Some embodiments described herein include a system that collects and learns reference side-channel normal activity, process it to reveal key features, compares subsequent collected data and processed data for anomalous behavior, and reports such behavior to a management center where this information is displayed and predefine actions can be executed when anomalous behavior is observed. In some instances, a physical side channel (e.g. and indirect measure of program execution such as power consumption or electromagnetic emissions and other physical signals) can be used to assess the execution status in a processor or digital circuit using an external monitor and detect, with extreme accuracy, when an unauthorized execution has managed to disrupt the normal operation of a target system (e.g., a computer system, etc.).

Over at least part of a lifetime of a product circuit, quiescent current to a product circuit is periodically measured. Over the part of the lifetime of the product circuit, voltage to the product circuit is periodically adjusted based on the monitored quiescent current. Methods, apparatus, and computer program product are disclosed. A calibration procedure may also be performed as part of manufacturing the product circuit, in order to provide values for the quiescent current and corresponding voltage to which the voltage should be adjusted.

Various devices, methods and systems are provided for aging-sensitive chip authentication. In one example, among others, a chip includes a reference Schmitt trigger ring oscillator (STRO) configured to enter a sleep mode during operation of the chip; a stressed STRO; a VDD charge pump configured to boost a positive voltage supplied to the stressed STRO during operation of the chip; and a GND charge pump configured to under-drive a ground voltage supplied to the stressed STRO during operation of the chip. In another example, a method includes detecting activation of a chip including a reference STRO and a stressed STRO and, in response to the activation of the chip, initiating sleep mode operation of the reference STRO. In response to the activation of the chip, a VDD voltage supplied to the stressed STRO can be boosted and/or a GND voltage supplied to the stressed STRO can be under-driven.

A radio-frequency receiver includes built-in-self-test (BIST) circuitry which generates a self-test signal. A local oscillator signal is divided. A self-test oscillation signal is generated, based, at least in part, on the frequency-divided local oscillation signal. The self-test signal is generated based on the self-test oscillation signal. The BIST circuitry includes a divider, which divides the self-test oscillation signal. The frequency-divided local oscillation signal and the divided self-test oscillation signal are used to perform one or more of generating the self-test oscillation signal and controlling the generation of the self-test oscillation signal. The radio-frequency receiver may be an automotive radar receiver.

The disclosed technology generally relates to electrical overstress protection devices, and more particularly to electrical overstress monitoring devices for detecting electrical overstress events in semiconductor devices. In one aspect, a device configured to monitor electrical overstress (EOS) events includes a pair of spaced conductive structures configured to electrically arc in response to an EOS event, wherein the spaced conductive structures are formed of a material and have a shape such that arcing causes a detectable change in shape of the spaced conductive structures, and wherein the device is configured such that the change in shape of the spaced conductive structures is detectable to serve as an EOS monitor.

There is realized a measurement apparatus capable of highly accurate synchronous detection while keeping costs low. A measurement apparatus is characterized by including: a current generation circuit causing an alternating constant current corresponding to a reference signal (Ss) with a predetermined frequency to occur and supplying the alternating constant current to a measurement target object; a voltage detection circuit detecting a voltage v that has occurred in the measurement target object; a signal generation circuit detecting a current i flowing in the measurement target object and generating a binary signal (Sip) synchronized with the current i; a first synchronous detection unit performing synchronous detection of the voltage v based on the reference signal (Ss) and calculating an amplitude |V| of the voltage v and a voltage phase difference v; a second synchronous detection unit performing synchronous detection of the binary signal (Sip) based on the reference signal (Ss) and calculating a current phase difference i; and an arithmetic unit calculating electrical characteristics of the measurement target object based on the amplitude |V| of the voltage and the voltage phase difference v, the current phase difference i, and an amplitude |I| of the current.

Efficient production testing of integrated circuits (ICs). A first production test is implemented on a group of ICs and failures among the test group are assessed. Specifically, the results of the first test are analyzed such that ICs having a recoverable fail and ICs having a non-recoverable fail are differentiated. The ICs are integrated based on the analyzed results and a second production test is implemented. The second production test tests the ICs responsive to the segregation, such that the second production test is limited only to ICs with a recoverable fail. The next succeeding production test will then use the new test program in the second production test with the handler bin designated as having ICs not to be re-tested.

Example circuitry is usable in testing a device under test (DUT). The circuitry includes test inputs; a resistor ladder including resistors electrically connected in series, with the resistor ladder being electrically connected to each of the test inputs; and first operational amplifiers, with each first operational amplifier including a first input and a first output, with each first input being electrically connected to the resistor ladder, and with each first output to electrically connect to the DUT. The circuitry includes floating circuitry which includes a second operational amplifier. The second operational amplifier includes a second input electrically connected to the resistor ladder and a reference input; a first power input to receive a first voltage; and a second power input to receive a second voltage. The floating circuitry is configured to apply the first voltage and the second voltage to power inputs of each of the first operational amplifiers.

An example apparatus includes a circuit board. The circuit board includes one or more layers that form first electrically conductive regions and electrically non-conductive regions; an edge at an angle relative to the one or more layers; and second electrically conductive regions on the edge that are electrically connected to one or more of the first electrically conductive regions. The second electrically conductive regions are substantially flat and each has a connection surface that is substantially parallel to a surface of the edge.

A method includes generating a first signal based on a difference between a first frequency of a first voltage controlled oscillator (VCO) and a second frequency of a second VCO. The method further includes determining a gain of the first VCO at least partially based on the first signal.