b) is connected to ground and the ferroelectric layer (2) is arranged between the first and second electrodes (3a, 3b).

A sensor (1) which consists of a first electrode (3a), a ferroelectric layer (2) and a second electrode (3b) is described. The second electrode (3b) is connected to ground and the ferroelectric layer (2) is arranged between the first and second electrodes (3a, 3b).

A sensor apparatus includes a photosensitive sensor, a cover, and a moving mechanism. The photosensitive sensor includes a first lens and a second lens which focus on a photosensitive element. The cover includes a first slit arranged on an optical axis of the first lens and a second slit arranged on an optical axis of the second lens. The moving mechanism is configured to move the photosensitive sensor and the cover relative to each other so that the second slit is arranged on the optical axis of the first lens.

A sensor apparatus includes a photosensitive sensor, a cover, and a moving mechanism. The photosensitive sensor includes a first lens and a second lens which focus on a photosensitive element. The cover includes a first slit arranged on an optical axis of the first lens and a second slit arranged on an optical axis of the second lens. The moving mechanism is configured to move the photosensitive sensor and the cover relative to each other so that the second slit is arranged on the optical axis of the first lens.

A photodetector array comprising at least one first sensor and at least one second sensor on the horizontal surface of the array substrate. The at least one first sensor is sensitive to radiation in a first wavelength range which comprises long-wavelength infrared wavelengths, and the at least one second sensor is sensitive to radiation in a second wavelength range which comprises wavelengths shorter than long-wavelength infrared. The array substrate comprises a vertical cavity on its horizontal surface, and the first sensor comprises a layer of pyroelectric material (65) which extends horizontally across the vertical cavity in the first area. A first part of a layer of two-dimensional layered material at least partly covers the layer of pyroelectric material (65), and a second part of the layer of two-dimensional layered material at least partly covers the foundation of the second sensor.