Aspects described herein include a method comprising bonding a photonic wafer with an electronic wafer to form a wafer assembly, removing a substrate of the wafer assembly to expose a surface of the photonic wafer or of the electronic wafer, forming electrical connections between metal layers of the photonic wafer and metal layers of the electronic wafer, and adding an interposer wafer to the wafer assembly by bonding the interposer wafer with the wafer assembly at the exposed surface. The interposer wafer comprises through-vias that are electrically coupled with the metal layers of one or both of the photonic wafer and the electronic wafer. The method further comprises dicing the wafer assembly to form a plurality of dies. A respective edge coupler of each die is optically exposed at an interface formed by the dicing.

A surface-relief structure comprises a surface-relief grating including a first material characterized by a first refractive index, a first layer of a second material having a second refractive index conformally deposited on surfaces of the surface-relief grating, and a second layer of a third material having a third refractive index conformally deposited on the first layer. The effective refractive index of the combination of the first layer and the second layer is less than, equal to, or greater than the first refractive index, thereby increasing the duty cycle and/or modifying the overall refractive index of the surface-relief structure. The first layer and the second layer are deposited using, for example, atomic layer deposition techniques.

The disclosure provides an optical waveguide, a manufacturing method of an optical waveguide, and a head-mounted display device. The optical waveguide has a first optical region and a second optical region for transmitting an image beam. The optical waveguide includes a plate body, multiple first light-guiding optical elements, and multiple optical microstructures. The first light-guiding optical elements are disposed in parallel lines on a light-guiding plane inside the plate body. The light-guiding plane is located in the first optical region, and there is a spacing between the adjacent first light-guiding optical elements. The image beam transmitted to the light-guiding plane is separated into multiple sub image beams, and the transmission paths of the sub image beams are at least partially different. The optical coupling-out structure is disposed in the plate body and is located in the second optical region.

Provided is an optical waveguide comprising a core surrounded by a cladding, wherein the core is in the shape of a trapezoid with sidewall angles between 60° and 85° and an opto-electronic circuit comprising the optical waveguide. Operational characteristics of the optical waveguide are shown to be superior to those of incumbent devices.

The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.

Systems for the manufacturing of waveguide cells in accordance with various embodiments can be configured and implemented in many different ways. In many embodiments, various deposition mechanisms are used to deposit layer(s) of optical recording material onto a transparent substrate. A second transparent substrate can be provided, and the three layers can be laminated to form a waveguide cell. Suitable optical recording material can vary widely depending on the given application. In some embodiments, the optical recording material deposited has a similar composition throughout the layer. In a number of embodiments, the optical recording material spatially varies in composition, allowing for the formation of optical elements with varying characteristics. Regardless of the composition of the optical recording material, any method of placing or depositing the optical recording material onto a substrate can be utilized.

An optoelectronic device and method of manufacturing the same. The device includes: a layer disposed above a substrate, the layer having a first cavity therein, which cavity is at least partially defined by an inclined interface between the cavity and an insulating liner, the interface being disposed at an angle relative to the substrate of greater than 0° and less than or equal to 90°; and a regrown semiconductor material, providing or forming a part of a waveguide, the regrown semiconductor material being at least partly disposed in the first cavity and including an inclined interface between the regrown semiconductor material and the insulating liner, the interface being disposed at an angle relative to the substrate of greater than 0° and less than or equal to 90°.

Aspects described herein include a method comprising bonding a photonic wafer with an electronic wafer to form a wafer assembly, removing a substrate of the wafer assembly to expose a surface of the photonic wafer or of the electronic wafer, forming electrical connections between metal layers of the photonic wafer and metal layers of the electronic wafer, and adding an interposer wafer to the wafer assembly by bonding the interposer wafer with the wafer assembly at the exposed surface. The interposer wafer comprises through-vias that are electrically coupled with the metal layers of one or both of the photonic wafer and the electronic wafer. The method further comprises dicing the wafer assembly to form a plurality of dies. A respective edge coupler of each die is optically exposed at an interface formed by the dicing.

A phased array LiDAR transmitting chip of multi-layer materials includes: a first material structure layer and an SOI silicon waveguide structure layer, a rear end of the first material structure layer and a front end of the SOI silicon waveguide structure layer form a coupling connection structure. The first material structure layer includes an input coupler and a beam splitter. The input coupler is optically connected to the beam splitter. The beam splitter is optically connected to the SOI silicon waveguide structure layer through the coupling connection structure. The input coupler couples input light to the chip. The beam splitter split a light wave coupled to the chip. The coupling connection structure couples each split light wave to a silicon waveguide in the SOI silicon waveguide structure layer. A non-linear refractive index of a first material in the first material structure layer is lower than that of a silicon material.

An example of a printed structure comprises a target substrate and a structure protruding from a surface of the target substrate. A component comprising a component substrate separate and independent from the target substrate is disposed in alignment with the structure on the surface of the target substrate within 1 micron of the structure. An example method of making a printed structure comprises providing the target substrate with the structure protruding from the target substrate, a transfer element, and a component adhered to the transfer element. The component comprises a component substrate separate and independent from the target substrate. The transfer element and adhered component move vertically toward the surface of the target substrate and horizontally towards the structure until the component physically contacts the structure or is adhered to the surface of the target substrate. The transfer element is separated from the component.