One exemplary embodiment includes a method including providing a battery, producing a first magnetic field so that a second magnetic field is induced in the battery, sensing a magnetic field resulting from the interaction of the first magnetic field and the second magnetic field, utilizing the sensed net magnetic field to determine the state of charge of the battery.

One exemplary embodiment includes a method including providing a battery, producing a first magnetic field so that a second magnetic field is induced in the battery, sensing a magnetic field resulting from the interaction of the first magnetic field and the second magnetic field, utilizing the sensed net magnetic field to determine the state of charge of the battery.

In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

A wafer testing cassette is provided. The wafer testing cassette includes a first housing, a second housing and a magnetic force generating assembly. The first housing include a probe card, the probe card includes at least one probe having a paramagnetic property. The second housing is combined with the first housing and has a magnetic force generating assembly arranged corresponding to the at least one probe. A wafer located in the second housing, and the at least one probe electrically contacts at least one pad of the wafer with a predetermined contact force. When the magnetic force generating assembly is configured to generate a first magnetic attraction force, the magnetic force generating assembly attracts the at least one probe, so that the at least one probe electrically contacts the at least one pad with a first contact force which is greater than or equal to the predetermined contact force.

A wafer test system is provided. The wafer test system includes a wafer test cassette, a carrier, and a test equipment. The wafer test cassette includes a first magnetic member. The carrier includes a second magnetic member. The wafer test cassette is fixed on the carrier through magnetic attraction generated between the first magnetic member and the second magnetic member. The test equipment includes a tester and a test cabinet. The test cabinet has a plurality of test spaces used to accommodate the wafer test cassettes and the carriers, and the tester is electrically connected to the wafer test cassette.

A wafer test system is provided. The wafer test system includes a wafer test cassette, a carrier, and a test equipment. The wafer test cassette includes a first magnetic member. The carrier includes a second magnetic member. The wafer test cassette is fixed on the carrier through magnetic attraction generated between the first magnetic member and the second magnetic member. The test equipment includes a tester and a test cabinet. The test cabinet has a plurality of test spaces used to accommodate the wafer test cassettes and the carriers, and the tester is electrically connected to the wafer test cassette.

A wafer test cassette, a wafer test system, and a wafer test method are provided. The wafer test cassette includes a first housing including a first magnetic member, a second housing including a second magnetic member corresponding to the first magnetic member, a first fluid port, and a gas supply device. The first housing and the second housing are tightly coupled to each other by which a test space is defined. The first housing includes a probe card, and the second housing carries a wafer. When the first housing and the second housing are coupled, a probe is electrically in contact with a pad of the wafer. The first fluid port is disposed in the first housing or the second housing, and receives an external gas to the test space. After the test space receives the external gas, an air pressure value thereof is greater than an atmospheric pressure.

A wafer test cassette having a fluid inlet and a fluid outlet, includes a first housing, a second housing, a heat source, and an isolation device. The first housing includes a probe card including probes. The second housing is coupled to the first housing, so that a test space is defined. The second housing carries a wafer arranged in the test space, and the probes are electrical contact with an upper surface of the wafer. The heat source heats a lower surface of the wafer, and a high temperature region is defined between the lower surface and the second housing. The solation device surrounds the high temperature region for thermally isolating the high temperature region from the test space. The fluid inlet receives a gas, the gas flows between the probe card and the upper surface of the wafer, and exits through the fluid outlet.

A wafer test cassette is provided, which includes a first housing, a second housing, and a magnetic barrier assembly. The first housing includes a first magnetic member, and the second housing includes a second magnetic member arranged corresponding to the first magnetic member. The magnetic barrier assembly is configured to be connected to the first housing or the second housing for reducing or eliminating magnetic attraction generated between the first magnetic member and the second magnetic member. The magnetic barrier assembly is configured to reduce or eliminate the magnetic attraction before the first housing and the second housing are in contact with each other. When the first housing and the second housing are correspondingly in contact with each other, an effect of the magnetic barrier assembly is released, so that the first housing and the second housing are tightly coupled to each other through the magnetic attraction.